Upper-layer metal power standard cell
First Claim
1. A standard cell which is used for providing a desired logical function with a semiconductor integrated circuit chip, the standard cell being placement information of a layout pattern in which an optimum arrangement of a basic logical circuit is designed within a predetermined area by an arrangement of transistor elements and an arrangement of inner metal wires, and has a power layer disposed at an upper-layer in the inner metal wires, and in which an upper-layer metal power standard cell comprises a basic power metal layer which is disposed in an upper layer of a circuit and which supplies a power voltage from an outside of the upper-layer metal power standard cell;
- a transistor element layer which is formed in a predetermined arrangement on a circuit substrate under the basic power metal layer; and
an inner wire layer which supplies the power voltage to the transistor element layer disposed under the basic power metal layer disposed in the upper layer from the basic power metal layer,wherein the basic power metal layer, the transistor element layer and the inner wire layer constitute the standard cell,wherein the transistor element layer and the inner wire layer form an underlayer in which the transistor element layer and the inner wire layer are formed as an optimized standard cell being placement information of a layout pattern which is designed by repeating several times a predetermined processing of a compaction or resizing, andwherein the underlayer includes a plurality of compacted or resized transistor elements are formed on the circuit substrate.
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Accused Products
Abstract
An upper-layer metal power standard cell comprises: a basic power metal layer which is disposed in an upper layer of a circuit and which supplies a power voltage from an outside of the upper-layer metal power standard cell; a transistor element layer which is formed in a predetermined arrangement on a circuit substrate under the basic power metal layer; and an inner wire layer which supplies the power voltage to the transistor element layer disposed under the basic power metal layer disposed in the upper layer from the basic power metal layer.
17 Citations
19 Claims
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1. A standard cell which is used for providing a desired logical function with a semiconductor integrated circuit chip, the standard cell being placement information of a layout pattern in which an optimum arrangement of a basic logical circuit is designed within a predetermined area by an arrangement of transistor elements and an arrangement of inner metal wires, and has a power layer disposed at an upper-layer in the inner metal wires, and in which an upper-layer metal power standard cell comprises a basic power metal layer which is disposed in an upper layer of a circuit and which supplies a power voltage from an outside of the upper-layer metal power standard cell;
- a transistor element layer which is formed in a predetermined arrangement on a circuit substrate under the basic power metal layer; and
an inner wire layer which supplies the power voltage to the transistor element layer disposed under the basic power metal layer disposed in the upper layer from the basic power metal layer,wherein the basic power metal layer, the transistor element layer and the inner wire layer constitute the standard cell, wherein the transistor element layer and the inner wire layer form an underlayer in which the transistor element layer and the inner wire layer are formed as an optimized standard cell being placement information of a layout pattern which is designed by repeating several times a predetermined processing of a compaction or resizing, and wherein the underlayer includes a plurality of compacted or resized transistor elements are formed on the circuit substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15)
- a transistor element layer which is formed in a predetermined arrangement on a circuit substrate under the basic power metal layer; and
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16. A standard cell which is used for providing a desired logical function with a semiconductor integrated circuit chip, the standard cell being placement information of a layout pattern in which an optimum arrangement of a basic logical circuit is designed by an arrangement of transistor elements and an arrangement of inner metal wires within a predetermined area, and the standard cell has a basic power layer at an upper-layer in the inner metal wires,
wherein the semiconductor integrated circuit chip comprises a plurality of upper-layer power metal standard cells which constitute a plurality of parts of the semiconductor integrated circuit, wherein each of the plurality of the upper-layers comprises a semiconductor substrate as a circuit substrate of the standard cell, an underlayer formed on the semiconductor substrate, and an upper-layer power metal layer formed on the underlayer and supplying a power voltage from an outside of the standard cell, wherein the underlayer comprises a transistor element layer and an inner wire layer, in which a plurality of transistor elements and inner wires is arranged according to circuit layout information synthesized to be designed as a certain standard cell, and an entire size of the certain standard cell and other standard cell is optimized by compacting both the standard cells in a manner of conforming the circuit layout information of the certain standard cell to a circuit layout information of the other standard cell which constitutes the semiconductor integrated circuit chip, and wherein the upper-layer power metal layer has a size designed to coincide with a size of the underlayer which is designed to an optimized size by compacting a respective standard cell.
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18. A standard cell which is used for providing a desired logical function with a semiconductor integrated circuit chip, the standard cell being placement information of a layout pattern in which an optimum arrangement of a basic logical circuit is designed by an arrangement of transistor elements and an arrangement of inner metal wires within a predetermined area, and the standard cell has a basic power layer at an upper-layer in the inner metal wires,
wherein the semiconductor integrated circuit chip comprises a plurality of upper-layer power metal standard cells which constitute a plurality of parts of the semiconductor integrated circuit, wherein each of the plurality of the upper-layers comprises a semiconductor substrate as a circuit substrate of the standard cell, an underlayer formed on the semiconductor substrate, and an upper-layer power metal layer formed on the underlayer and supplying a power voltage from an outside of the standard cell, wherein the underlayer comprises a transistor element layer and an inner wire layer, in which a plurality of transistor elements and inner wires are arranged according to circuit layout information synthesized to be designed as a certain standard cell, and an entire size of the certain standard cell and other standard cell is optimized by resizing both the standard cells in a manner of conforming the circuit layout information of the certain standard cell to a circuit layout information of the other standard cell which constitutes the semiconductor integrated circuit chip, and the upper-layer power metal layer has a size designed to coincide with a size of the underlayer which is designed to an optimized size by resizing in a respective standard cell.
Specification