System for fault determinations for high frequency electronic circuits

• US 7,496,466 B2
• Filed: 01/19/2007
• Issued: 02/24/2009
• Est. Priority Date: 01/19/2007
• Status: Active Grant

• Current Assignee: Huntron, Inc.
• Original Assignee: Huntron, Inc.
• Inventors: Farkas, Alexander T.
• Primary Examiner(s): Feliciano; Eliseo Ramos
• Assistant Examiner(s): HENSON, MISCHITA L
• Application Number:
  US11/625,175
• Publication Number:
  US 20080177486A1
• Time in Patent Office: 767 Days
• Field of Search: 702/57, 702/58, 702/59, 702/75, 702/76, 702/77, 702/117, 702/124, 702/125, 702/185, 324/529, 324/530, 324/537, 324/750, 324/632, 324/513, 324/754
• US Class Current: 702/117
• CPC Class Codes: G01R 31/2806 Apparatus therefor, e.g. test stations, drivers, analysers, conveyors G01R31/2805, G01R31/281, G01R31/2818 take precedence
• CPC Class Codes: G01R 31/304 of printed or hybrid circuits G01R31/305 - G01R31/315 take precedence

Abstract

A positioning system is provided for mounting a circuit board or device to be tested, and for mounting a sensor assembly, the positioning system having the capability of moving the sensor assembly in three dimensions. The sensor assembly is positioned on the mounting assembly such that it is not in contact with the circuit board under test. The sensor assembly in operation samples the electromagnetic field emanating from the circuit under test and converts those signals into a representative electrical signal in a digitized format. A processing system compares the measured values from the sensor assembly with reference values from the same point in a circuit known to be good and provides an indication to the user as to whether the difference therebetween is within an acceptable range or outside thereof.

Claims

1. A system for making fault determinations in high frequency circuits, comprising:

a positioning system for fixedly mounting a circuit board or device having circuit elements thereon to be tested and for mounting a sensor assembly, said positioning system capable of moving the sensor in X, Y and Z dimensions relative to the circuit board;

a control system for the positioning system for registering the position of the sensor assembly relative to the circuit board to be tested and for moving the sensor assembly to selected known locations for the circuit board to be tested;

a sensor assembly for obtaining electromagnetic signals emanating from circuit elements on the circuit board at said selected known locations and for converting said electromagnetic signals into a measured signal value representative of the electromagnetic signals in a digitized format,

wherein the circuit board under test is operating with a normal power input or stimulus signals and the circuit board being tested is in a typical operating mode and

said sensor assembly is mounted on the positioning system above the circuit board to be tested such that it does not come into physical contact with said circuit board during the testing of the circuit board; and

a processing system for comparing measured signal values from the sensor assembly at selected known locations for the circuit board to be tested and reference signal values from the same locations in a similar circuit board known to be good and for providing an information display concerning whether or not the difference between the measured signal values and the reference signal values is within a selected acceptable range, or outside thereof, which is indicative of a fault at said selected location.

2. The system of claim 1, wherein the information display includes a graphical, tabular or pass/fail indication of a fault at said location.

3. The system of claim 1, wherein the sensor assembly includes a transducer responsive to the electromagnetic signals, producing a representative signal corresponding thereto, a circuit for filtering, attenuating and/or amplifying the representative signal, a mixer responsive to the representative signal, a programmable oscillator to provide sum and difference frequencies and an analog to digital converter responsive to a difference frequency signal to produce a corresponding digitized signal for processing by the processing system.

4. The system of claim 1, wherein the sensor assembly is registered to the circuit board by assigning an XY sensor assembly location to a known position of the circuit board under test.

5. The system of claim 3, wherein the difference frequency signal produced by the sensor assembly is on the order of 10 MHz or less.

6. The system of claim 2, wherein the information display includes a graphical overlay on a representation of a portion of the circuit board to be tested, with indications at selected locations therein as to whether or not measurements at those locations indicate a fault.

7. The system of claim 1, wherein the high frequency circuits are operating at frequencies greater than 200 MHz.

8. The system of claim 1, including means for applying a stimulus signal of pre-selected characteristics to the high frequency circuit under test, wherein the resulting electromagnetic field is measured at said selected locations relative to the high frequency circuit.

9. The system of claim 1, wherein the control system operates such that the sensor assembly receives electromagnetic signals and provides measured values covering a selected area of the circuit board under test.

10. The system of claim 1, wherein the control system operates such that the sensor assembly receives electromagnetic signals and provides measured values only at selected locations in the selected area of the circuit board under test.