Method of fabricating a free-standing microstructure
First Claim
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1. A method for fabricating a microelectromechanical systems device comprising:
- forming a conductive layer over a first sacrificial layer;
patterning a movable conductor from the conductive layer;
forming a planar layer of a second sacrificial layer over the movable conductor and first sacrificial layer;
forming an opening in the first sacrificial layer prior to forming the second sacrificial layer, wherein the opening is adjacent to the movable conductor;
forming a first opening in the second sacrificial layer, whereinthe first opening in the second sacrificial layer is adjacent to the movable conductor; and
the first opening in the second sacrificial layer is substantially aligned with the opening in the first sacrificial layer; and
forming a deformable layer over the second sacrificial layer, and into the first opening in the second sacrificial layer, thereby forming an integrated deformable layer and post.
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Abstract
Provided is a MEMS device comprising an integrated post and deformable layer. In some embodiments, the transition between the post and deformable layer comprises substantially a single arcuate or convex surface, thereby providing a mechanically robust structure. Some embodiments provide a method for fabricating a MEMS device comprising the use of a self-planarizing sacrificial material, which provides a surface conducive to the formation of a relatively uniform deformable layer thereon.
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Citations
17 Claims
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1. A method for fabricating a microelectromechanical systems device comprising:
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forming a conductive layer over a first sacrificial layer; patterning a movable conductor from the conductive layer; forming a planar layer of a second sacrificial layer over the movable conductor and first sacrificial layer; forming an opening in the first sacrificial layer prior to forming the second sacrificial layer, wherein the opening is adjacent to the movable conductor; forming a first opening in the second sacrificial layer, wherein the first opening in the second sacrificial layer is adjacent to the movable conductor; and the first opening in the second sacrificial layer is substantially aligned with the opening in the first sacrificial layer; and forming a deformable layer over the second sacrificial layer, and into the first opening in the second sacrificial layer, thereby forming an integrated deformable layer and post. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 16)
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11. A microelectromechanical systems device comprising:
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a movable conductor formed over a first sacrificial layer; a planar second sacrificial layer formed over the movable conductor and the first sacrificial layer; an opening in the first sacrificial layer adjacent to the movable conductor; a first opening in the second sacrificial layer adjacent to the movable conductor and substantially aligned with the opening in the first sacrificial layer; and a conductive deformable layer over the planar second sacrificial layer, comprising an integrated post extending into the first opening in the second sacrificial layer. - View Dependent Claims (12, 13, 14, 15, 17)
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Specification