Wafer probe

• US 7,495,461 B2
• Filed: 10/18/2007
• Issued: 02/24/2009
• Est. Priority Date: 12/04/2000
• Status: Expired due to Fees

• Current Assignee: Cascade Microtech Incorporated (FormFactor Incorporated)
• Original Assignee: Cascade Microtech Incorporated (FormFactor Incorporated)
• Inventors: Andrews, Mike, Martin, John, Hayden, Leonard
• Primary Examiner(s): Karlsen; Ernest F
• Application Number:
  US11/975,176
• Publication Number:
  US 20080042678A1
• Time in Patent Office: 495 Days
• Field of Search: 324/762, 297/05, 298/27, 298/43
• US Class Current: 324/755.11
• CPC Class Codes: G01R 1/06772 High frequency probes
• CPC Class Codes: G01R 1/07342 the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
• CPC Class Codes: Y10T 29/49121 Beam lead frame or beam lead device
• CPC Class Codes: Y10T 29/49147 Assembling terminal to base
• CPC Class Codes: Y10T 29/49204 Contact or terminal manufacturing
• CPC Class Codes: Y10T 29/49208 by assembling plural parts

Abstract

The present invention relates to a probe for testing of integrated circuits or other microelectronic devices.

Claims

1. A probe comprising:

(a) a substantially rigid support comprising a planar board having additional electrical elements including a plurality of spaced connection sites;

(b) an integrated tip assembly comprising;

(ii) a tab;

(ii) a plurality of contact fingers each comprising a first end portion and a second end portion, said plurality of contact fingers maintained in a predetermined alignment by said tab secured to said contact fingers, said second end portions of said contact fingers cantilevered from said first end portions in a relationship spaced to align respective second end portions of said contact fingers with respective connection sites; and

(c) a plurality of soldered interconnections securing respective second end portions of said contact fingers to respective connection sites, said first end portions of said contact fingers extending from an edge of said support.

2. The probe of claim 1 wherein said second end portions of said plurality of contact fingers are spaced further apart than said first end portions of said plurality of contact fingers and longitudinal axes of said plurality of contact fingers extending from respective second end portions through respective first end portions intersect at an intersection nearer said first end portions of said contact fingers than to said second end portions but more distal from said second end portions of said contact fingers than said first end portions are from said second end portions.

3. The probe of claim 2 wherein the arrangement said first end portions of said contact fingers match the geometry of a plurality of contacting pads on a device under test.

4. The probe of claim 1 wherein said integrated tip assembly includes a tab located nearer said first end portions of said plurality of contact fingers than said second end portions that maintains said contact fingers in said predetermined alignment.

5. The probe of claim 1 wherein said rigid support includes a respective trace for each of said connection sites.

6. The probe of claim 5 wherein said respective traces are electrically interconnected to a connector suitable to interconnect to test equipment.

7. The probe of claim 1 wherein said plurality of contact fingers is greater than three.

8. The probe of claim 1 wherein said additional electrical elements are interconnected to said contact fingers.

9. The probe of claim 8 wherein said support includes a base and a planar circuit board inclined with respect to said base.