LED and LED lamp

• US 7,497,596 B2
• Filed: 12/30/2002
• Issued: 03/03/2009
• Est. Priority Date: 12/29/2001
• Status: Expired due to Fees

• Current Assignee: Mane Lou
• Original Assignee: Mane Lou
• Inventors: Ge, Shichao
• Primary Examiner(s): Sember; Thomas M
• Application Number:
  US10/500,315
• Publication Number:
  US 20050068776A1
• Time in Patent Office: 2,255 Days
• Field of Search: 362/247, 362/294, 362/373, 362/470, 362/471, 362/555, 362/800, 257/81, 257/99, 257/100
• US Class Current: 362/294
• CPC Class Codes: F21K 9/232 specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
• CPC Class Codes: F21V 29/505 of reflectors
• CPC Class Codes: F21V 29/75 with fins or blades having different shapes, thicknesses or spacing
• CPC Class Codes: F21V 29/76 with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
• CPC Class Codes: F21V 29/78 with helically or spirally arranged fins or blades
• CPC Class Codes: F21V 3/00 Globes; Bowls; Cover glasses with refracting properties F21V5/00; with reflecting properties F21V7/00; characterised by cooling arrangements F21V29/506
• CPC Class Codes: F21V 7/06 with parabolic curvature
• CPC Class Codes: F21W 2111/02 for roads, paths or the like
• CPC Class Codes: F21Y 2107/00 Light sources with three-dimensionally disposed light-generating elements
• CPC Class Codes: F21Y 2113/13 comprising an assembly of point-like light sources
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: G02B 6/0031 Reflecting element, sheet or layer
• CPC Class Codes: G02B 6/0073 Light emitting diode [LED]
• CPC Class Codes: G02B 6/0085 Means for removing heat created by the light source from the package heat extraction or cooling elements for semiconductor light sources in general H01L33/64
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/8592 Applying permanent coating, e.g. protective coating
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 33/62 : Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H01L 33/642 : characterized by the shape
• CPC Class Codes: Y10S 362/80 : Light emitting diode

Abstract

This invention relates to a light emitting diode (LED) and a LED lamp consisted of LEDs. The LED comprises at least one LED chip. The LED is mounted on a high heat conductivity base and is connected to an applied power supply through a circuit board. The LED chip also has a transparent medium layer on it. The base top surface acts as a light reflective surface, or a light reflective surface is provided around the base, the LED comprises a screw extended downwards from the base bottom or a screw hole in the base bottom to connect the LED to a heat sink mechanically. The LED is electrically connected to a driving circuit through its outgoing wires. The driving circuit is in turn electrically connected to an electrical connector through its housing. A LED lamp can be fabricated after the LED is enclosed in a transparent bulb housing. The LED has high efficiency, high power and long lifetime and can be used to fabricate LED traffic lamps, LED plane light sources, etc.

Claims

1. An LED lamp including at least one LED, comprising:

a heat sink;

at least one LED mechanically connected to the heat sink through screws or screw holes on or in a base bottom of the LED;

a driving circuit including an electrical connector, to which outgoing leads of the LEDs are connected; and

a transparent bulb housing mounted over the LED;

wherein the LED includes at least one LED chip directly mounted on a base of high heat connectivity;

wherein the LED chip is electrically connected to an applied power supply through a circuit board and the LED chip has a transparent medium layer disposed thereon;

wherein a base top surface is a light reflective surface or a light reflective surface is disposed around the base;

wherein the circuit board is disposed on the base; and

wherein the base is a metal base and a screw mechanically connects the heat sink to a bottom surface of the metal base.

2. The LED lamp according to claim 1, wherein, the electrical connector is a double-leg bayonet lamp head, multi-leg bayonet lamp head or a screw lamp head.

3. The LED lamp according to claim 1, wherein, the transparent housing is a transparent, colored or scattering bulb housing made of glass or plastic.

4. The LED lamp according to claim 1, wherein, a light converting material layer is coated on the inner surface of the bulb housing.

5. The LED lamp according to claim 1, wherein, the heat sink has heat dispersing flanges on it.

6. The LED lamp of claim 5, wherein, the heat sink has a plurality of gyroidal heat dispersing flanges.

7. The LED lamp according to claim 5, wherein, the inner surface of the heat sink is a light reflection surface.

8. The LED lamp according to claim 7, wherein, the inner surface is cylindrocanical or parabolic.