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Electronics circuit manufacture

  • US 7,485,489 B2
  • Filed: 12/16/2004
  • Issued: 02/03/2009
  • Est. Priority Date: 06/19/2002
  • Status: Active Grant
First Claim
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1. A method of manufacturing a circuit comprising the steps of embedding a component between external layers and making at least one electrical connection to the component through an external layer, wherein the component is encapsulated by:

  • providing an internal material around the component and between the external layers,causing the internal material to flow, andallowing the internal material to cure,wherein the internal material is applied as one or more solid sheets having an aperture for the component, wherein the one or more solid sheets include a dummy aperture to provide a space for excess internal material when the excess internal material flows.

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