Method for manufacturing substrate with cavity
First Claim
1. A method for manufacturing a substrate, the substrate having a cavity, the method comprising:
- (a) forming a barrier around a predetermined area where the cavity is to be formed on a copper foil laminated master, an internal circuit formed in the copper foil laminated master;
(b) coating a thermosetting material in the area where the cavity is to be formed;
(c) laminating a dielectric layer and a copper foil layer on the copper foil laminated master, on which the thermosetting material is coated;
(d) pressing the laminated dielectric layer and copper foil layer using a press plate, on which a protruded part is formed in an area corresponding to the area where the cavity is to be formed;
(e) forming an external circuit pattern in the upper part of the laminated dielectric layer; and
(f) dissolving the coated thermosetting material using a solvent and forming the cavity.
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Accused Products
Abstract
A method for manufacturing a substrate having a cavity which includes forming a barrier around a predetermined area where the cavity is to be formed on a copper foil laminated master, an internal circuit formed in the copper foil laminated master; coating a thermosetting material in the area where the cavity is to be formed; laminating a dielectric layer and a copper foil layer on the copper foil laminated master, on which the thermosetting material is coated; pressing the laminated dielectric layer and copper foil layer using a press plate, on which a protruded part is formed in an area corresponding to the area where the cavity is to be formed; forming an external circuit pattern in the upper part of the laminated dielectric layer; and dissolving the coated thermosetting material using a solvent and forming the cavity.
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Citations
6 Claims
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1. A method for manufacturing a substrate, the substrate having a cavity, the method comprising:
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(a) forming a barrier around a predetermined area where the cavity is to be formed on a copper foil laminated master, an internal circuit formed in the copper foil laminated master; (b) coating a thermosetting material in the area where the cavity is to be formed; (c) laminating a dielectric layer and a copper foil layer on the copper foil laminated master, on which the thermosetting material is coated; (d) pressing the laminated dielectric layer and copper foil layer using a press plate, on which a protruded part is formed in an area corresponding to the area where the cavity is to be formed; (e) forming an external circuit pattern in the upper part of the laminated dielectric layer; and (f) dissolving the coated thermosetting material using a solvent and forming the cavity. - View Dependent Claims (2, 3, 4, 5, 6)
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Specification