Resin molded component fitted with a metal plate and molding method therefor

• US 7,488,904 B2
• Filed: 06/21/2007
• Issued: 02/10/2009
• Est. Priority Date: 06/22/2006
• Status: Active Grant

• Current Assignee: Sumitomo Wiring Systems Limited (Sumitomo Corporation)
• Original Assignee: Sumitomo Wiring Systems Limited (Sumitomo Corporation)
• Inventors: Nagashima, Shinyu, Maegawa, Akihito
• Primary Examiner(s): Ngo; Hung V
• Application Number:
  US11/820,980
• Publication Number:
  US 20080123261A1
• Time in Patent Office: 600 Days
• Field of Search: 174/68.2, 174/536, 174/541, 174/521, 439/76.2, 439/625
• US Class Current: 174/521
• CPC Class Codes: B29C 2045/0027 Gate or gate mark locations
• CPC Class Codes: B29C 45/14655 connected to or mounted on a carrier, e.g. lead frame
• CPC Class Codes: B29C 45/1671 with an insert
• CPC Class Codes: H05K 1/056 the metal substrate being covered by an organic insulating layer
• CPC Class Codes: H05K 2201/0397 Tab forming integral conductive tabs H05K3/4092
• CPC Class Codes: H05K 2201/09118 Moulded substrate
• CPC Class Codes: H05K 2201/10151 Sensor
• CPC Class Codes: H05K 2201/10401 Eyelets, i.e. rings inserted into a hole through a circuit board
• CPC Class Codes: H05K 2201/10651 Component having two leads, e.g. resistor, capacitor
• CPC Class Codes: H05K 3/202 using self-supporting metal foil pattern
• CPC Class Codes: H05K 3/326 the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits H05K3/365 takes precedence

Abstract

A sensor unit (1) has a metal plate (10), a resin molded portion (20) and an oil temperature sensor (2). Busbars (4) made of a metal are arranged in the resin molded portion (20). Since the busbars (4) are insert-molded while having the exposed ends (4A) thereof tightly held by a pair of forming dies, a distance between the exposed ends (4A) and the placing surface 10A is held constant. Further, gate marks (5D) of the oil temperature sensor (2) are accommodated in recesses (10B) of the placing surface (10) and engaging grooves (9) and engaging projections (26A) are engaged. Thus, the oil temperature sensor (2) can be held in a proper posture. Additionally, the oil temperature sensor (2) can be held on the placing surface (10A) by riveting the exposed end (4A) and a terminal (8) of the oil temperature sensor (2).

Claims

1. A component, comprising:

at least one metal plate;

a resin molded portion insert-molded to the metal plate to define an integral matrix of resin surrounding and engaging at least portions of the metal plate;

at least one electronic component arranged substantially at the resin molded portion; and

at least one busbar at least partly insert-molded in the resin molded portion, and the electronic component being holdable on the metal plate by fixing a portion of the busbar exposed from the resin molded portion to a terminal of the electronic component.

2. The component of claim 1, wherein the electronic component includes a main portion made of synthetic resin and formed by injection molding.

3. The component of claim 2, wherein the electronic component is formed with at least one molding gate at a part of the main portion in contact with the metal plate, and the metal plate is formed with at least one recess for at least partly accommodating a gate mark formed on the main portion of the electronic component substantially in correspondence with the gate.

4. The component of claim 1, wherein the resin molded portion includes a primary molded portion insert-molded to be integral to the metal plate, and a secondary molded portion insert-molded to be integral to the primary molded portion and to surround at least part of the busbar0.

5. The component of claim 1, further comprising guiding walls integrally formed with the metal plate and standing up from a surface of the metal plate for positioning and holding the electronic component therebetween.

6. The component claim 5, wherein the electronic component and the guiding walls include engaging portions and engaging grooves that are engageable with each other.

7. The component of claim 6, wherein the engaging portions and the engaging grooves are configured for slidably guiding the electronic component into a clearance between the guiding walls for positioning the electronic component relative to the surface of the metal plate.

8. A method for molding component, comprising:

providing at least one metal plate;

insert-molding a resin molded portion to define a unitary matrix of resin at least partly surrounding and engaging the metal plate;

insert-molding at least one busbar in the resin molded portion;

arranging at least one electronic component at the resin molded portion; and

fixing a portion of the busbar exposed from the resin molded portion to a terminal of the electronic component for holding the electronic component on a surface of the metal plate.

9. The method of claim 8, injection molding a synthetic resin main portion of the electronic component to include at least one molding gate mark at a part of the main portion in contact with the metal plate, and forming the metal plate with at least one recess for at least partly accommodating the gate mark formed on the main portion of the electronic component.

10. The method of claim 8, wherein the step of insert-molding the resin molded portion includes the following steps:

insert-molding a primary molded portion to be integral to the metal plate; and

insert-molding at least one secondary molded portion to be integral to the primary molded portion and surrounding at least part of the busbar.