Acoustic transducer module

• US 7,501,703 B2
• Filed: 02/26/2004
• Issued: 03/10/2009
• Est. Priority Date: 02/28/2003
• Status: Active Grant

• Current Assignee: Knowles Electronics Llc (Knowles Corporation)
• Original Assignee: Knowles Electronics Llc (Knowles Corporation)
• Inventors: Minervini, Anthony D.
• Primary Examiner(s): Chambliss; Alonzo
• Application Number:
  US10/788,181
• Publication Number:
  US 20040184632A1
• Time in Patent Office: 1,839 Days
• Field of Search: None
• US Class Current: 257/730
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H04R 1/028 associated with devices performing functions other than acoustics, e.g. electric candles
• CPC Class Codes: H04R 19/005 using semiconductor materials
• CPC Class Codes: H04R 19/04 Microphones H04R19/01 takes precedence
• CPC Class Codes: H04R 2499/11 Transducers incorporated or for use in hand-held devices, e.g. mobile phones, PDA's, camera's

Abstract

A module (100, 200, 300, 400, 500, 600) may be electrically connected to a PCB (18) residing in a device (14) or may be joined to the device (14) to form a portion of the housing (16) of the device (14). The module includes a housing (102, 202, 302, 402, 502, 602) having at least one layer, a surface mountable component, such as a surface mountable acoustic transducer (110, 210, 310, 410, 510, 610) having a connecting surface (114, 214, 314, 414, 514, 614) disposed within the housing (102, 202, 302, 402, 502, 602), and at least one acoustic port (124, 224, 324, 424, 524, 624) formed on a surface of the housing (102, 202, 302, 402, 502, 602). The module (100, 200, 300, 400, 500, 600) may further include a secondary mounting structure (654) electrically connected to the connecting surface (114, 214, 314, 414, 514, 614) of the surface mountable acoustic transducer (110, 210, 310, 410, 510, 610). The acoustic port (124, 224, 324, 424, 524, 624) may include a layer of an environmental barrier (450, 550).

Claims

1. An acoustic transducer module comprising:

a housing;

a surface mountable acoustic transducer disposed within the housing, the surface mountable acoustic transducer having a connecting surface configured to engage a retaining structure formed as a portion of the housing adjacent the connecting surface, a relief structure within the housing having a size to receive an extension portion of a printed circuit board of an electronic device; and

at least one acoustic pathway coupling a surface of the surface mountable acoustic transducer to an exterior portion of the housing.

2. The acoustic transducer module of claim 1, wherein the surface mountable acoustic transducer is received within a chamber formed within the housing and secured therein.

3. The acoustic transducer module of claim 2, wherein the surface mountable acoustic transducer is secured by one of:

mechanical fasteners, friction and mutually engaging mechanical element.

4. The acoustic transducer module of claim 2, wherein the surface mountable acoustic transducer is secured by bonding.

5. The acoustic transducer module of claim 1, wherein the surface mountable acoustic transducer is in situ molded within the housing.

6. The acoustic transducer module of claim 1, wherein the housing comprises a first housing member and a second housing member.

7. The acoustic transducer module of claim 6, wherein the first housing member comprises an inner housing layer and the second housing member comprises an outer housing layer.

8. The acoustic transducer module of claim 7, comprising an intermediate layer disposed between the first housing layer and the second housing layer.

9. The acoustic transducer module of claim 8, wherein the first housing layer and the second housing layer are each non-conductive and the intermediate layer comprises a conductive layer.

10. The acoustic transducer module of claim 1, comprising a barrier disposed within the acoustic pathway.

11. The acoustic transducer module of claim 10, wherein the barrier comprises one of a polymeric material film and a sintered metal.

12. The acoustic transducer module of claim 1, wherein the surface mounted acoustic transducer comprises a miniature silicon condenser microphone.

13. The acoustic transducer module of claim 1, wherein an outer surface of the housing is aesthetically similar to an outer surface of an electronic device to which the acoustic transducer module is to be coupled.

14. An acoustic transducer module comprising:

a housing;

a surface mountable acoustic transducer disposed within the housing, the surface mountable acoustic transducer having a surface for electrically coupling the surface mounted acoustic transducer to a printed circuit board; and

at least one acoustic pathway for delivering acoustic energy and acoustically coupling a surface of the surface mountable acoustic transducer to an exterior portion of the housing;

wherein the housing comprises a retaining structure adjacent the connecting surface, the retaining structure sized to receive an extension portion of a printed circuit board of an electronic device.