Probe station with low inductance path

• US 7,498,828 B2
• Filed: 06/20/2007
• Issued: 03/03/2009
• Est. Priority Date: 11/25/2002
• Status: Expired due to Fees

• Current Assignee: FormFactor Beaverton, Inc. (FormFactor Incorporated)
• Original Assignee: Cascade Microtech Incorporated (FormFactor Incorporated)
• Inventors: Cowan, Clarence E., Dunklee, John
• Primary Examiner(s): Nguyen; Ha Tran T
• Assistant Examiner(s): Chan; Emily Y
• Application Number:
  US11/820,518
• Publication Number:
  US 20070247178A1
• Time in Patent Office: 622 Days
• Field of Search: 324754-765, 324/158.1
• US Class Current: 324/756.01
• CPC Class Codes: G01R 31/2851 Testing of integrated circuits [IC] G01R31/317 takes precedence; testing individual devices G01R31/26; testing printed circuits G01R31/2801
• CPC Class Codes: G01R 31/2886 Features relating to contacting the IC under test, e.g. probe heads; chucks G01R31/2865 takes precedence, test connections, e.g. test sockets, or probes per se, G01R1/04 or G01R1/06
• CPC Class Codes: G01R 31/2887 involving moving the probe head or the IC under test; docking stations moving single probes G01R1/06705; moving individual probes in multiple probes G01R1/07392

Abstract

A probe assembly suitable for high-current measurements of an electrical device.

Claims

1. A probe assembly for probing an electrical device, said probe assembly comprising:

(a) a chuck having a first conductive member suitable for supporting an electrical device; and

(b) a second conductive member spaced apart from said chuck, wherein said electrical device is spaced between said first conductive member and said second conductive member, wherein said first conductive member is electrically interconnected to said second conductive member, wherein said first conductive member and said second conductive member are electrically connected to the same potential.

2. The probe assembly of claim 1 wherein said second conductive member is electrically interconnected to a test signal of said electrical device.

3. The probe assembly of claim 1 wherein said first conductive member comprises a first plate, said second conductive member comprises a second plate, and wherein said second conductive member is spaced further distant from said electrical device than said first conductive member.

4. The probe assembly of claim 1 wherein said second conductive member comprises a second plate and is vertically spaced apart from said first conductive member.

5. The probe assembly of claim 1 wherein said second conductive member is electrically interconnected to said first conductive member completely within an environmental chamber.

6. The probe assembly of claim 1 wherein said second conductive member is free from being supported by said chuck.

7. The probe assembly of claim 1 wherein said first conductive member is electrically interconnected to a first probe, wherein said second conductive member is electrically interconnected to a second probe.

8. The probe assembly of claim 1 wherein said first conductive member and said second conductive member are electrically interconnected to a first probe.

9. The probe assembly of claim 1 wherein said first probe is electrically interconnected to test instrumentation using a twisted pair of wires over at least 50% of the distance between said first probe and said test instrumentation.

10. The probe assembly of claim 1 further comprising a detachable substantially closed loop member engageable with said first conductive member and said second conductive member, where said loop member includes a flexible member interconnecting said first conductive member and said second conductive member.