Light-emitting device and glass seal member therefor

• US 7,491,981 B2
• Filed: 09/06/2005
• Issued: 02/17/2009
• Est. Priority Date: 09/07/2004
• Status: Expired due to Fees

• Current Assignee: Toyoda Gosei Company Limited (Toyota Motor Corporation)
• Original Assignee: Toyoda Gosei Company Limited (Toyota Motor Corporation)
• Inventors: Yamaguchi, Seiji, Suehiro, Yoshinobu
• Primary Examiner(s): Vu; David
• Assistant Examiner(s): LOPEZ ESQUERRA, ANDRES
• Application Number:
  US11/218,530
• Publication Number:
  US 20060049423A1
• Time in Patent Office: 1,260 Days
• Field of Search: 257 98-100
• US Class Current: 257/100
• CPC Class Codes: H01L 2224/0554 External layer
• CPC Class Codes: H01L 2224/0555 Shape
• CPC Class Codes: H01L 2224/0556 Disposition
• CPC Class Codes: H01L 2224/0557 the external layer being disposed on a via connection of the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/05571 the external layer being disposed in a recess of the surface
• CPC Class Codes: H01L 2224/05573 Single external layer
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01019 Potassium [K]
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 33/58 Optical field-shaping elements
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H01L 33/642 : characterized by the shape

Abstract

A light-emitting device has a light-emitting portion having a light-emitting element; a heat dissipation base on which is mounted the light-emitting portion and which is exposed outwardly for dissipating heat produced by the light-emitting portion; a power feeding portion for feeding power to the light-emitting portion; and a sealing portion formed of a glass material being integral with the heat dissipation base for insulating the power feeding portion from the heat dissipation base.

Claims

1. A light-emitting device, comprising:

a light-emitting portion comprising a light-emitting element;

a heat dissipation base on which the light-emitting portion is mounted and which is exposed outwardly for dissipating heat produced by the light-emitting portion;

a power feeding portion for feeding power to the light-emitting portion; and

a sealing portion comprising a glass material contacting the heat dissipation base for insulating the power feeding portion from the heat dissipation base,

wherein the sealing portion comprises;

a first sealing portion comprised of the glass material and disposed between the heat dissipation base and the power feeding portion for insulation therebetween, said first sealing portion having at least one of a recessed portion and a groove with corrugated ridges surrounding said light-emitting element at a predetermined distance therefrom; and

a second sealing portion comprised of the glass material and which is integrated through the power feeding portion with the first sealing portion, the glass material having light transmissivity for radiating outwardly light emitted from the light-emitting portion, and

the second sealing portion is directly bonded to the first sealing portion.

2. The light-emitting device according to claim 1, wherein:

the sealing portion further comprises;

a stress buffer portion that is disposed at a periphery of the light-emitting portion, the stress buffer portion being confined by the heat dissipation base and the sealing portion.

3. The light-emitting device according to claim 2, wherein:

the light-emitting portion comprises the light-emitting element mounted on a submount.

4. The light-emitting device according to claim 2, wherein:

the power feeding portion is in the form of a conductive thin film.

5. The light-emitting device according to claim 2, wherein:

the at least one of said recessed portion and said groove with corrugated ridges comprises a suppression portion that prevents a diffusion of a buffering material to flow out from the stress buffer portion through an interface between the first and the second sealing portions.

6. The light-emitting device according to claim 2, wherein:

the first sealing portion comprises a molded sealing portion.

7. The light-emitting device according to claim 1, wherein:

the light-emitting portion comprises the light-emitting element mounted on a submount.

8. The light-emitting device according to claim 1, wherein:

the power feeding portion is in the form of a conductive thin film, said conductive thin film extending radially outward from between said first sealing portion and said second sealing portion.

9. The light-emitting device according to claim 1, wherein:

the heat dissipation base, the power feeding portion and the sealing portion have substantially a same thermal expansion coefficient.

10. The light-emitting device according to claim 1, wherein:

the power feeding portion comprises a soft metal.

11. The light-emitting device according to claim 1, wherein:

the heat dissipation base comprises a material with a thermal conductivity of 100 W/(m·

K) or more.

12. The light-emitting device according to claim 11, wherein:

the heat dissipation base comprises a copper alloy.

13. The light-emitting device according to claim 1, wherein the second sealing portion is thermocompression-bonded to the first sealing portion.