Electronic device package with an integrated evaporator
First Claim
1. An electronic device package adapted for enabling thermal regulation, said electronic device package comprising:
- a housing comprising a thermally conductive substrate;
an evaporator portion adapted for operable coupling to a secondary portion of a thermal management system;
at least one electronic device disposed on the thermally conductive substrate and thermally coupled to the evaporator portion via the thermally conductive substrate; and
a carrier onto which the housing is mounted, one end of the evaporator portion extending into a hole in the carrier so as to contact the housing.
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Accused Products
Abstract
The present invention provides an electronic device package that can be fabricated using standard package fabrication technologies while providing a desired level of thermal transfer capability to an attachable thermal management system. The electronic device package according to the present invention comprises a housing that is specifically designed to couple with an evaporator portion of a thermal management system, for example a heat pipe. One or more electronic devices are mounted in thermal contact with the evaporator portion of the thermal management system. Upon completion of the fabrication of the package using standard techniques, the evaporator portion of the electronic device package is operatively coupled with a secondary portion of the thermal management system. In this manner the electronic device package can be fabricated to incorporate a desired thermal management system, while being fabricated using standard package fabrication processes and machinery.
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Citations
18 Claims
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1. An electronic device package adapted for enabling thermal regulation, said electronic device package comprising:
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a housing comprising a thermally conductive substrate; an evaporator portion adapted for operable coupling to a secondary portion of a thermal management system; at least one electronic device disposed on the thermally conductive substrate and thermally coupled to the evaporator portion via the thermally conductive substrate; and a carrier onto which the housing is mounted, one end of the evaporator portion extending into a hole in the carrier so as to contact the housing. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18)
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Specification