Apparatus and methods for packaging dielectric resonator antennas with integrated circuit chips

• US 7,504,721 B2
• Filed: 01/19/2006
• Issued: 03/17/2009
• Est. Priority Date: 01/19/2006
• Status: Expired due to Fees

• Current Assignee: International Business Machines Corporation
• Original Assignee: International Business Machines Corporation
• Inventors: Chen, Zhi Ning, Zwick, Thomas M., Pfeiffer, Ullrich R., Gaucher, Brian P., Liu, Duixian
• Primary Examiner(s): Malsawma; Lex
• Assistant Examiner(s): HUBER, ROBERT T
• Application Number:
  US11/334,832
• Publication Number:
  US 20070164420A1
• Time in Patent Office: 1,153 Days
• Field of Search: 257/691, 257/687, 257/728, 257/787, 343/700, 343/873
• US Class Current: 257/724
• CPC Class Codes: H01L 2223/6677 for antenna, e.g. antenna included within housing of semiconductor device antennas per se H01Q
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/16245 the item being metallic
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 23/5227 Inductive arrangements or effects of, or between, wiring layers other inductive arrangements H01L23/645
• CPC Class Codes: H01L 25/16 the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/09701 Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/15311 being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/3011 Impedance
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding
• CPC Class Codes: H01P 7/10 Dielectric resonators
• CPC Class Codes: H01Q 1/2283 mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
• CPC Class Codes: H01Q 9/0485 Dielectric resonator antennas

Abstract

Apparatus and methods are provided for integrally packaging antenna devices with semiconductor IC (integrated circuit) chips, wherein IC chips are packaged with dielectric resonators antennas that are integrally constructed as part of a package molding (encapsulation) process, for example, to form compact integrated radio/wireless communications systems for millimeter wave applications.

Claims

1. An electronic package apparatus, comprising:

a package frame;

an IC (integrated circuit) chip mounted to a die paddle of the package frame, the IC chip having an antenna feed network formed on an active surface thereof electrically connecting the IC chip to package leads of the package frame;

a dielectric resonator antenna stacked on the active surface of the IC chip and aligned to a portion of the feed network; and

a package cover formed over the IC chip and the dielectric resonator antenna, wherein the dielectric resonator antenna has one surface that is exposed through the package cover, and wherein a portion of the package cover is disposed between the die paddle and the package leads.

2. The apparatus of claim 1, wherein the dielectric resonator antenna is formed by injection molding using a first dielectric material.

3. The apparatus of claim 2, wherein the package cover is an encapsulation material that is formed by injection molding using a second dielectric material, wherein the second dielectric material surrounds the first dielectric material.

4. The apparatus of claim 3, wherein the first dielectric material has a first dielectric constant and the second dielectric material has a second dielectric constant, wherein the first dielectric constant is greater than the second dielectric constant.