Integrated circuit having bond pad with improved thermal and mechanical properties
First Claim
Patent Images
1. An integrated circuit including active circuitry and at least one bond pad, the at least one bond pad comprising:
- a metallization layer, the metallization layer in electrical contact with at least a portion of the active circuitry; and
a capping layer, the capping layer formed over at least a portion of the metallization layer and in electrical contact with the metallization layer;
wherein the capping layer is patterned to comprise a plurality of etched grooves;
wherein one or more of said etched grooves are formed in an upper surface of the capping layer but do not extend through the capping layer to a lower surface of the capping layer;
at least one of said etched grooves thereby having a depth which is less than a thickness of the capping layer between said upper and lower surfaces.
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Abstract
An integrated circuit includes active circuitry and at least one bond pad. The at least one bond pad, in turn, comprises a metallization layer and a capping layer having one or more grooves. The metallization layer is in electrical contact with at least a portion of the active circuitry. In addition, the capping layer is formed over at least a portion of the metallization layer and is in electrical contact with the metallization layer. The grooves in the capping layer may be located only proximate to the edges of the bond pad or may run throughout the bond pad depending on the application.
13 Citations
20 Claims
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1. An integrated circuit including active circuitry and at least one bond pad, the at least one bond pad comprising:
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a metallization layer, the metallization layer in electrical contact with at least a portion of the active circuitry; and a capping layer, the capping layer formed over at least a portion of the metallization layer and in electrical contact with the metallization layer; wherein the capping layer is patterned to comprise a plurality of etched grooves; wherein one or more of said etched grooves are formed in an upper surface of the capping layer but do not extend through the capping layer to a lower surface of the capping layer; at least one of said etched grooves thereby having a depth which is less than a thickness of the capping layer between said upper and lower surfaces. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15)
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16. An integrated circuit including active circuitry and at least one bond pad, the at least one bond pad comprising:
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a metallization layer, the metallization layer in electrical contact with at least a portion of the active circuitry; a capping layer, the capping layer formed over at least a portion of the metallization layer and in electrical contact with the metallization layer; and a passivation layer, the passivation layer defining an opening over the metallization layer through which the capping layer electrically contacts the metallization layer; wherein the capping layer is patterned to comprise a plurality of etched grooves; and wherein the capping layer lies at least partially on top of the passivation layer.
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17. An integrated circuit mounted in an integrated circuit package, the integrated circuit including active circuitry and a bond pad, wherein the bond pad comprises:
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a metallization layer, the metallization layer in electrical contact with at least a portion of the active circuitry; and a capping layer, the capping layer formed over at least a portion of the metallization layer and in electrical contact with the metallization layer; wherein the capping layer is patterned to comprise a plurality of etched grooves; wherein one or more of said etched grooves are formed in an upper surface of the capping layer but do not extend through the capping layer to a lower surface of the capping layer; at least one of said etched grooves thereby having a depth which is less than a thickness of the capping layer between said upper and lower surfaces. - View Dependent Claims (18, 19)
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20. A method of forming a bond pad in an integrated circuit including active circuitry, the method comprising the steps of:
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forming a metallization layer, the metallization layer in electrical contact with at least a portion of the active circuitry; and forming a capping layer over at least a portion of the metallization layer and in electrical contact with the metallization layer; wherein the capping layer is patterned to comprise a plurality of etched grooves; wherein one or more of said etched grooves are formed in an upper surface of the capping layer but do not extend through the capping layer to a lower surface of the capping laver; at least one of said etched grooves thereby having a depth which is less than a thickness of the capping layer between said upper and lower surfaces.
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Specification