Electronics circuit manufacture
First Claim
1. A method of manufacturing a circuit comprising the steps of embedding a component between external layers and making at least one electrical connection to the component through an external layer, wherein the component is encapsulated by:
- providing an internal material around the component and between the external layers,causing the internal material to flow, andallowing the internal material to cure,wherein the internal material is applied as one or more solid sheets having an aperture for the component, wherein the one or more solid sheets include a dummy aperture to provide a space for excess internal material when the excess internal material flows.
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Accused Products
Abstract
A circuit with embedding components (13) is produced by placing the components (13) on a substrate (14) and applying sheets (15) of prepreg. The prepreg sheets (15) have apertures to accommodate the -components, the number of sheets and arrangement of apertures being chosen to accommodate a variety of component X, Y and Z dimensions. A top layer with Cu foil (16(b)) is applied. The assembly is pressed in an operation analogous to conventional multilayer board lamination pressing. This causes all of the prepreg resin to flow to completely embed the components without raids or damage. Electrical connections are made by drilling and plating vias.
140 Citations
39 Claims
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1. A method of manufacturing a circuit comprising the steps of embedding a component between external layers and making at least one electrical connection to the component through an external layer, wherein the component is encapsulated by:
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providing an internal material around the component and between the external layers, causing the internal material to flow, and allowing the internal material to cure, wherein the internal material is applied as one or more solid sheets having an aperture for the component, wherein the one or more solid sheets include a dummy aperture to provide a space for excess internal material when the excess internal material flows. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32)
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33. A method of manufacturing a circuit comprising the steps of embedding a component in a plurality of components between external layers and making at least one electrical connection to the component through an external layer, wherein the component is encapsulated by:
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providing an internal material around the component and between the external layers, causing the internal material to flow, and allowing the internal material to cure, wherein the internal material is caused to flow by application of heat and external pressure on opposite sides of the internal material, wherein the pressure and/or a depth of the internal material are dynamically monitored to ensure that the internal material does not become thinner than a target minimum thickness, being greater than a component depth of a deepest component in the plurality of components, wherein the internal material is applied as one or more solid sheets having an aperture for the component, wherein the one or more solid sheets include a dummy aperture to provide a space for excess internal material when the excess internal material flows. - View Dependent Claims (34)
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35. A method of manufacturing a circuit comprising the steps of embedding a component between external layers and making at least one electrical connection to the component through an external layer, wherein the component is encapsulated by:
providing an internal material around the component and between the external layers, causing the internal material to flow, wherein an electrical connection is made to a component lateral lead of the component, wherein a via is drilled through the lead, wherein the internal material is applied as one or more solid sheets having an aperture for the component, wherein the one or more solid sheets include a dummy aperture to provide a apace for excess internal material when the excess internal material flows. - View Dependent Claims (36)
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37. A method of manufacturing a circuit comprising the steps of embedding a component between external layers and making at least one electrical connection to the component through an external layer, wherein the component is encapsulated by:
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providing an internal material around the component and between the external layers, causing the internal material to flow, and allowing the internal material to cure, wherein a plurality of components are embedded in the internal material one above the other and are interconnected by a multi-layer vertical bus, and wherein bus interconnections are made at vias formed through the components, wherein the internal material is applied as one or more solid sheets having an aperture for the component, wherein the one or more solid sheets include a dummy aperture to provide a space for excess internal material when the excess internal material flows. - View Dependent Claims (38, 39)
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Specification