Microminiature power converter and thin film magnetic induction device thereof

• US 7,489,222 B2
• Filed: 12/07/2007
• Issued: 02/10/2009
• Est. Priority Date: 12/07/2006
• Status: Active Grant

• Current Assignee: Fuji Electric Company Limited (Fuji Electric Systems Company Limited)
• Original Assignee: Fuji Electric Device Technology Company Limited (Fuji Electric Systems Company Limited)
• Inventors: Hirose, Takayuki, Edo, Masaharu
• Primary Examiner(s): Nguyen; Tuyen T.
• Application Number:
  US11/952,986
• Publication Number:
  US 20080136575A1
• Time in Patent Office: 431 Days
• Field of Search: 336/65, 336/83, 336/192, 336/200, 336206-208, 336/232
• US Class Current: 336/200
• CPC Class Codes: H01F 2027/2819 Planar transformers with printed windings, e.g. surrounded by two cores and to be mounted on printed circuit
• CPC Class Codes: H01F 27/2804 Printed windings
• CPC Class Codes: H01F 27/29 Terminals; Tapping arrangements for signal inductances
• CPC Class Codes: H01F 27/40 Structural association with built-in electric component, e.g. fuse
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector

Abstract

A microminiature power converter includes a thin film magnetic induction device including a ferrite substrate and a solenoid coil conductor extending along the first and second principal planes of the substrate with the conductor extending through through-holes formed in the substrate to form a coil configuration. Electrodes are positioned near the peripheral region of the substrate and are collectively arranged at least one along the direction parallel to the axis of the solenoid coil formed by the conductor. The length of the coil can be increased to increase the inductance value of the coil. Gaps or grooves are provided near or in the peripheral region of the ferrite substrate to reduce induced voltage appearing in the electrodes.

Claims

1. A microminiature power converter comprising:

a semiconductor device having an integrated circuit; and

a thin film magnetic induction device operatively connected to the semiconductor device,

wherein the thin film magnetic induction device includes;

a magnetic insulating substrate having a first principal plane and a second principal plane, a plurality of first through-holes, and a plurality of second through-holes;

a solenoid coil comprising a conductor extending on the first principal plane of the magnetic insulating substrate, passing through the through holes and extending on the second principal plane of the magnetic insulating substrate to form a coil configuration;

second connection conductors in the second through-holes; and

a plurality of pairs of electrodes connected through the second connection conductors and formed opposing each other on the first principal plane and the second principal plane,

wherein the second through-holes are situated along a peripheral region of the magnetic insulating substrate,

wherein the pairs of electrodes are arranged collectively only at one side or two opposing sides of the magnetic insulating substrate, extending parallel to an axis of the solenoid coil.

2. The microminiature power converter according to claim 1, wherein the magnetic insulating substrate has at least one of gaps or grooves around the peripheral region thereof to reduce induced voltage between the pairs of electrodes.

3. The microminiature power converter according to claim 2, wherein the gaps extend from the second through-holes or are spaced from the second through-holes.

4. The microminiature power converter according to claim 2, wherein each of the gaps has a slit configuration passing through the magnetic insulating substrate.

5. The microminiature power converter according to claim 2, wherein the grooves extend between adjacent pairs of the electrodes on the first or second principal plane.

6. The microminiature power converter according to claim 2, wherein the grooves extend from at least one the first or the second principal plane toward but not to the other of the first or second plane.

7. The microminiature power converter according to claim 2, wherein the gaps or grooves reach an outer peripheral end of the magnetic insulating substrate.

8. A microminiature power converter comprising:

a semiconductor device having an integrated circuit; and

a thin film magnetic induction device operatively connected to the semiconductor device,

wherein the thin film magnetic induction device includes;

a magnetic insulating substrate having a first principal plane and a second principal plane, a plurality of first through-holes, and a plurality of second through-holes;

a solenoid coil comprising a conductor extending on the first principal plane of the magnetic insulating substrate, passing through the through holes and extending on the second principal plane of the magnetic insulating substrate to form a coil configuration;

second connection conductors in the second through-holes; and

a plurality of pairs of electrodes connected through the second connection conductors and formed opposing each other on the first principal plane and the second principal plane,

wherein the second through-holes are situated along a peripheral region of the magnetic insulating substrate,

wherein the magnetic insulating substrate has at least one of gaps or grooves around the peripheral region thereof to reduce induced voltage between the pairs of electrodes.

9. The microminiature power converter according to claim 8, wherein the gaps extend from the second through-holes or are spaced from the second through-holes.

10. The microminiature power converter according to claim 8, wherein each of the gaps has a slit configuration passing through the magnetic insulating substrate.

11. The microminiature power converter according to claim 8, wherein the grooves extend between adjacent pairs of the electrodes on the first or second principal plane.

12. The microminiature power converter according to claim 8, wherein the grooves extend from at least one the first or the second principal plane toward but not to the other of the first or second plane.

13. The microminiature power converter according to claim 8, wherein the gaps or grooves reach an outer peripheral end of the magnetic insulating substrate.

14. A thin film magnetic induction device for a microminiature power converter, the induction device comprising:

a magnetic insulating substrate having a first principal plane and a second principal plane, a plurality of first through-holes, and a plurality of second through-holes;

a solenoid coil comprising a conductor extending on the first principal plane of the magnetic insulating substrate, passing through the through holes and extending on the second principal plane of the magnetic insulating substrate to form a coil configuration;

second connection conductors in the second through-holes; and

a plurality of pairs of electrodes connected through the second connection conductors and formed opposing each other on the first principal plane and the second principal plane,

wherein the second through-holes are situated along a peripheral region of the magnetic insulating substrate,

wherein the pairs of electrodes are arranged collectively only at one side or two opposing sides of the magnetic insulating substrate, extending parallel to an axis of the solenoid coil.

15. The thin film magnetic induction device according to claim 14, wherein the magnetic insulating substrate has at least one of gaps or grooves around the peripheral region thereof to reduce induced voltage between the pairs of electrodes.

16. The thin film magnetic induction device according to claim 15, wherein the gaps extend from the second through-holes or are spaced from the second through-holes.

17. The thin film magnetic induction device according to claim 15, wherein each of the gaps has a slit configuration passing through the magnetic insulating substrate.

18. The thin film magnetic induction device according to claim 15, wherein the grooves extend between adjacent pairs of the electrodes on the first or second principal plane.

19. The thin film magnetic induction device according to claim 15, wherein the grooves extend from at least one the first or the second principal plane toward but not to the other of the first or second plane.

20. The thin film magnetic induction device according to claim 15, wherein the gaps or grooves reach an outer peripheral end of the magnetic insulating substrate.