Semiconductor package structure having multiple heat dissipation paths and method of manufacture
First Claim
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1. A semiconductor package structure having multiple heat dissipation paths comprising:
- a semiconductor component having first and second opposing surfaces;
a conductive support structure having a plurality of support pads, wherein the first surface of the semiconductor component is coupled to one or more of the plurality of support pads and wherein at least two of the support pads have an alignment structure formed therein;
a conductive connective bridge coupled to the second surface of the semiconductor component, wherein the conductive connective bridge comprises coupling portions on opposing ends, and wherein the coupling portions are aligned to the alignment structure on at least two support pads, and wherein the coupling portions extend from a major surface of the conductive connective bridge, and wherein the coupling portions are in physical contact with the alignment structures without an intervening material, and wherein the coupling portions and the alignment structures are configured to enhance planarity between the conductive connective bridge and semiconductor component; and
an encapsulating layer passivating portions of the semiconductor package structure while leaving portions of the conductive connective bridge and portions of the plurality of supports pads exposed to provide the multiple heat dissipation paths.
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Abstract
In one embodiment, a semiconductor package structure includes a conductive bridge having coupling portions on opposing ends. A lead frame includes alignment or receiving features for receiving the coupling portions of the bridge. A semiconductor device is attached to both the conductive bridge and the lead frame, and is configured so that the coupling portions are on opposing sides of the semiconductor device.
20 Citations
18 Claims
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1. A semiconductor package structure having multiple heat dissipation paths comprising:
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a semiconductor component having first and second opposing surfaces; a conductive support structure having a plurality of support pads, wherein the first surface of the semiconductor component is coupled to one or more of the plurality of support pads and wherein at least two of the support pads have an alignment structure formed therein; a conductive connective bridge coupled to the second surface of the semiconductor component, wherein the conductive connective bridge comprises coupling portions on opposing ends, and wherein the coupling portions are aligned to the alignment structure on at least two support pads, and wherein the coupling portions extend from a major surface of the conductive connective bridge, and wherein the coupling portions are in physical contact with the alignment structures without an intervening material, and wherein the coupling portions and the alignment structures are configured to enhance planarity between the conductive connective bridge and semiconductor component; and an encapsulating layer passivating portions of the semiconductor package structure while leaving portions of the conductive connective bridge and portions of the plurality of supports pads exposed to provide the multiple heat dissipation paths. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A semiconductor package structure comprising:
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a lead frame having a plurality of beam portions, wherein at least two beam portions include receiving structures formed thereon; a semiconductor device having first and second opposed major surfaces, wherein the semiconductor device has a first current carrying electrode on the first surface, and wherein the first current carrying electrode is attached to a first beam portion, and wherein the second major surface comprises a second current carrying electrode; a conductive plate having coupling portions extending from one surface, wherein the one surface is coupled to the second major surface of the semiconductor device so that the coupling portions are on two opposing sides of the semiconductor device, and wherein the coupling portions are in physical contact with the alignment structures without an intervening material, and wherein the coupling portions are configured to couple with the receiving structures to enhance planarity between the conductive plate and the semiconductor device; and an encapsulating layer formed over portions of the semiconductor package leaving portions of the conductive plate and portions of the beam portions exposed. - View Dependent Claims (12, 13, 14, 15, 16)
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17. A method of forming a semiconductor package comprising the steps of:
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providing a lead frame having a plurality of beam portions, wherein at least two beam portions include alignment structures formed thereon; attaching a semiconductor device having first and second opposed major surfaces and a first current carrying electrode on the first surface to a first beam portion, and wherein the second major surface comprises a second current carrying electrode; attaching a conductive plate to the second major surface of the semiconductor device, wherein the conductive plate has coupling portions extending from one surface, and wherein the attaching step includes attaching the coupling portions to the alignment structures so that the coupling portions are on two opposing sides of the semiconductor device and in physical contact with the alignment structures without an intervening material during the step of attaching the coupling portions to the alignment structures so as to provide a built-in stop feature between the coupling portions and the alignment structures; and forming an encapsulating layer formed over portions of the semiconductor package leaving portions of the conductive plate and portions of the beam portions exposed. - View Dependent Claims (18)
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Specification