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Method of fabricating a free-standing microstructure

  • US 7,492,502 B2
  • Filed: 08/05/2005
  • Issued: 02/17/2009
  • Est. Priority Date: 09/27/2004
  • Status: Expired due to Fees
First Claim
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1. A method for fabricating a microelectromechanical systems device comprising:

  • forming a conductive layer over a first sacrificial layer;

    patterning a movable conductor from the conductive layer;

    forming a planar layer of a second sacrificial layer over the movable conductor and first sacrificial layer;

    forming an opening in the first sacrificial layer prior to forming the second sacrificial layer, wherein the opening is adjacent to the movable conductor;

    forming a first opening in the second sacrificial layer, whereinthe first opening in the second sacrificial layer is adjacent to the movable conductor; and

    the first opening in the second sacrificial layer is substantially aligned with the opening in the first sacrificial layer; and

    forming a deformable layer over the second sacrificial layer, and into the first opening in the second sacrificial layer, thereby forming an integrated deformable layer and post.

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