Method of manufacturing an inverter device
First Claim
1. A method of manufacturing an inverter device that includes a plurality of heat buffer plates, comprising:
- bonding a plurality of semiconductor chips and said heat buffer plates by a low melting point or high melting point solder;
bonding said heat buffer plates and a conductor by a low melting point or high melting point solder;
dividing a wide conductor into a plurality of chips fixing said conductor to a cooler;
fixing said heat buffer plates with said plurality of chips;
fixing said conductor and said cooler by application of pressure at locations where the plurality of semiconductor chips are not bonded to said conductor;
forming said conductor as an upper arm conductor and a lower arm conductor; and
bonding a first subset of said heat buffer plates onto said upper arm conductor and bonding a second subset of said heat buffer plates onto said lower arm conductor.
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Accused Products
Abstract
By providing a plurality of semiconductor chips that are connected in parallel and constitute one arm of an inverter; a first conductor to which a face on one side of said plurality of semiconductor chips is connected; a wide conductor to which a face on the other side of said plurality of semiconductor chips is connected; a second conductor said first conductor and second conductor are connected connected to said wide conductor; and a cooler to which through an insulating resin sheet, part of the heat loss generated in the semiconductor chips is thermally conducted to the first conductor and is thence thermally conducted to the cooler, producing cooling, while another part thereof is thermally conducted to the wide conductor and thence to the second conductor, whence it is thermally conducted to the cooler, producing cooling.
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Citations
4 Claims
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1. A method of manufacturing an inverter device that includes a plurality of heat buffer plates, comprising:
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bonding a plurality of semiconductor chips and said heat buffer plates by a low melting point or high melting point solder; bonding said heat buffer plates and a conductor by a low melting point or high melting point solder; dividing a wide conductor into a plurality of chips fixing said conductor to a cooler; fixing said heat buffer plates with said plurality of chips; fixing said conductor and said cooler by application of pressure at locations where the plurality of semiconductor chips are not bonded to said conductor; forming said conductor as an upper arm conductor and a lower arm conductor; and bonding a first subset of said heat buffer plates onto said upper arm conductor and bonding a second subset of said heat buffer plates onto said lower arm conductor. - View Dependent Claims (2, 3, 4)
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Specification