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Manufacturing method for semiconductor device, semiconductor device, and electronic apparatus

  • US 7,498,661 B2
  • Filed: 05/30/2006
  • Issued: 03/03/2009
  • Est. Priority Date: 03/25/2003
  • Status: Expired due to Term
First Claim
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1. A semiconductor device comprising:

  • a thinned substrate having an active surface side on which electronic circuits are formed and a back surface side opposite the active surface side; and

    connecting terminals that serve as external electrodes for the electronic circuits, the connecting terminals passing through the substrate from the active surface side to the back surface side;

    wherein distal ends of the connecting terminals at the back surface side of the substrate have a plurality of surface undulations which comprise one of;

    a plurality of convex outward surfaces; and

    a plurality of concave inward surfaces, andwherein the connecting terminals respectively include a first part and a second part, the first part being directly connected to the electronic circuits, the second part passing through the substrate, the first part and the second part consisting of the same metal and forming a unit.

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