Semiconductor package having an optical device and the method of making the same
First Claim
1. A semiconductor package having an optical device, comprising:
- a transparent substrate, having a plurality of first contacts and a plurality of second contacts, the first contacts electrically connecting to the second contacts;
a chip, connecting to the transparent substrate and forming a gap therebetween, and having a plurality of third contacts for electrically connecting to the first contacts;
an optical device, disposed in the gap; and
a carrier substrate, having a base, a circumfluent wall, and a plurality of fourth contacts, the circumfluent wall connecting with a periphery of the base to define a receiving space for accommodating the chip and the optical device, and the fourth contacts disposed on the circumfluent wall for electrically connecting to the second contacts of the transparent substrate.
1 Assignment
0 Petitions
Accused Products
Abstract
A semiconductor package having an optical device and the method of making the same, includes a transparent substrate, a chip, an optical device and a carrier substrate. The transparent substrate has a plurality of first contacts and second contacts, wherein the first contacts are electrically connected to the second contacts. The chip is connected to the transparent substrate and forms a gap therebetween. The chip has a plurality of third contacts that are electrically connected to the first contacts. The optical device is disposed in the gap. The carrier substrate has a receiving space and a plurality of fourth contacts, wherein the receiving space accommodates the chip and the optical device, and the fourth contacts are electrically connected to the second contacts of the transparent substrate. Therefore, no connecting wires are needed and the step of wire bonding is omitted. Also, only one transparent substrate is used in the semiconductor package.
7 Citations
17 Claims
-
1. A semiconductor package having an optical device, comprising:
-
a transparent substrate, having a plurality of first contacts and a plurality of second contacts, the first contacts electrically connecting to the second contacts; a chip, connecting to the transparent substrate and forming a gap therebetween, and having a plurality of third contacts for electrically connecting to the first contacts; an optical device, disposed in the gap; and a carrier substrate, having a base, a circumfluent wall, and a plurality of fourth contacts, the circumfluent wall connecting with a periphery of the base to define a receiving space for accommodating the chip and the optical device, and the fourth contacts disposed on the circumfluent wall for electrically connecting to the second contacts of the transparent substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17)
-
Specification