Automatic activating system for thermometer

• US 7,507,021 B2
• Filed: 10/06/2006
• Issued: 03/24/2009
• Est. Priority Date: 10/06/2006
• Status: Active Grant

• Current Assignee: Kpr U.S., LLC (Cardinal Health, Inc.)
• Original Assignee: Tyco Healthcare Group LP (Medtronic Plc)
• Inventors: Price, Jeffrey E., Yerlikaya, Denis Y.
• Primary Examiner(s): Assouad; Patrick J
• Assistant Examiner(s): ADAMS, BRET W
• Application Number:
  US11/539,545
• Publication Number:
  US 20080112464A1
• Time in Patent Office: 900 Days
• Field of Search: 335/6, 335 43- 44, 335/217, 335220-221, 310/315, 310/346, 310 16- 24, 310/68.C, 310 21- 22, 310 25- 29, 310 31- 32, 374/163, 374/141, 374/E17.014, 374/E7.039, 374100-210
• US Class Current: 374/142
• CPC Class Codes: G01K 13/20 Clinical contact thermometers for use with humans or animals

Abstract

An electronic thermometer includes an automatic activating system for automatically configuring the thermometer between an active state (broadly, the thermometer is turned on) and a non-active state (broadly, the thermometer is turned off). In general the activating system includes a solid-state activating sensor, such as a Hall-effect sensor, in a housing of the thermometer and a magnet in a probe of the thermometer for activating the sensor when the probe is received in a probe well.

Claims

1. A hand-held thermometer comprising:

a probe having at least one temperature-sensing component;

a housing having a probe well for removably receiving the probe;

a solid-state sensor associated with the housing and having no moving parts, the solid-state sensor and the probe being adapted and configured so that the solid-state sensor detects a first magnetic flux density indicative of the probe being seated in the probe well, the thermometer being configured to be in a non-active state when the sensor detects the first magnetic flux density and being configured to be in an active state when the sensor detects a second magnetic flux density different from the first magnetic flux density and indicative of the probe being removed from the well, the solid state sensor comprising a Hall-effect sensor;

a magnetic source associated with the probe;

a microcontroller and an activating circuit including the solid-state sensor, the activating circuit being in communication with the microcontroller so that the circuit sends a non-active signal to the microcontroller when the sensor detects the presence of the magnetic field and sends an active signal to the microcontroller when the sensor detects the absence of the magnetic field, the activating circuit further comprises a logic gate for receiving an input signal from the sensor and for sending either the non-active signal or the active signal to the microcontroller;

the sensor being configured to send a high voltage output to the logic gate when the sensor is not activated and a low voltage output to the logic gate when the sensor is activated, and wherein the logic gate comprises an inverter, the inverter being configured to invert the input signal from the sensor so that the high voltage input from the sensor is changed to a low voltage output constituting the active signal and the low voltage input from the sensor is changed to a high voltage output constituting the non-active signal.

2. A thermometer as set forth in claim 1 wherein the magnetic source comprises a magnet mounted on the probe.

3. A thermometer as set forth in claim 1 wherein the activating circuit further comprises a leakage preventing device for preventing current from flowing between the solid-state sensor and the microcontroller when the thermometer is in the non-active state.

4. A thermometer as set forth in claim 3 wherein the leakage preventing device comprises a diode.

5. A thermometer as set forth in claim 1 wherein the activating circuit further comprises a leakage preventing device for preventing current from flowing from the inverter to the microcontroller when the thermometer is in the non-active state.

6. A thermometer as set forth in claim 5 wherein the leakage preventing device comprises a diode.

7. A thermometer as set forth in claim 6 wherein the diode is electrically disposed between the inverter and the microcontroller.

8. A thermometer as set forth in claim 1 further comprising a circuit board in the housing of the base unit, the microcontroller and the activating circuit being integrated on the circuit board.

9. A thermometer as set forth in claim 8 wherein the magnetic source comprises a permanent magnet attached to the probe.

10. A thermometer as set forth in claim 9 wherein the magnetic source is configured and arranged on the probe, and the sensor is configured and arranged on the base unit so that the sensor will not detect the presence of the permanent magnet unless the probe is substantially fully received in the probe well.

11. A thermometer as set forth in claim 10 wherein the magnetic field of the magnetic source has a flux density of between about 3800 to 4200 Gauss.

12. A thermometer as set forth in claim 11 further comprising flex circuit inside the probe electrically connecting the temperature-sensing component to the microcontroller, the magnetic source being mounted on the flex circuit.

13. A thermometer as set forth in claim 10 wherein the probe comprises a handle and an elongate shaft, the magnetic source being disposed in the shaft.

14. A thermometer as set forth in claim 1, wherein the solid-state sensor uses less than about 20 μ

A of current.

15. A thermometer as set forth in claim 14, wherein the solid-state sensor uses less or equal to about 5 μ

A of current.

16. A method of making an electronic thermometer comprising:

mounting the temperature sensing component on a substrate;

mounting a magnetic source on the substrate;

assembling the substrate including the magnetic source and the temperature sensing component into a probe;

mounting on a circuit board a microcontroller configured for placing the thermometer in an active state to acquire temperature information from the temperature sensing component and for placing the thermometer in an inactive state;

mounting on the circuit board a solid-state sensor having no moving parts so that the solid-state sensor and the microcontroller are in electrical communication with each other, the solid-state sensor being capable of detecting a first magnetic flux density indicative of the probe being seated in a probe well and being capable of detecting a second magnetic flux density different from the first magnetic flux density and indicative of the probe being removed from the well

assembling the circuit board with the microcontroller and solid-state sensor thereon into a housing of the thermometer;

operatively interconnecting the microcontroller and the temperature sensing component for communication of temperature information from the temperature sensing component to the microcontroller.

17. A method of making an electronic thermometer as set forth in claim 16 further comprising mounting a leakage preventing device on the circuit board for preventing current from flowing between the solid-state sensor and the microcontroller when the thermometer is in the non-active state.

18. A method of making an electronic thermometer as set forth in claim 17 wherein the leakage preventing device comprises a diode.

19. A method of making an electronic thermometer as set forth in claim 18 further comprising mounting a logic gate on the circuit board for receiving an input signal from the sensor and sending either the non-active signal or the active signal to the microcontroller.

20. A method of making an electronic thermometer as set forth in claim 19 wherein the logic gate comprises an inverter.

21. A method of making an electronic thermometer as set forth in claim 20 wherein mounting a leakage preventing device comprises electrically interposing the diode between the inverter and the microcontroller.

22. A method of making an electronic thermometer as set forth in claim 16 wherein assembling the temperature sensing component and magnetic source into a probe comprises placing the substrate in the probe.

23. A method of making an electronic thermometer as set forth in claim 16 wherein assembling the substrate into the probe further comprises deforming the substrate from a first configuration into a second configuration and placing the substrate in the second configuration inside the probe.

24. A method of making an electronic thermometer as set forth in claim 23 wherein deforming the substrate comprises bending the substrate from the first generally flat position in which the temperature sensing component and the magnetic source were mounted on the substrate into a second position in which the substrate is not flat.

25. A method of making an electronic thermometer as set forth in claim 16 wherein operatively interconnecting the microcontroller and the temperature sensing component comprises electrically connecting the substrate to the circuit board.

26. A method of making an electronic thermometer as set forth in claim 25 wherein electrically connecting the substrate to the circuit board comprises making a hardwired connection between the substrate and the circuit board.