Polyurethane to polyethylene adhesion process

• US 7,489,843 B2
• Filed: 02/06/2007
• Issued: 02/10/2009
• Est. Priority Date: 02/06/2007
• Status: Expired due to Fees

• Current Assignee: CommScope Technologies, LLC (CommScope Holding Company, Inc.)
• Original Assignee: ADC Telecommunications Incorporated (TE Connectivity Limited)
• Inventors: Wells, Dennis Ray, Carlson, Scott
• Primary Examiner(s): HAHM, SARAH UH YOUNG
• Application Number:
  US11/702,914
• Publication Number:
  US 20080187274A1
• Time in Patent Office: 735 Days
• Field of Search: 385134-137, 385/100
• US Class Current: 385/100
• CPC Class Codes: B29C 2045/14557 coating spliced fibres or cables, e.g. optical fiber splices or junctions
• CPC Class Codes: B29C 45/14549 Coating rod-like, wire-like or belt-like articles B29C45/14426 takes precedence
• CPC Class Codes: B29C 59/043 for profiled articles
• CPC Class Codes: B29C 65/70 by moulding using a particular moulding technique, see the relevant technique , e.g. by injection B29C45/14467
• CPC Class Codes: B29C 66/0222 without removal of material, e.g. cleaning by air blowing or using brushes
• CPC Class Codes: B29C 66/02245 Abrading, e.g. grinding, sanding, sandblasting or scraping
• CPC Class Codes: B29C 66/026 Chemical pre-treatments B29C66/028 takes precedence
• CPC Class Codes: B29C 66/028 Non-mechanical surface pre-treatments, i.e. by flame treatment, electric discharge treatment, plasma treatment, wave energy or particle radiation B29C65/14 takes precedence; non-mechanical surface treatment of plastics in general B29C59/08 - B29C59/16
• CPC Class Codes: B29C 66/1142 Single butt to butt joints
• CPC Class Codes: B29C 66/526 Joining bars
• CPC Class Codes: B29C 66/71 characterised by the composition of the plastics material of the parts to be joined welding bar compositions B29C65/125
• CPC Class Codes: B29C 66/73161 Roughness or rugosity
• CPC Class Codes: B29K 2023/06 PE, i.e. polyethylene
• CPC Class Codes: B29K 2075/00 Use of PU, i.e. polyureas or polyurethanes or derivatives thereof, as moulding material
• CPC Class Codes: B29L 2031/3462 Cables
• CPC Class Codes: C08J 2323/06 Polyethene
• CPC Class Codes: C08J 2375/04 Polyurethanes
• CPC Class Codes: C08J 5/121 by heating
• CPC Class Codes: G02B 6/4475 with provision for lateral branching G02B6/4431 takes precedence

Abstract

A telecommunications cable includes a distribution cable, a tether branching from the distribution cable at a breakout location, and an enclosure that surrounds the breakout location. The enclosure is secured to the distribution cable at first and second adhesion regions. The enclosure can also secure to the tether at a third adhesion region. The adhesion regions are treated by sanding the regions, cleaning the regions, and then plasma-etching the regions immediately before welding/injection molding the enclosure around the breakout location.

Claims

1. A method for treating a telecommunications cable, the method comprising:

selecting a first area on the telecommunications cable, the first area extending partially along a first length of the telecommunications cable and circumferentially around the telecommunications cable;

sanding a first surface of the first area to provide a first roughened surface;

cleaning the first roughened surface with a cleaning agent to provide a first cleaned surface;

etching disruptions in the first cleaned surface to form a first treated surface; and

forming an enclosure over the telecommunications cable, at least a portion of the enclosure contacting the first treated surface of the telecommunications cable.

2. The method of claim 1, wherein forming an enclosure comprises forming the enclosure from a polymeric material.

3. The method of claim 2, wherein forming an enclosure comprises forming the enclosure from polyurethane.

4. The method of claim 1, wherein the first area of the telecommunications cable is formed from polyethylene.

5. The method of claim 1, wherein cleaning comprises applying the cleaning agent to the first roughened surface and wiping excess cleaning agent from the first roughened surface.

6. The method of claim 1, wherein the cleaning agent comprises isopropyl alcohol.

7. The method of claim 1, wherein etching disruptions is performed less than four minutes after cleaning the first roughened surface.

8. The method of claim 1, wherein etching disruptions is performed with a plasma-etcher.

9. The method of claim 1, wherein forming the enclosure is performed less than four minutes after etching disruptions.

10. The method of claim 1, further comprising:

selecting a second area on the telecommunications cable, the second area extending partially along a second length of the telecommunications cable;

sanding a surface of the second area to provide a second roughened surface;

cleaning the second roughened surface with a cleaning agent to provide a second cleaned surface; and

etching disruptions in the second cleaned surface to form a seconded treated surface.

11. The method of claim 10, wherein the first length is less than four inches and the second length is substantially equal to the first length.

12. The method of claim 11, wherein the first length is about three inches.

13. A method for overmolding a section of a telecommunications cable, the method comprising:

selecting a first area on the telecommunications cable, the first area extending partially along a length of the telecommunications cable and circumferentially around the telecommunications cable;

sanding a first surface of the first area to provide a first roughened surface;

cleaning the first roughened surface with alcohol to provide a first cleaned surface;

etching disruptions in the first cleaned surface to form a first treated surface;

mounting the first treated surface in a mold;

injecting a liquid polymeric material into the mold to cover the first treated surface;

allowing the polymeric material to harden; and

removing the mold to leave the hardened polymeric material around the first treated surface.

14. The telecommunications cable of claim 13, wherein the polymeric material is polyurethane.

15. The telecommunications cable of claim 13, wherein the first area of the telecommunications cable is formed from polyethylene.

16. The method of claim 13, further comprising:

selecting a second area on the telecommunications cable;

sanding a surface of the second area to provide a second roughened surface;

cleaning the second roughened surface with alcohol to provide a second cleaned surface;

etching disruptions in the second cleaned surface to form a seconded treated surface; and

mounting the second treated surface in the mold, wherein the liquid polymeric material injected into the mold also cover the second treated surface; and

the hardened polymeric material surrounds the second treated surface.

17. A method for preterminating a tether to a distribution cable, the method comprising:

coupling at least a first fiber of a tether to a first fiber of a distribution cable at a breakout location on the distribution cable;

selecting a first area on the distribution cable, the first area located at a first end of the breakout location, the first area having a first surface;

selecting a second area on the distribution cable, the second area located at a second, opposite end of the breakout location, the second area having a second surface;

sanding the first surface of the first area to provide a first roughened surface;

sanding the second surface of the second area to provide a second roughened surface;

cleaning the first roughened surface with a cleaning agent to provide a first cleaned surface;

cleaning the second roughened surface with the cleaning agent to provide a second cleaned surface;

etching disruptions in the first cleaned surface to form a first treated surface;

etching disruptions in the second cleaned surface to form a second treated surface; and

forming an enclosure over the breakout location on the distribution cable, at least a first portion of the enclosure contacting the first treated surface of the distribution cable and at least a second portion of the enclosure contacting the second treated surface of the distribution cable.

18. The method of claim 17, wherein the enclosure if formed from polyurethane.

19. The method of claim 17, wherein the first area of the distribution cable is formed from polyethylene.

20. The method of claim 17, further comprising installing a breakout assembly on the distribution cable to protect the first fiber of the tether and the first fiber of the distribution cable, the enclosure also surrounding the breakout assembly.

21. The method of claim 17, wherein the enclosure is formed on the distribution cable in a factory prior to field installation.

22. The method of claim 17, further comprising:

selecting a third area on the tether, the third area located adjacent the second end of the breakout location on the distribution cable;

sanding a surface of the third area to provide a third roughened surface;

cleaning the third roughened surface with a cleaning agent to provide a third cleaned surface; and

etching disruptions in the third cleaned surface to form a third treated surface, wherein at least a portion of the enclosure contacts the third treated surface of the tether.

23. A method for providing enhanced adhesion between a polyethylene surface and an overmolded polyurethane layer, the method comprising:

sanding a first section of the polyethylene surface to produce a first roughened surface;

cleaning the first roughened surface with a cleaning agent to provide a first cleaned surface;

etching disruptions in the first cleaned surface to form a first treated surface; and

overmolding the first treated surface with polyurethane to produce an overmolded polyurethane layer, wherein the overmolded polyurethane layer is adhered to the first treated surface.

24. The method of claim 23, wherein cleaning comprises cleaning the first roughened surface with isopropyl alcohol.

25. The method of claim 23, wherein etching disruptions is performed less than two minutes after cleaning the first roughened surface.

26. The method of claim 23, wherein overmolding the first treated surface is performed less than two minutes after etching disruptions in the first cleaned surface.