Image sensor with stacked and bonded photo detection and peripheral circuit substrates
First Claim
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1. An image sensor, comprising:
- a photo detection device including a photodiode formed at a first end of said photo detection device, a first plurality of bonding pads formed on a second end of said photo detection device opposite said first end and a transfer transistor configured to transfer photoelectric charges produced by said photodiode, said transfer transistor having an electrode and being located between said photodiode and said first plurality of bonding pads such that said electrode of said transfer transistor being located below a plane defined by said photodiode; and
a peripheral circuits device including a second plurality of bonding pads formed on one end of said peripheral circuit device, said peripheral circuits device further including peripheral circuits formed on a substrate;
wherein said photo detection device is stacked on top of said peripheral circuits device such that ones of said first plurality of boding pads are electrically coupled to associated ones of said second plurality of bonding pads to provide electrical connection path between said photodiode and said peripheral circuits.
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Abstract
A complementary metal oxide semiconductor (CMOS) device with a three dimensional integration structure and a method for fabricating the same are provided. An image sensor includes a first substrate in which a photo detection device is formed; a second substrate in which a peripheral circuit is formed, wherein the first substrate and the second substrate are bonded through a plurality of bonding pads formed on both the first substrate and the second substrate, and a back side of the first substrate is turned upside down; and a microlens formed on a top portion of the back side of the first substrate.
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Citations
18 Claims
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1. An image sensor, comprising:
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a photo detection device including a photodiode formed at a first end of said photo detection device, a first plurality of bonding pads formed on a second end of said photo detection device opposite said first end and a transfer transistor configured to transfer photoelectric charges produced by said photodiode, said transfer transistor having an electrode and being located between said photodiode and said first plurality of bonding pads such that said electrode of said transfer transistor being located below a plane defined by said photodiode; and a peripheral circuits device including a second plurality of bonding pads formed on one end of said peripheral circuit device, said peripheral circuits device further including peripheral circuits formed on a substrate; wherein said photo detection device is stacked on top of said peripheral circuits device such that ones of said first plurality of boding pads are electrically coupled to associated ones of said second plurality of bonding pads to provide electrical connection path between said photodiode and said peripheral circuits. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A method for fabricating an image sensor, comprising:
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fabricating a photo detection device by; forming a first insulation layer on a first substrate; forming an epitaxial layer on the first insulation layer; forming a photodiode within the epitaxial layer; forming a transfer transistor within the epitaxial layer, an impurity region of the transfer transistor being directly connected to the photodiode; and forming a plurality of first bonding pads above the transfer transistor; fabricating a peripheral circuit device by; forming a plurality of transistors on a second substrate; forming a plurality of connection units extend from the second substrate away from said plurality of transistors, at least one of said plurality of connection units being made to penetrate through said second substrate; and forming a plurality of second bonding pads at ends of the connection units; stacking and bonding together the photo detection device and the peripheral device such that the first bonding pads and the second bonding pads face, and electrically coupled to, each other, and such that an electrode of said transfer transistor is located below a plane defined by said photodiode; forming an input/output pad to be connected to the at least one of the plurality of connection units that penetrates said second substrate on a back side of the second substrate; removing a back side of the first substrate to expose the first insulation layer; forming a color filter array and an over coating layer on the first insulation layer; and forming a microlens on the over coating layer. - View Dependent Claims (9, 10, 11, 12, 13, 14, 15, 16, 17, 18)
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Specification