Lithographic apparatus and device manufacturing method, an integrated circuit, a flat panel display, and a method of compensating for cupping

• US 7,499,146 B2
• Filed: 10/19/2005
• Issued: 03/03/2009
• Est. Priority Date: 03/14/2005
• Status: Expired due to Fees

• Current Assignee: ASML Holding NV, ASML Netherlands BV (ASML Holding NV), Avago Technologies International Sales Pte Limited (Broadcom, Inc.)
• Original Assignee: ASML Holding NV, ASML Netherlands BV (ASML Holding NV), LSI Logic Corporation (Broadcom, Inc.)
• Inventors: Baselmans, Johannes Jacobus Matheus, Bleeker, Arno Jan, Troost, Kars Zeger, Callan, Neal, Eib, Nicholas K., Markoya, Louis
• Primary Examiner(s): Lee; Diane
• Assistant Examiner(s): NGUYEN, HUNG
• Application Number:
  US11/252,877
• Publication Number:
  US 20060203220A1
• Time in Patent Office: 1,231 Days
• Field of Search: 355/53, 355/55, 355/67, 359291-292
• US Class Current: 355/67
• CPC Class Codes: G03F 7/70275 Multiple projection paths, e.g. array of projection systems, microlens projection systems or tandem projection systems
• CPC Class Codes: G03F 7/70291 Addressable masks, e.g. spatial light modulators [SLMs], digital micro-mirror devices [DMDs] or liquid crystal display [LCD] patterning devices
• CPC Class Codes: G03F 7/70358 Scanning exposure, i.e. relative movement of patterned beam and workpiece during imaging

Abstract

The tilt and position of individually controllable element are simultaneously adjusted to allow a greater range of contrasts to be achieved. This can also be used to compensate for cupping of individually controllable elements. Simultaneous adjustment of both the position and tilt of the individually controllable elements can be achieved by two electrodes operable over a range of values.

Claims

1. A lithographic apparatus, comprising:

an illumination system configured to condition a radiation beam;

a first patterning array in a plurality of patterning arrays, the first patterning array comprising an array of individually controllable elements configured to modulate the radiation beam and an adjusting device configured to individually adjust a linear position and tilt of each of the individually controllable elements; and

a projection system configured to project the modulated beam onto a target portion of a substrate.

2. The lithographic apparatus of claim 1, wherein the linear position of the individually controllable elements is adjustable in a direction perpendicular to a plane in which the array of individually controllable elements lies.

3. The lithographic apparatus of claim 1, wherein the adjusting device is configured to adjust within a range of linear position adjustments of at least a wavelength λ

of the beam of radiation.

4. The lithographic apparatus of claim 1, wherein the adjusting device is configured to tilt within an angle range of at least 3λ

/2L rad, wherein L is a length of the individually controllable element and λ

is a wavelength of the beam of radiation.

5. The lithographic apparatus of claim 1, wherein the adjusting device is configured to simultaneously adjust a linear position within a range of λ

, a wavelength of the beam of radiation, and to adjust the tilt over an angle range of λ

/L rad.

6. The lithographic apparatus of claim 1 wherein a single control signal is configured to control the adjusting device, such as to maximize a range of intensities generated by each of the individually controllable elements.

7. The lithographic apparatus of claim 1, wherein:

each of the individually controllable elements comprise a hinge line that lies in a plane of the individually controllable element, the hinge line dividing the individually controllable element into two parts; and

the lithographic apparatus further comprises two electrodes, wherein each of the electrodes is configured to adjust the tilt of the individually controllable element over a range of at least three values and each of the electrodes is arranged opposite from a different part of each of the individually controllable element.

8. The lithographic apparatus of claim 7, wherein the two electrodes are positioned opposite from a same face of the individually controllable element.

9. The lithographic apparatus of claim 7, further comprising:

a memory configured to store compensation values applied to the adjusting device, wherein the compensation values are used to compensate for each degree of non-planarity of the individually controllable element by changing the linear position of the individually controllable element using the electrodes.

10. The lithographic apparatus of claim 1, wherein at least one of the individually controllable elements comprises a hinge line in a plane of the individually controllable element, a portion of the individually controllable element removed along the hinge line.

11. The lithographic apparatus of claim 1, wherein:

each of the individually controllable elements comprises a hinge in a plane of the individually controllable element; and

the lithographic apparatus further comprises an electrode configured to control a position of the hinge.

12. The lithographic apparatus of claim 1, further comprising two electrodes, wherein at least one of the electrodes is configured to adjust the tilt of each of the individually controllable elements over a range of at least three values, and each electrode is arranged opposite from a different part of each of the individually controllable elements.

13. The lithographic apparatus of claim 1, wherein:

each of the individually controllable elements comprise a hinge line in a plane of the individually controllable element, the hinge line dividing the individually controllable element into two parts; and

the lithographic apparatus further comprises two electrodes, each electrode configured to adjust the tilt of each of the individually controllable elements over a range of at least three values, and each electrode arranged opposite from a different part of each of the individually controllable elements.

19. The lithographic apparatus of claim 1, wherein the adjusting device is configured to simultaneously adjust the linear position and tilt of each of the individually controllable elements.

14. A patterning array, comprising:

a first patterning array in a plurality of patterning arrays, the first patterning array comprising an array of individually controllable elements configured to modulate a radiation beam; and

an adjusting device configured to individually adjust a linear position and tilt of each of the individually controllable elements.

15. The patterning array of claim 14, wherein:

each of the individually controllable elements comprise a hinge line in a plane of the individually controllable element, the hinge line dividing the individually controllable element into two parts; and

the adjusting device further comprises two electrodes, wherein each electrode is configured to adjust the tilt of each of the individually controllable element over a range of at least three values, and each electrode is arranged opposite from a different part of each of the individually controllable element.

16. The patterning array of claim 14, wherein at least one of the individually controllable elements comprise a hinge line in a plane of the individually controllable element, a portion of the individually controllable element removed along the hinge line.

17. A device manufacturing method, comprising:

modulating a beam of radiation using a first patterning array in a plurality of patterning arrays, the first patterning array comprising an array of individually controllable elements;

projecting the modulated beam of radiation onto a substrate; and

individually adjusting a linear position and tilt of each of the individually controllable elements.

18. The method of claim 17, wherein the position and tilt of each of the individually controllable elements are adjusted using two electrodes, each of the electrodes operable over a range of values.