Inductively powered transponder device
First Claim
Patent Images
1. An inductively powered transponder device comprises:
- an unpackaged integrated circuit in which is integrated an antenna for receiving power and signal from radio frequency transmissions;
a heatsink thermally connected to the integrated circuit and having means to prevent eddy currents, wherein the heatsink comprises a metallic layer and the means to prevent eddy currents comprises one or more slots in the metallic layer; and
a first layer and a second layer of web material attached together to encapsulate the integrated circuit and the heatsink;
wherein one or both of the first layer and the second layer are formed substantially of paper.
1 Assignment
0 Petitions
Accused Products
Abstract
An inductively powered transponder device has an unpackaged integrated circuit in which is integrated an antenna for receiving power and signal from radio frequency transmissions. A heatsink is thermally connected to the integrated circuit. The heatsink has means to prevent eddy currents. A first layer and a second layer of web material are attached together to encapsulate the integrated circuit and the heatsink.
6 Citations
16 Claims
-
1. An inductively powered transponder device comprises:
-
an unpackaged integrated circuit in which is integrated an antenna for receiving power and signal from radio frequency transmissions; a heatsink thermally connected to the integrated circuit and having means to prevent eddy currents, wherein the heatsink comprises a metallic layer and the means to prevent eddy currents comprises one or more slots in the metallic layer; and a first layer and a second layer of web material attached together to encapsulate the integrated circuit and the heatsink; wherein one or both of the first layer and the second layer are formed substantially of paper. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
-
-
9. A method of manufacturing an inductively powered transponder device, comprising:
-
providing a first layer of web material; forming a heatsink layer, having means to prevent eddy currents, on the first layer, wherein the heatsink layer comprises a metallic layer and the means to prevent eddy currents comprises one or more slots formed in the metallic layer; attaching an unpackaged integrated circuit with an antenna for receiving power and signal from radio frequency transmissions on the heatsink layer; providing a second layer of web material over the first layer such that the heatsink layer and the unpackaged integrated circuit lie therebetween; and encapsulating the heatsink layer and the unpackaged integrated circuit between the first layer and the second layer; wherein one or both of the first layer and the second layer are formed substantially of paper. - View Dependent Claims (10, 11, 12, 13, 14)
-
- 15. A memory tag comprising an unpackaged integrated circuit with an antenna and adapted to receive power and signal from radio frequency transmissions, the unpackaged integrated circuit being in thermal contact with a heatsink having means to prevent eddy currents, wherein the unpackaged integrated circuit and the heatsink are encapsulated between two layers of a web material, wherein the two layers are formed substantially of paper, and wherein the heatsink comprises a metallic layer and the means to prevent eddy currents comprises one or more slots formed in the metallic layer.
Specification