Method and apparatus for vibration machining with two independent axes

• US 7,508,116 B2
• Filed: 09/07/2005
• Issued: 03/24/2009
• Est. Priority Date: 09/07/2005
• Status: Expired due to Fees

• Current Assignee: Panasonic Corporation (Panasonic Holdings Corporation)
• Original Assignee: Panasonic Corporation (Panasonic Holdings Corporation)
• Inventors: Liu, Xinbing
• Primary Examiner(s): BUDD, MARK OSBORNE
• Application Number:
  US11/221,041
• Publication Number:
  US 20070052326A1
• Time in Patent Office: 1,294 Days
• Field of Search: 310/323.01, 310/323.12, 310/323.16, 310/323.18, 310/328
• US Class Current: 310/328
• CPC Class Codes: B23B 2226/31 Diamond
• CPC Class Codes: B23B 2260/108 Piezoelectric elements
• CPC Class Codes: B23B 29/125 Vibratory toolholders
• CPC Class Codes: B23D 5/00 Planing or slotting machines cutting otherwise than by relative movement of the tool and workpiece in a straight line
• CPC Class Codes: B23P 25/00 Auxiliary treatment of workpieces, before or during machining operations, to facilitate the action of the tool or the attainment of a desired final condition of the work, e.g. relief of internal stress
• CPC Class Codes: B24B 1/04 subjecting the grinding or polishing tools, the abrading or polishing medium or work to vibration, e.g. grinding with ultrasonic frequency polishing or abrading surfaces on work by means of tumbling apparatus B24B31/00, involving oscillating or vibrating containers B24B31/06; superfinishing surfaces on work, e.g. by means of abrading blocks reciprocating with high frequency, B24B35/00
• CPC Class Codes: B24B 13/046 using a pointed tool or scraper-like tool B24B13/015 and B24B13/065 take precedence

Abstract

A vibration machining apparatus and method of use. The vibration machining apparatus includes a cutting tool and a motion stage coupled to one of the cutting tool or the workpiece to move the cutting tool relative to the workpiece. A tangent to a machine path and a normal to the surface of the workpiece define a vibration plane. The vibration machining apparatus further includes a first vibrating unit coupled to one of the cutting tool or the workpiece to vibrate it along a first vibrational direction, substantially in the vibration plane, and a second vibrating unit coupled with one of the cutting tool or the workpiece to vibrate the one of the cutting tool or the workpiece coupled to the second vibrating unit along a second vibrational direction, different from the first direction and substantially in the vibration plane.

Claims

1. A vibration machining apparatus for use in machining a surface of a workpiece, comprising:

a cutting tool to machine at least a portion of the workpiece;

a motion stage coupled to one of the cutting tool or the workpiece to move the cutting tool relative to the workpiece coupled to the motion stage such that the cutting tool follows a machining path on the surface of the workpiece, a tangent to the machining path and a normal to the surface of the workpiece defining a vibration plane;

a first vibrating unit coupled to one of the cutting tool or the workpiece to vibrate the one of the cutting tool or the workpiece coupled to the first vibrating unit along a first vibrational direction, the first vibrational direction being in the vibration plane or substantially in the vibration plane; and

a second vibrating unit coupled with one of the cutting tool or the workpiece to vibrate the one of the cutting tool or the workpiece coupled to the second vibrating unit along a second vibrational direction, the second vibrational direction being different from the first vibrational direction and in the vibration plane or substantially in the vibration plane,

wherein the first vibrating unit and the second vibrating unit are not coupled together.

2. The vibration machining apparatus according to claim 1, wherein the first vibrational direction is substantially tangent to the machining path and the second vibration direction is substantially normal to the surface of the workpiece.

3. The vibration machining apparatus according to claim 1, wherein the first vibrational direction and second vibration direction are substantially orthogonal to each other.

4. The vibration machining apparatus according to claim 1, further comprising:

control means electrically coupled to the motion stage for controlling motion of at least one of the workpiece or the cutting tool coupled to the motion stage according to predetermined machining criteria.

5. The vibration machining apparatus according to claim 1, wherein the motion stage is configured to translate or rotate the one of the workpiece or the cutting tool coupled to the motion stage.

6. The vibration machining apparatus according to claim 1, wherein the cutting tool includes a cutting edge formed from at least one of diamond, ruby, sapphire, silicone carbide, tungsten, tungsten carbide or ceramic.

7. The vibration machining apparatus according to claim 1, wherein the first vibrating unit and the second vibrating unit each vibrate at a frequency in the range of about 100Hz to 50KHz.

8. The vibration machining apparatus according to claim 1, further comprising a signal pre-compensating unit to pre-compensate input signals to the first vibrating unit and the second vibrating unit to reduce or substantially eliminate hysteresis effects in the cutting tool.

9. The vibration machining apparatus according to claim 1, wherein the first vibrating unit and the second vibrating unit are piezoelectric stacks.

10. The vibration machining apparatus according to claim 1, wherein:

the cutting tool includes a cutting edge for cutting the surface of the workpiece; and

the first vibrating unit and the second vibrating unit are configured to generate a composite trajectory of the cutting edge relative to the workpiece which is substantially closed looped.

11. The vibration machining apparatus according to claim 10, wherein at least a portion of the closed loop trajectory is elliptical.

12. A method of machining at least a portion of a workpiece using vibration machining apparatus, the method comprising the steps of:

a) moving a cutting tool relative to the workpiece such that the cutting tool follows a machining path on the surface of the workpiece, a tangent to the machine path and a normal to the surface of the workpiece defining a vibration plane;

b) vibrating one of the cutting tool or the workpiece coupled to a first vibrating unit along a first vibrational direction, the first vibrational direction being in the vibration plane or substantially in the vibration plane; and

c) vibrating one of the cutting tool or the workpiece coupled to the second vibrating unit along a second vibrational direction, the second vibrational direction being different from the first vibrational direction and in the vibration plane or substantially in the vibration planes,

wherein the first vibrating unit and the second vibrating unit are not coupled together.

13. The method according to claim 12, further comprising the step of:

d) independently controlling (1) amplitudes of input waveforms of the first vibrating unit and the second vibrating unit, (2) a relative phase of the input waveforms of the first vibrating unit and the second vibrating unit or (3) the input waveforms of the first vibrating unit and the second vibrating unit.

14. The method according to claim 13, wherein input waveforms of the first vibrating unit and the second vibrating unit are periodic.

15. The method according to claim 12, wherein steps (b) and (c) of vibrating by the first vibrating unit and the second vibrating unit, each comprise the step of generating a vibration at a frequency in a range of about 100Hz to50KHz.

16. The method according to claim 13, wherein step (d) of independently controlling the relative phase of the input waveforms includes the step of controlling the relative phase of the input waveform to have a relative phase other than a relative phase of 0°

or 180°

.

17. The method according to claim 12, further comprising the step of:

e) pre-compensate input waveforms of the first vibrating unit and the second vibrating unit to reduce or substantially eliminate hysteresis effects in the cutting tool.

18. The method according to claim 12, wherein steps (b) and (c) of vibrating by the first vibrating unit and the second vibrating unit further comprises the step of generating a composite trajectory of a cutting edge of the cutting tool relative to the workpiece which is substantially closed looped.

19. The method according to claim 13, wherein step (d) of independently controlling further comprises the steps of:

providing one of a truncated sinusoidal waveform or a sinusoidal waveform, as the input waveform of the first vibrating unit, to generate vibration along the first vibrational axis; and

providing one of a truncated sinusoidal waveform or a sinusoidal waveform, as the input waveform of the second vibrating unit, to generate vibration along the second vibrational axis.

20. The method according to claim 14, wherein step (d) of independently controlling further comprises the steps of:

providing one of a truncated non-sinusoidal waveform or a non-sinusoidal waveform, as the input waveform of the first vibrating unit, to generate vibration along the first vibrational axis; and

providing one of a truncated non-sinusoidal waveform or a non-sinusoidal waveform, as the input waveform of the second vibrating unit, to generate vibration along the second vibrational axis.

21. The method according to claim 14, wherein one of the input waveforms of the first vibrating unit or the second vibrating unit is a truncated sinusoidal waveform or a sinusoidal waveform and a remaining one of the input waveforms of the first vibrating unit and the second vibrating unit is a truncated non-sinusoidal waveform or a non-sinusoidal waveform.

22. The method according to claim 12, further comprising the step of:

f) controlling motion of one of the workpiece or the cutting tool coupled to the motion stage according to predetermined machining criteria.

23. The method according to claim 12, wherein step (a) comprises the step of:

translating and/or rotating the one of the workpiece or the cutting tool coupled to the motion stage.

24. The method according to claim 20, wherein the input waveforms of the first vibrating unit and the second vibrating unit have a relative phase of 90°

and a common frequency.