Tri-level inverter
First Claim
Patent Images
1. A power module, comprising:
- a module housing;
a cold plate integrated into the module housing, said cold plate including a direct copper bonded substrate attached to a base plate by a solder layer;
a DC bus bar including first and second bus bars separated by bus bar insulation that is integrally molded as part of the module housing;
a set of DC terminals accessible from an exterior of the module housing;
at least three pairs of AC terminals accessible from the exterior of the module housing; and
an inverter circuit contained within the module housing, the invertercircuit configurable to selectively switch between at least three output states and electrically coupled between the set of DC terminals and at least one of the pairs of AC terminals.
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Accused Products
Abstract
A tri-level inverter power module has an architecture employing a high degree of modularity that allows a base power module to be quickly, easily, and cost effectively configured to address a large variety of applications.
93 Citations
15 Claims
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1. A power module, comprising:
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a module housing; a cold plate integrated into the module housing, said cold plate including a direct copper bonded substrate attached to a base plate by a solder layer; a DC bus bar including first and second bus bars separated by bus bar insulation that is integrally molded as part of the module housing; a set of DC terminals accessible from an exterior of the module housing; at least three pairs of AC terminals accessible from the exterior of the module housing; and an inverter circuit contained within the module housing, the inverter circuit configurable to selectively switch between at least three output states and electrically coupled between the set of DC terminals and at least one of the pairs of AC terminals. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A power system, comprising:
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a DC power supply; a power module, comprising; a housing including an integrated cold plate, wherein the cold plate includes a direct copper bonded substrate attached to a base plate by a solder layer; a pair of input terminals accessible from an exterior of the housing, the input terminals electrically coupled to the DC power supply; a DC bus electrically coupled to the pair of input terminals, wherein the DC bus includes first and second bus bars separated by insulation that is integrally molded as part of the housing; three pairs of output terminals accessible from the exterior of the housing; an AC bus electrically coupled to at least one of the three pairs of output terminals; and an inverter circuit configurable to selectively operate in one of at least three output states and electrically coupled between the DC bus and the AC bus; and a controller to generate control signals to control the inverter circuit. - View Dependent Claims (9, 10, 11, 12, 13, 14, 15)
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Specification