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Mask defect analysis system

  • US 7,492,940 B2
  • Filed: 06/12/2007
  • Issued: 02/17/2009
  • Est. Priority Date: 02/21/2002
  • Status: Expired due to Fees
First Claim
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1. A method of evaluating the effect of defects on components in a semiconductor manufacturing process, said method comprising:

  • inspecting a component for a defect using an inspection tool;

    storing defect inspection data from the inspection tool;

    generating a shape representing the defect;

    retrieving design data from a design data repository corresponding to the component being inspected;

    reading a first rule from a predetermined rule set of a plurality of rules; and

    determining whether to repair, accept, or scrap the component based upon the defect by applying the first rule to the generated shape.

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