RFID tags and processes for producing RFID tags

• US 7,489,248 B2
• Filed: 07/31/2006
• Issued: 02/10/2009
• Est. Priority Date: 03/24/2003
• Status: Expired due to Fees

• Current Assignee: RUIZHANG TECHNOLOGY LIMITED COMPANY
• Original Assignee: Alien Technology Corporation
• Inventors: Hadley, Mark A., Schatz, Kenneth D., Gengel, Glenn W., Drzaic, Paul S., Pounds, Tom
• Primary Examiner(s): Mullen, Thomas J
• Application Number:
  US11/497,402
• Publication Number:
  US 20060267778A1
• Time in Patent Office: 925 Days
• Field of Search: 340/572.1, 340/572.7, 298/25, 298/29, 298/46, 299/46, 438/106, 438/107, 438/110, 257/678, 257/734, 361/737, 361/749, 361/760, 361/761, 361/764, 235/492
• US Class Current: 340/572.7
• CPC Class Codes: D10B 2401/18 including electronic components
• CPC Class Codes: G06K 19/027 the material being suitable for use as a textile, e.g. woven-based RFID-like labels designed for attachment to laundry items markings attached to laundry items in general D06F93/00
• CPC Class Codes: G06K 19/07722 the record carrier being multilayered, e.g. laminated sheets flat articles in general, see B32B37/00
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/07758 arrangements for adhering the record carrier to further objects or living beings, functioning as an identification tag
• CPC Class Codes: H01L 2224/24227 the HDI interconnect not connecting to the same level of the item at which the semiconductor or solid-state body is mounted, e.g. the semiconductor or solid-state body being mounted in a cavity or on a protrusion of the item
• CPC Class Codes: H01L 2224/76155 Jetting means, e.g. ink jet
• CPC Class Codes: H01L 2224/82039 using a laser
• CPC Class Codes: H01L 2224/82102 using jetting, e.g. ink jet
• CPC Class Codes: H01L 24/24 of an individual high density interconnect connector
• CPC Class Codes: H01L 24/82 by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI] interconnection structure between a plurality of semiconductor chips H01L23/5389
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/01004 Beryllium [Be]
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01027 Cobalt [Co]
• CPC Class Codes: H01L 2924/01033 Arsenic [As]
• CPC Class Codes: H01L 2924/01047 Silver [Ag]
• CPC Class Codes: H01L 2924/01051 Antimony [Sb]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/01082 Lead [Pb]
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/07802 : not being an ohmic electrical conductor
• CPC Class Codes: H01L 2924/12042 : LASER
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/15153 : the die mounting substrate comprising a recess for hosting the device
• CPC Class Codes: H01L 2924/15165 : Monolayer substrate
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H01L 2924/19042 : being an inductor
• CPC Class Codes: H01L 2924/3011 : Impedance
• CPC Class Codes: Y10T 29/49018 : with other electrical component
• CPC Class Codes: Y10T 29/49155 : Manufacturing circuit on or in base

Abstract

A Radio Frequency Identification (RFID) tag. The RFID tag comprises a flexible substrate and an integrated circuit embedded within the flexible substrate. The top surface of the integrated circuit is coplanar with the flexible substrate. At least one conductive element is formed on the flexible substrate. The conductive element is electrically connected to the integrated circuit. The conductive element serves as an antenna for the RFID tag.

Claims

1. A method of forming an RFID tag comprising:

depositing an integrated circuit within a receptor in a flexible web substrate using Fluidic Self Assembly;

forming at least one conductive trace on the flexible web substrate to simultaneously form an electrical connection to the integrated circuit and form an antenna element, wherein a portion of the flexible web substrate has a length which is at least ten times a width of the integrated circuit after the portion, including the integrated circuit and the at least one conductive trace, is singulated from the flexible web substrate.

2. The method of claim 1 wherein the conductive trace is at least one of a printed conductive element, evaporated metal, sputtered metal, plated metal, and a laminated conducting foil.

3. The method of claim 1 wherein the length of the portion is configured to be optimized to cancel the electrical reactance of the integrated circuit in the RFID tag.

4. The method of claim 1 wherein the structure of the antenna element is configured to be designed to substantially match the impedance of the antenna element to the input impedance of the integrated circuit.

5. A Radio Frequency Identification (RFID) tag comprising:

a flexible substrate;

an integrated circuit embedded within the flexible substrate, a top surface of the integrated circuit being coplanar with the flexible substrate;

at least one conductive element formed on the flexible substrate, the at least one conductive element being electrically connected to the integrated circuit, the at least one conductive element are trace filaments serving as an antenna for the RFID tag; and

wherein the trace filaments and the flexible substrate are singulatated from a blanket coat of a nearly-continuous conductive film formed over a plurality of flexible substrates prior to singulation, wherein the trace filaments are substantially aligned along the length of the corresponding singulatated flexible substrate.

6. The RFID tag of claim 5 wherein the trace filaments cut from the blanket of a nearly-continuous film of conductive element is on top of a planarization layer which is on top of the flexible substrate.

7. The RFID tag of claim 6 wherein a metal interconnection is formed directly on the top surface of the flexible substrate to connect the integrated circuit to the trace filaments.

8. The RFID tag of claim 7 wherein a metal interconnection is part of the substantially continuous film over the flexible substrate and the integrated circuit.

9. The RFID tag of claim 5 wherein coplanar refers to a configuration where the top surface of the integrated circuit is below a top surface of the substrate.

10. The RFID tag of claim 5 wherein coplanar refers to a configuration where the top surface of the integrated circuit shares essentially the same plane as a top surface of the substrate.

11. A method of forming an RFID tag comprising:

depositing an integrated circuit within a receptor in a flexible web substrate using Fluidic Self Assembly;

forming a blanket coat of a nearly-continuous film of conductor over the flexible web substrate, leaving only the center portion of the integrated circuit exposed, and

using a subtractive method to form antenna traces from the blanket coat of a nearly-continuous film of conductor and to form an electrical connection to the integrated circuit, wherein the blanket coat of a nearly-continuous film of conductor is formed on top of a planarization layer which is formed on top of the flexible substrate.

12. The method of claim 11 wherein a subtractive method includes at least one of chemical etching, laser ablation and mechanical removal.

13. A Radio Frequency Identification (RFID) tag comprising:

a flexible substrate;

a block device embedded within the flexible substrate, a top surface of the block device being coplanar with the flexible substrate;

the block device having a top electrical contact directly on the top surface and a bottom electrical contact directly on a bottom surface; and

wherein the size of the top electrical contact is significantly larger than a bonding pad on top of the block device, and the size of the bottom electrical contact is significantly larger than another bonding pad on top of the block device.

14. The RFID tag of claim 13 wherein the size of the top electrical contact is about the same size as the entire top surface of the block device.

15. The RFID tag of claim 13 wherein the size of the bottom electrical contact is about the same size as the entire bottom surface of the block device.

16. The RFID tag of claim 13 wherein an interconnect extends from a bonding pad on the top of the block device around a side of the block device to the bottom electrical contact.

17. The RFID tag of claim 13 wherein a planarization layer is formed directly on the top surface of the block device and below the top electrical contact.

18. The RFID tag of claim 13 wherein the top electrical contact or the bottom electrical contact is configured to be formed from a full or partial layer of a conducting adhesive material.

19. The RFID tag of claim 13 wherein the top electrical contact or the bottom electrical contact is configured to be covered by a thin layer of a non-conducting adhesive material.

20. The RFID tag of claim 13 wherein coplanar refers to a configuration where the top surface of the block device is below a top surface of the substrate.

21. The RFID tag of claim 13 wherein coplanar refers to a configuration where the top surface of the block device shares essentially the same plane as a top surface of the substrate.

22. A Radio Frequency Identification (RFID) tag comprising:

a flexible substrate;

an integrated circuit embedded within the flexible substrate, a top surface of the integrated circuit being coplanar with the flexible substrate;

at least one conductive element formed on the flexible substrate, the at least one conductive element being electrically connected to the integrated circuit, the at least one conductive element serving as an antenna for the RFID tag; and

wherein the flexible substrate length is at least ten times the width of the integrated circuit and the at least one conductive element comprises at least one of metal particles, organic particles, and semiconducting particles, wherein the length of the flexible substrate is configured to be optimized to cancel the electrical reactance of the integrated circuit in the RFID tag.

23. The RFID tag of claim 22 wherein the at least one conductive element is at least one of a printed conductive element, evaporated metal, sputtered metal, plated metal, and a laminated conducting foil.

24. The RFID tag of claim 22 wherein coplanar refers to a configuration where the top surface of the integrated circuit shares essentially the same plane as a top surface of the substrate.

25. A Radio Frequency Identification (RFID) tag comprising:

a flexible substrate;

an integrated circuit embedded within the flexible substrate, a top surface of the integrated circuit being coplanar with the flexible substrate;

at least one conductive element formed on the flexible substrate, the at least one conductive element being electrically connected to the integrated circuit, the at least one conductive element serving as an antenna for the RFID tag; and

wherein the flexible substrate length is at least ten times the width of the integrated circuit and the at least one conductive element comprises at least one of metal particles, organic particles, and semiconducting particles, wherein the structure of the antenna is configured to be designed to substantially match the impedance of the antenna to the input impedance of the integrated circuit.

26. The RFID tag of claim 25 wherein the at least one conductive element is at least one of a printed conductive element, evaporated metal, sputtered metal, plated metal, and a laminated conducting foil.

27. The RFID tag of claim 25 wherein coplanar refers to a configuration where the top surface of the integrated circuit shares essentially the same plane as a top surface of the substrate.

28. A Radio Frequency Identification (RFID) tag comprising:

a flexible substrate;

an integrated circuit embedded within the flexible substrate, a top surface of the integrated circuit being coplanar with the flexible substrate;

at least one conductive element formed on the flexible substrate, the at least one conductive element being electrically connected to the integrated circuit, the at least one conductive element serving as an antenna for the RFID tag; and

wherein the flexible substrate length is at least ten times the width of the integrated circuit and the at least one conductive element comprises at least one of metal particles, organic particles, and semiconducting particles, wherein coplanar refers to a configuration where the top surface of the integrated circuit is below a top surface of the substrate.

29. The RFID tag of claim 28 wherein the at least one conductive element is at least one of a printed conductive element, evaporated metal, sputtered metal, plated metal, and a laminated conducting foil.