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Light emitting diode package with diffuser and method of manufacturing the same

  • US 7,501,656 B2
  • Filed: 07/25/2006
  • Issued: 03/10/2009
  • Est. Priority Date: 07/26/2005
  • Status: Active Grant
First Claim
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1. A light emitting diode package comprising:

  • a substrate with an electrode formed thereon;

    a light emitting diode chip mounted on the substrate;

    an encapsulant applied around the light emitting diode chip, the encapsulant containing a diffuser; and

    a lens part disposed on the light emitting diode chip and the encapsulant to radiate light in a wide angle,whereby light from the light emitting diode chip is emitted out of the package without distortion.

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