Electronic component products and method of manufacturing electronic component products
DCFirst Claim
1. A method of manufacturing a ball array device, the method comprising:
- making a three dimensional inspection of a lead on the ball array device with the ball array device being positioned in a fixed optical system; and
selecting the ball array device as a produced ball array device based upon the results of the three dimensional inspection;
wherein the three dimensional inspection comprises;
illuminating the ball array device;
taking a first image of the ball array device with a first camera disposed in a fixed focus position relative to the ball array device to obtain a characteristic circular doughnut shape image from at least one ball;
taking a second image of the ball array device with a second camera disposed in a fixed focus position relative to the ball array device to obtain a side view image of the at least one ball; and
processing the first image and the second image using a triangulation method to calculate a three dimensional position of the at least one ball with reference to a pre-calculated calibration plane.
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Accused Products
Abstract
A calibration and part inspection method for the inspection of ball grid array, BGA, devices. Two cameras image a precision pattern mask with dot patterns deposited on a transparent reticle. The precision pattern mask is used for calibration of the system. A light source and overhead light reflective diffuser provide illumination. A first camera images the reticle precision pattern mask from directly below. An additional mirror or prism located below the bottom plane of the reticle reflects the reticle pattern mask from a side view, through prisms or reflective surfaces, into a second camera and a second additional mirror or prism located below the bottom plane of the reticle reflects the opposite side view of the reticle pattern mask through prisms or mirrors into a second camera. By imaging more than one dot pattern the missing state values of the system can be resolved using a trigonometric solution. The reticle with the pattern mask is removed after calibration and the BGA to be inspected is placed with the balls facing downward, in such a manner as to be imaged by the two cameras. The scene of the part can thus be triangulated and the dimensions of the BGA are determined.
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Citations
35 Claims
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1. A method of manufacturing a ball array device, the method comprising:
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making a three dimensional inspection of a lead on the ball array device with the ball array device being positioned in a fixed optical system; and selecting the ball array device as a produced ball array device based upon the results of the three dimensional inspection; wherein the three dimensional inspection comprises; illuminating the ball array device; taking a first image of the ball array device with a first camera disposed in a fixed focus position relative to the ball array device to obtain a characteristic circular doughnut shape image from at least one ball; taking a second image of the ball array device with a second camera disposed in a fixed focus position relative to the ball array device to obtain a side view image of the at least one ball; and processing the first image and the second image using a triangulation method to calculate a three dimensional position of the at least one ball with reference to a pre-calculated calibration plane. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15)
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16. A method of manufacturing a ball array device, the method comprising:
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making a three dimensional inspection of a lead on the ball array device with the ball array device being positioned in an optical system; and selecting the ball array device as a produced ball array device based upon the results of the three dimensional inspection; wherein the three dimensional inspection comprises; illuminating the ball array device to produce reflections; taking a first image of the reflections with a first camera disposed in a first fixed position to obtain a circular doughnut shape image of the ball array device; taking a second image of the reflections with a second camera disposed in a second fixed position non-parallel to the first fixed position to obtain a side view of the ball array device; and processing measurements from the first image and the second image to calculate a three dimensional position of at least one ball using a triangulation method with reference to a pre-calculated calibration plane. - View Dependent Claims (17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28)
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29. A method of manufacturing a ball array device, the method comprising:
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making a three dimensional inspection of a lead on the ball array device with the ball array device being positioned in an optical system; and selecting the ball array device as a produced ball array device based upon the results of the three dimensional inspection; wherein the three dimensional inspection comprises; illuminating the ball array device; taking a first image of the ball array device with a first camera disposed in a first fixed position relative to the ball array device to obtain a circular doughnut shape view of the ball array device, wherein the first camera includes a charged coupled device array; taking a second image of the ball array device with a second camera disposed in a second fixed position non-parallel to the first fixed position to obtain a side view of the ball array device, wherein a fixed mirror is interposed to reflect light between the ball array device and the second camera, and wherein the second camera includes a charged coupled device array; and processing measurements from the first image and the second image to calculate a three dimensional position of at least one ball using a triangulation method with reference to a pre-calculated calibration plane, wherein the calibration plane comprises a coordinate system having X, Y and Z axes, and wherein an X measurement value is proportional to a Z measurement value. - View Dependent Claims (30, 31, 32, 33, 34, 35)
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Specification