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Micro-chimney and thermosiphon die-level cooling

  • US 7,487,822 B2
  • Filed: 10/26/2005
  • Issued: 02/10/2009
  • Est. Priority Date: 01/11/2002
  • Status: Expired due to Term
First Claim
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1. A semiconductor die comprising:

  • at least one conduit disposed within the die, a first portion of the conduit being proximate to a localized area, and a second portion of the conduit having an end portion at a face of the die; and

    a heat-dissipating material at least partially filling the conduit, the heat-dissipating material comprising a material capable of changing phase, wherein the conduit is constructed and arranged to absorb the heat from the localized area and to dissipate at least a portion of the heat away from the localized area.

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