Thermal energy storage transfer system

• US 7,505,269 B1
• Filed: 10/11/2007
• Issued: 03/17/2009
• Est. Priority Date: 10/11/2007
• Status: Expired due to Fees

• Current Assignee: Valere Power, Inc. (Delta Electronics Incorporated)
• Original Assignee: Valere Power, Inc. (Delta Electronics Incorporated)
• Inventors: Teter, John, Garcia, Marvin, Cosley, Michael
• Primary Examiner(s): Thompson; Gregory D
• Application Number:
  US11/870,702
• Time in Patent Office: 523 Days
• Field of Search: 165/104.33, 361/690, 361/700
• US Class Current: 361/700
• CPC Class Codes: F28D 15/02 in which the medium condenses and evaporates, e.g. heat pipes heat pipes used in solar heat collectors F24S10/95; in radiators F28D1/0226; in nuclear reactors G21C15/257
• CPC Class Codes: F28D 15/0266 with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers F28D15/043 takes precedence
• CPC Class Codes: F28D 15/0275 Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
• CPC Class Codes: F28D 20/021 the latent heat storage material and the heat-exchanging means being enclosed in one container F28D20/023 - F28D20/028 take precedence
• CPC Class Codes: F28F 13/00 Arrangements for modifying heat-transfer, e.g. increasing, decreasing F28F1/00 - F28F11/00 take precedence
• CPC Class Codes: F28F 3/02 Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations F28F3/08 takes precedence
• CPC Class Codes: H05K 7/20609 Air circulating in closed loop within cabinets wherein heat is removed through air-to-liquid heat-exchanger
• CPC Class Codes: Y02E 60/14 Thermal energy storage

Abstract

A thermal energy storage transfer system that is adapted to transfer heat from an electronics enclosure. The thermal energy storage system includes a thermal energy storage unit that is positioned within the electronics enclosure. The thermal energy storage unit contains a phase change material that stores heat created by electronics stored within the electronics enclosure and transfers the heat to outside of the electronics enclosure by use of a heat pipe and condenser.

Claims

1. A thermal energy storage transfer system for use with an electronics enclosure having an interior space for electronics, the thermal energy storage transfer system comprising:

a main housing positioned within the interior space of the electronics enclosure;

a phase change material in the main housing and adapted to absorb heat created by the electronics;

a heat sink coupled to the main housing and in communication with the phase change material, the heat sink adapted to transfer heat to the phase change material that is generated by the electronics within the electronics enclosure;

a conductive material positioned within the main housing and embedded within the phase change material, the conductive material adapted to transfer heat from the phase change material;

a heat pipe coupled to the main housing and in communication with the conductive material, the heat pipe arranged to extend from the interior space of the electronics enclosure to a convection chimney associated with the electronics enclosure; and

a condenser coupled to the heat pipe and positioned within the convection chimney, the condenser adapted to remove heat from the heat pipe by releasing the heat into air moving through the convection chimney.

2. The thermal energy storage transfer system of claim 1, wherein the heat sink includes a base coupled to the main housing and a series of fins extending from the base.

3. The thermal energy storage transfer system of claim 1, wherein the condenser includes a series of fins coupled to the heat pipe to radiate heat from the heat pipe.

4. The thermal energy storage transfer system of claim 1, further including a second heat pipe coupled to the main housing for transferring heat from the phase change material to the condenser.

5. The thermal energy storage transfer system of claim 1, further including a condenser housing coupled to the main housing, the condenser housing adapted to house the condenser.

6. A thermal energy storage and transfer system for removing heat generated by electronics equipment positioned within an interior space of an electronics enclosure, the thermal energy storage and transfer system comprising:

a main housing positioned within the electronics enclosure;

a phase change material positioned in the main housing, the phase change material adapted to absorb and store heat generated by the electronics equipment within the electronics enclosure;

a heat sink coupled to the main housing and adapted to transfer heat created by the electronics equipment to the phase change material;

a condenser housing coupled to the main housing and positioned outside of the interior space of the electronics enclosure and within a convection chimney;

a condenser positioned within the condenser housing;

at least one heat pipe coupled to the main housing at a first end and to the condenser at a second end, the heat sink adapted to transfer heat stored by the phase change material within the housing to the condenser where air, passing through the convection chimney, contacts the condenser to remove heat from the condenser; and

a conductive material positioned within the main housing and embedded within the phase change material, the conductive material adapted to transfer heat from the phase change material to the at least one heat pipe.

7. The thermal energy storage transfer system of claim 6, wherein the heat sink includes a base coupled to the main housing and a series of fins extending from the base.

8. The thermal energy storage transfer system of claim 7, wherein the condenser includes a series of fins coupled to the at least one heat pipe to radiate heat from the at least one heat pipe.

9. The thermal energy storage transfer system of claim 6, further including a second heat pipe coupled to the main housing for transferring heat from the phase change material to the condenser.

10. The thermal energy storage transfer system of claim 6, further including a cover adapted to be coupled to the main housing, the cover including at least one opening adapted to accept a corresponding one of the at least one heat pipe.

11. The thermal energy storage transfer system of claim 10, wherein the cover includes a fill opening and a vent opening to allow the main housing to be filled with the phase change material.

12. An electronics enclosure for electronics equipment comprising:

a convection chimney having an air inlet and an air outlet positioned above the air inlet;

a thermal energy storage unit positioned within the electronics enclosure, the thermal energy storage unit having a main housing;

a phase change material positioned within the main housing, the phase change material adapted to absorb and store heat generated by the electronics equipment within the electronics enclosure;

a heat sink coupled to the main housing and adapted to transfer heat created by the electronics equipment to the phase change material;

a condenser positioned within the chimney;

a heat pipe coupled to the housing at a first end and to the condenser at a second end, the heat pipe adapted to transfer heat stored by the phase change material within the housing to the condenser where air, passing through the chimney, contacts the condenser to remove heat from the condenser; and

a conductive material positioned within the housing and embedded within the phase change material, the conductive material adapted to transfer heat from the phase change material to the heat pipe such that heat generated by the electronics equipment is absorbed by the phase change material and transferred through the heat pipe to the condenser where air passing through the chimney removes heat from the condenser.

13. The electronics enclosure of claim 12, wherein the heat sink includes a base coupled to the main housing and a series of fins extending from the base.

14. The electronics enclosure of claim 12, wherein the condenser includes a series of fins coupled to the heat pipe to radiate heat from the heat pipe.

15. The electronics enclosure of claim 12, further including a second heat pipe coupled to the main housing for transferring heat from the phase change material to the condenser.

16. The electronics enclosure of claim 12, further including a condenser housing coupled to the main housing, the condenser housing adapted to house the condenser.

17. The electronics enclosure of claim 12, further including a reflective insulating material lining the inside of the electronics enclosure to reflect heat from the electronics equipment to the heat sink.