Assembly comprising a functional device and a resonator and method of making same

• US 7,500,610 B1
• Filed: 11/07/2005
• Issued: 03/10/2009
• Est. Priority Date: 11/08/2004
• Status: Expired due to Fees

• Current Assignee: RUIZHANG TECHNOLOGY LIMITED COMPANY
• Original Assignee: Alien Technology Corporation
• Inventors: Hadley, Mark A., Smith, John Stephen, Carrender, Curt L., Craig, Gordon S. W.
• Primary Examiner(s): Lee, Michael G.
• Assistant Examiner(s): Haupt, Kristy A.
• Application Number:
  US11/269,400
• Time in Patent Office: 1,219 Days
• Field of Search: 235/451, 235/492, 340/572.1, 340/572.5, 340/572.7, 340/572.8
• US Class Current: 235/451
• CPC Class Codes: G06K 19/07718 the record carrier being manufactured in a continuous process, e.g. using endless rolls
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/07752 using an interposer
• CPC Class Codes: G06K 19/07756 the connection being non-galvanic, e.g. capacitive
• CPC Class Codes: H01L 2223/6677 for antenna, e.g. antenna included within housing of semiconductor device antennas per se H01Q
• CPC Class Codes: H01L 2224/04105 Bonding areas formed on an encapsulation of the semiconductor or solid-state body, e.g. bonding areas on chip-scale packages
• CPC Class Codes: H01L 2224/20 Structure, shape, material or disposition of high density interconnect preforms
• CPC Class Codes: H01L 2224/24227 the HDI interconnect not connecting to the same level of the item at which the semiconductor or solid-state body is mounted, e.g. the semiconductor or solid-state body being mounted in a cavity or on a protrusion of the item
• CPC Class Codes: H01L 2224/76155 Jetting means, e.g. ink jet
• CPC Class Codes: H01L 2224/82 by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI]
• CPC Class Codes: H01L 2224/82102 using jetting, e.g. ink jet
• CPC Class Codes: H01L 2224/83136 involving guiding structures, e.g. spacers or supporting members
• CPC Class Codes: H01L 2224/83851 being an anisotropic conductive adhesive
• CPC Class Codes: H01L 2224/95085 being a liquid, e.g. for fluidic self-assembly
• CPC Class Codes: H01L 2224/95122 by applying vibration
• CPC Class Codes: H01L 2224/95136 involving guiding structures, e.g. shape matching, spacers or supporting members
• CPC Class Codes: H01L 2224/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 23/66 High-frequency adaptations
• CPC Class Codes: H01L 24/19 Manufacturing methods of high density interconnect preforms
• CPC Class Codes: H01L 24/24 of an individual high density interconnect connector
• CPC Class Codes: H01L 24/83 : using a layer connector
• CPC Class Codes: H01L 24/95 : at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
• CPC Class Codes: H01L 24/97 : the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 25/50 : Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00 H01L21/50 takes precedence
• CPC Class Codes: H01L 29/0657 : characterised by the shape of the body
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00011 : Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01015 : Phosphorus [P]
• CPC Class Codes: H01L 2924/0102 : Calcium [Ca]
• CPC Class Codes: H01L 2924/01023 : Vanadium [V]
• CPC Class Codes: H01L 2924/01024 : Chromium [Cr]
• CPC Class Codes: H01L 2924/01027 : Cobalt [Co]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/01055 : Cesium [Cs]
• CPC Class Codes: H01L 2924/01057 : Lanthanum [La]
• CPC Class Codes: H01L 2924/01074 : Tungsten [W]
• CPC Class Codes: H01L 2924/01075 : Rhenium [Re]
• CPC Class Codes: H01L 2924/01077 : Iridium [Ir]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/10158 : at the passive surface
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/15153 : the die mounting substrate comprising a recess for hosting the device
• CPC Class Codes: H01L 2924/15155 : the shape of the recess being other than a cuboid
• CPC Class Codes: H01L 2924/15157 : Top view
• CPC Class Codes: H01L 2924/15165 : Monolayer substrate
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H01L 2924/19042 : being an inductor
• CPC Class Codes: H01L 2924/19043 : being a resistor
• CPC Class Codes: H01L 2924/30105 : Capacitance
• CPC Class Codes: H01L 2924/30107 : Inductance
• CPC Class Codes: H01L 2924/3011 : Impedance
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding
• CPC Class Codes: Y10T 29/53178 : Chip component

Abstract

A Radio Frequency Identification (RFID) device. The RFID device comprises an antenna assembly and a resonator assembly. The antenna assembly comprises a first substrate and an antenna element. The resonator assembly comprises a second substrate having an integrated circuit connected to a resonator loop. The first substrate and the second substrate are attached to one another. The integrated circuit electrically couples to the antenna element without a direct mechanical contact.

Claims

1. A device comprising:

an antenna assembly comprising a first substrate and an antenna element; and

a resonator assembly comprising a second substrate having a resonator loop coupled to an integrated circuit, wherein said resonator assembly further comprises a third substrate having said integrated circuit embedded therein, wherein said resonator loop is formed on said second substrate, and wherein said third substrate is coupled to said second substrate such that an electrical interconnection is formed from said integrated circuit to said resonator loop,

wherein said second substrate is attached to said first substrate and wherein said integrated circuit is electrically coupled to said antenna element by said resonator loop, said resonator loop lacking direct electrical contact with said antenna.

2. The device of claim 1 wherein said device is an RFID device.

3. The device of claim 1 wherein said integrated circuit is inductively connected to said antenna element.

4. The device of claim 1 wherein said integrated circuit is capacitively connected to said antenna element.

5. The device of claim 1 wherein said antenna assembly further comprising at least two antenna elements electrically isolated from one another and wherein each one of said antenna elements includes at least a portion that is capacitively coupled to said resonator loop.

6. The device of claim 1 wherein said resonator loop is placed in proximity and not in physical contact with said antenna element for an inductive coupling between said integrated circuit and said antenna element.

7. The device of claim 1 wherein said resonator loop includes a portion that overlaps to a portion of said antenna element for an inductive coupling between said integrated circuit and said antenna element.

8. The device of claim 1 wherein said resonator loop has a double-loop configuration.

9. The device of claim 1 wherein said antenna assembly is attached to or at least is part of a packaging of an item.

10. A method for forming an RFID device, the method comprising:

forming an antenna on a first substrate;

forming a resonator assembly, said resonator assembly comprising a second substrate having an integrated circuit connected to a resonator loop, wherein said resonator assembly is formed on a continuous web process line that includes a Fluidic-Self Assembly process to deposit said integrated circuit into said second substrate; and

electrically coupling said antenna to said integrated circuit by one of inductive coupling and capacitive coupling with said resonator loop, said resonator loop lacking direct contact with said antenna.

11. A device comprising:

an antenna assembly comprising a first substrate and an antenna element; and

a resonator assembly comprising a second substrate having a resonator loop coupled to an integrated circuit, wherein said resonator assembly further comprises a third substrate having said integrated circuit embedded therein using a Fluidic-Self Assembly process, wherein said resonator loop is formed on said second substrate, and wherein said third substrate is coupled to said second substrate such that an electrical interconnection is formed from said integrated circuit to said resonator loop, and wherein pad conductors are provided on said third substrate to interconnect said integrated circuit to said resonator loop,

wherein said second substrate is attached to said first substrate and wherein said integrated circuit is electrically coupled to said antenna element by said resonator loop, said resonator loop lacking direct electrical contact with said antenna.

12. A device comprising:

an antenna assembly comprising a first substrate and an antenna element; and

a resonator assembly comprising a second substrate having a resonator loop coupled to an integrated circuit,

wherein said second substrate is attached to said first substrate and wherein said integrated circuit is electrically coupled to said antenna element by said resonator loop, said resonator loop lacking direct electrical contact with said antenna and wherein said second substrate further comprises a receptor formed to receive said integrated circuit deposited therein, wherein said substrate having formed thereon pad conductors connecting said integrated circuit to said resonator loop, and wherein said resonator loop is formed on a surface of said second substrate.

13. A device comprising:

an antenna assembly comprising a first substrate and an antenna element; and

a resonator assembly comprising a second substrate having a resonator loop coupled to an integrated circuit, wherein said resonator assembly further comprises a receptor site in said second substrate, said integrated circuit being at least partially embedded within said receptor site,

wherein said second substrate is attached to said first substrate and wherein said integrated circuit is electrically coupled to said antenna element by said resonator loop, said resonator loop lacking direct electrical contact with said antenna.