Lithographic apparatus, device manufacturing method, and device manufactured thereby
First Claim
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1. A lithographic projection apparatus for imaging a pattern onto a substrate that is at least partially covered by a layer of radiation-sensitive material, the apparatus comprising:
- a radiation system configured to provide a beam of radiation;
a support configured to support a patterning structure, the patterning structure configured to produce a desired pattern in the beam of radiation;
a substrate table configured to hold a substrate;
a projection system configured to project the patterned beam of radiation onto a target portion of the substrate; and
a radiation absorber comprising a gas supply configured to supply an absorbent gas at a controlled concentration to at least one enclosure traversed by the beam of radiation, the absorbent gas serving to absorb radiation energy delivered by the beam of radiation to the substrate during exposure of the radiation-sensitive material to the patterned beam of radiation,wherein the radiation absorber is configured to have a gas concentration in a path of the beam of radiation that is controllably non-uniform in an unobstructed plane perpendicular to an optical axis of the radiation system, or the projection system, or both the radiation system and the projection system, andwherein the beam of radiation traverses through a top surface and a bottom surface of the at least one enclosure, the top and bottom surfaces substantially parallel to each other, while avoiding interaction with an optical element between the top and bottom surfaces of the at least one enclosure.
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Abstract
In a lithographic projection system, the radiation energy delivered to the substrate needs to be accurately controlled. Attenuation by injecting an absorbent gas into a volume through which the radiation passes is a convenient way to control the energy. Additionally, the interaction between gasses and the radiation may be used to measure the energy of the radiation with minimal disruption to the radiation.
32 Citations
55 Claims
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1. A lithographic projection apparatus for imaging a pattern onto a substrate that is at least partially covered by a layer of radiation-sensitive material, the apparatus comprising:
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a radiation system configured to provide a beam of radiation; a support configured to support a patterning structure, the patterning structure configured to produce a desired pattern in the beam of radiation; a substrate table configured to hold a substrate; a projection system configured to project the patterned beam of radiation onto a target portion of the substrate; and a radiation absorber comprising a gas supply configured to supply an absorbent gas at a controlled concentration to at least one enclosure traversed by the beam of radiation, the absorbent gas serving to absorb radiation energy delivered by the beam of radiation to the substrate during exposure of the radiation-sensitive material to the patterned beam of radiation, wherein the radiation absorber is configured to have a gas concentration in a path of the beam of radiation that is controllably non-uniform in an unobstructed plane perpendicular to an optical axis of the radiation system, or the projection system, or both the radiation system and the projection system, and wherein the beam of radiation traverses through a top surface and a bottom surface of the at least one enclosure, the top and bottom surfaces substantially parallel to each other, while avoiding interaction with an optical element between the top and bottom surfaces of the at least one enclosure. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22)
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23. A device manufacturing method, comprising:
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projecting a patterned beam of radiation onto a target portion of a layer of radiation-sensitive material at least partially covering a substrate; controlling an energy of the patterned beam, or a duration of exposure of the radiation-sensitive material to the patterned beam, or both the energy and the duration, such that a desired dose of radiation is delivered to the substrate; and supplying an absorbent gas according to a concentration profile to an enclosure traversed by the beam of radiation to effect a desired attenuation of the patterned beam, the absorbent gas absorbing a wavelength of the radiation, the concentration varying across at least part of an unobstructed space traversed by the beam in a direction substantially perpendicular to a direction of the beam, wherein the beam of radiation traverses through a top surface and a bottom surface of the enclosure, the top and bottom surfaces substantially parallel to each other, while avoiding interaction with an optical element between the top and bottom surfaces of the enclosure.
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24. A device manufacturing method, comprising:
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projecting a patterned beam of radiation onto a target portion of a layer of radiation-sensitive material at least partially covering a substrate; controlling an energy profile of the patterned beam of radiation, such that a desired radiation uniformity is delivered to the substrate during an exposure; and supplying an absorbent gas according to a concentration profile to an enclosure traversed by the beam of radiation to effect a desired non-uniform attenuation of the patterned beam, the absorbent gas absorbing a wavelength of the radiation, the concentration varying across at least part of an unobstructed space traversed by the beam in a direction substantially perpendicular to a direction of the beam, wherein the beam of radiation traverses through a top surface and a bottom surface of the enclosure, the top and bottom surfaces substantially parallel to each other, while avoiding interaction with an optical element between the top and bottom surfaces of the enclosure.
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25. A lithographic projection apparatus for imaging a pattern onto a substrate that is at least partially covered by a layer of radiation-sensitive material, the apparatus comprising:
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a radiation system configured to provide a beam of radiation; a support configured to support a patterning structure, the patterning structure configured to produce a desired pattern in the beam of radiation; a substrate table configured to hold a substrate; a projection system configured to project the patterned beam of radiation onto a target portion of the substrate; and an enclosure having a top surface and a bottom surface, the beam of radiation traversing through the top and bottom surfaces of the enclosure, and having a radiation-energy detector configured to determine the energy of the beam of radiation, the beam of radiation passing at least partly through a region of interactive gas, wherein the detector comprises a sensor located within the enclosure and configured to output a signal that represents an interaction of the beam of radiation with the region of gas, and to measure, out of a path of the beam of radiation, particles scattered from the path of the beam of radiation due to the interaction to determine the amount of interaction of the beam of radiation with the region of gas. - View Dependent Claims (26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39, 40, 41, 42, 43, 44, 45, 46, 47, 48)
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49. A device manufacturing method, comprising:
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projecting a patterned beam of radiation onto a target portion of a layer of radiation-sensitive material at least partially covering a substrate; controlling an energy of the patterned beam of radiation, or a duration of exposure of the radiation-sensitive material to the patterned beam of radiation, or both the energy and the duration, such that a desired dose of radiation is delivered to the substrate during an exposure; directing the patterned beam of radiation through an enclosure having a top and bottom surface, wherein the beam of radiation traverses through the top and bottom surfaces of the enclosure; and determining, with a sensor located within the enclosure, the energy of the radiation by supplying an interactive gas according to a concentration profile to the enclosure traversed by the radiation beam of radiation; and measuring, with the sensor located within the enclosure, particles scattered from a path of the beam of radiation due to the interaction of the beam of radiation with the interactive gas to determine the amount of interaction of the beam of radiation with the interactive gas, wherein results of the measurement are used to control the energy and/or the duration.
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50. A device manufacturing method, comprising:
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projecting a patterned beam of radiation onto a target portion of a layer of radiation-sensitive material at least partially covering a substrate; controlling an energy profile of the patterned beam, such that a desired radiation uniformity is delivered to the substrate during an exposure; directing the patterned beam of radiation through an enclosure having a top and bottom surface, wherein the beam of radiation traverses through the top and bottom surfaces of the enclosure; and determining, with a sensor located within the enclosure, the energy profile of the radiation by supplying an interactive gas to the enclosure traversed by the radiation; and measuring, with the sensor located within the enclosure, particles scattered out of a path of radiation due to interaction of the radiation with the interactive gas to determine the amount of interaction of the radiation with the interactive gas at a plurality of points, wherein results of the measurement are used to control the energy profile of the patterned beam.
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51. A lithographic projection apparatus for imaging a pattern onto substrate that is at least partially covered by a layer of radiation-sensitive material, the apparatus comprising:
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a radiation system configured to provide a beam of radiation; a support configured to support a patterning structure, the patterning structure configured to produce a desired pattern in the beam of radiation; a substrate table configured to hold a substrate; a projection system configured to project the patterned beam of radiation onto a target portion of the substrate; and an enclosure having a top surface and a bottom surface, the beam of radiation traversing through the top and bottom surfaces of the enclosure, wherein the enclosure comprises; a radiation absorber comprising a gas supply configured to supply an absorbent gas al a controlled concentration to an enclosure traversed by the beam of radiation, the absorbent gas serving to absorb radiation energy delivered by the beam of radiation to the substrate during exposure of the radiation-sensitive material; and a radiation-energy sensor located within the enclosure, the sensor, in operation, providing an output signal that represents an interaction of the beam with the absorbent gas and measuring, out of a path of the beam of radiation, particles scattered from the path of the beam of radiation due to the interaction to determine the amount of interaction of the beam of radiation with the absorbent gas. - View Dependent Claims (52)
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53. A device manufacturing method, comprising:
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projecting a patterned beam of radiation onto a target portion of a layer of radiation-sensitive material at least partially covering a substrate; controlling the energy profile of the patterned beam, such that a desired radiation uniformity is delivered to the substrate during an exposure; directing the patterned beam of radiation through an enclosure having a top and bottom surface, wherein the beam of radiation traverses through the top and bottom surfaces of the enclosure; supplying an absorbent gas according to a concentration profile to the enclosure traversed by the beam of radiation to effect a desired non-uniform attenuation of the patterned beam of radiation, the absorbent gas absorbing a wavelength of the radiation; and determining, with a sensor located within the enclosure, the energy profile of the radiation by measuring, out of a path of the beam of radiation, particles scattered from the path of the beam of radiation due to the interaction of the radiation with the absorbent gas to determine an amount of interaction of the radiation with the absorbent gas at a plurality of points, wherein results of the measurement are used to control the energy profile control of the patterned beam.
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54. A device manufacturing method, comprising:
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projecting a patterned beam of radiation onto a target portion of a layer of radiation-sensitive material at least partially covering a substrate; controlling an energy of the patterned beam, or a duration of exposure of the radiation-sensitive material to the patterned beam, or both the energy and the duration, such that a desired dose of radiation is delivered to the substrate during an exposure; directing the patterned beam of radiation through an enclosure having a top and bottom surface, wherein the beam of radiation traverses through the top and bottom surfaces of the enclosure; supplying an absorbent gas according to a concentration profile to the enclosure traversed by the beam of radiation to effect a desired attenuation of the patterned beam of radiation, the absorbent gas absorbing the radiation wavelength; and determining, with a sensor located within the enclosure, the energy of the radiation by measuring, out of a path of the beam of radiation, particles scattered from the path of the beam due to the interaction of the radiation with the absorbent gas to determine an amount of interaction of the radiation with the absorbent gas, wherein results of the measurement are used to control the energy and/or the duration.
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55. A lithographic projection apparatus for imaging a pattern onto a substrate that is at least partially covered by a layer of radiation-sensitive material, the apparatus comprising:
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a radiation system configured to provide a beam of radiation; a support configured to support a patterning structure, the patterning structure configured to produce a desired pattern in the beam of radiation; a substrate table configured to hold a substrate; a projection system configured to project the patterned beam of radiation onto a target portion of the substrate; a concentration controlled enclosure of radiation absorbent gas, with a top surface and a bottom surface substantially parallel to each other, positioned to be traversed by the beam of radiation during exposure of the radiation-sensitive material, wherein the beam of radiation traverses through the top and bottom surfaces of the concentration controlled enclosure while avoiding interaction with an optical element between the top and bottom surfaces of the concentration controlled enclosure; and a plurality of gas supplies configured to supply a plurality of different absorbent gasses at controlled concentrations to the enclosure.
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Specification