Method of making an encapsulated plasma sensitive device

• US 7,510,913 B2
• Filed: 05/23/2006
• Issued: 03/31/2009
• Est. Priority Date: 04/11/2003
• Status: Active Grant

• Current Assignee: Samsung Display Company Limited (Samsung Electronics Co. Ltd.)
• Original Assignee: Vitex Systems, Inc.
• Inventors: Zumhoff, Mac R., Nelson, Kenneth Jeffrey, Rosenblum, Martin Philip, Burrows, Paul E., Moro, Lorenza, Graff, Gordon L., Chu, Xi, Bonham, Charles C., Gross, Mark E., Martin, Peter M.
• Primary Examiner(s): Dang; Phuc T
• Application Number:
  US11/439,474
• Publication Number:
  US 20060216951A1
• Time in Patent Office: 1,043 Days
• Field of Search: 438/121, 438/124, 438/125, 438/126, 438/127
• US Class Current: 438/124
• CPC Class Codes: C23C 14/0694 Halides
• CPC Class Codes: H10K 50/8445 multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
• CPC Class Codes: H10K 71/00 Manufacture or treatment specially adapted for the organic devices covered by this subclass

Abstract

A method of making an encapsulated plasma sensitive device. The method comprises: providing a plasma sensitive device adjacent to a substrate; depositing a plasma protective layer on the plasma sensitive device using a process selected from non-plasma based processes, or modified sputtering processes; and depositing at least one barrier stack adjacent to the plasma protective layer, the at least one barrier stack comprising at least one decoupling layer and at least one barrier layer, the plasma sensitive device being encapsulated between the substrate and the at least one barrier stack, wherein the decoupling layer, the barrier layer, or both are deposited using a plasma process, the encapsulated plasma sensitive device having a reduced amount of damage caused by the plasma compared to an encapsulated plasma sensitive device made without the plasma protective layer. An encapsulated plasma sensitive device is also described.

Claims

1. A method of making an encapsulated plasma sensitive device comprising:

providing a plasma sensitive device adjacent to a substrate;

depositing a plasma protective layer on the plasma sensitive device using a process selected from non-plasma based processes; and

depositing at least one barrier stack adjacent to the plasma protective layer, the at least one barrier stack comprising at least one decoupling layer and at least one barrier layer, the plasma sensitive device being encapsulated between the substrate and the at least one barrier stack, wherein the decoupling layer, the barrier layer, or both are deposited using a plasma process, the encapsulated plasma sensitive device having a reduced amount of damage caused by a plasma compared to an encapsulated plasma sensitive device made without the plasma protective layer.

2. The method of claim 1 wherein the non-plasma based process is a process performed under a vacuum.

3. The method of claim 1 wherein the non-plasma based process is selected from thermal evaporation, electron beam evaporation, chemical vapor deposition, metalorganic chemical vapor deposition, catalytic chemical vapor deposition, laser thermal transfer, evaporation or chemical vapor deposition followed by ion densification, or combinations thereof.

4. The method of claim 1, wherein the non-plasma based process is a process performed at atmospheric pressure.

5. The method of claim 1 wherein the non-plasma based process is selected from spin coating, ink jet printing, screen printing, spraying, gravure printing, offset printing, laser thermal transfer, or combinations thereof.

6. The method of claim 1 wherein the plasma protective layer is an inorganic coating.

7. The method of claim 6 wherein the inorganic coating is selected from LiF, MgF₂, CaF₂, or combinations thereof.

8. The method of claim 1 wherein the plasma protective layer is an organic coating.

9. The method of claim 8 wherein the organic coating is selected from aluminum tris 8-hydroxyquinoline, phthalocyanines, naphthalocyanines, polycyclic aromatics, or combinations thereof.

10. The product produced by the method of claim 1.

11. A method of making an encapsulated plasma sensitive device comprising:

providing a plasma sensitive device adjacent to a substrate;

depositing a plasma protective layer on the plasma sensitive device using a modified sputtering process selected from providing a screen between a target cathode and the plasma sensitive device, applying off-axis sputtering, reducing a time of exposure of the plasma sensitive device to a plasma, reducing the energy of a plasma, or combinations thereof; and

depositing at least one barrier stack adjacent to the plasma protective layer, the at least one barrier stack comprising at least one decoupling layer and at least one barrier layer, the plasma sensitive device being encapsulated between the substrate and the at least one barrier stack, wherein the decoupling layer, the barrier layer, or both are deposited using a plasma process, the encapsulated plasma sensitive device having a reduced amount of damage caused by a plasma compared to an encapsulated plasma sensitive device made without the plasma protective layer.

12. The method of claim 11 wherein the plasma protective layer is selected from AlO_x, SiO_x, or combinations thereof.

13. The method of claim 11 wherein the plasma protective layer is not a baffler layer.

14. The method of claim 11 wherein the modified sputtering process comprises a modified reactive sputtering process.

15. The product produced by the method of claim 11.

16. A method of making an encapsulated plasma sensitive device comprising:

providing a plasma sensitive device adjacent to a substrate;

depositing a plasma protective layer on the plasma sensitive device using a process selected from non-plasma based processes, or modified sputtering processes, the plasma protective layer being made of a dielectric material; and

depositing at least one barrier stack adjacent to the plasma protective layer, the at least one barrier stack comprising at least one decoupling layer and at least one barrier layer, the plasma sensitive device being encapsulated between the substrate and the at least one barrier stack, wherein the decoupling layer, the barrier layer, or both are deposited using a plasma process, the encapsulated plasma sensitive device having a reduced amount of damage caused by a plasma compared to an encapsulated plasma sensitive device made without the plasma protective layer.

17. The method of claim 16 wherein the plasma protective layer is deposited using a non-plasma based process selected from thermal evaporation, electron beam evaporation, chemical vapor deposition, metalorganic chemical vapor deposition, catalytic chemical vapor deposition, laser thermal transfer, evaporation or chemical vapor deposition followed by ion densification, or combinations thereof.

18. The method of claim 16 wherein the plasma protective layer is deposited using a non-plasma based process selected from spin coating, ink jet printing, screen printing, spraying, gravure printing, offset printing, laser thermal transfer, or combinations thereof.

19. The method of claim 16 wherein the plasma protective layer is an inorganic coating.

20. The method of claim 19 wherein the inorganic coating is selected from LiF, MgF₂, CaF₂, or combinations thereof.

21. The method of claim 16 wherein the plasma protective layer is an organic coating.

22. The method of claim 16 wherein the plasma protective layer is selected from AlO_x, SiO_x, or combinations thereof.

23. The method of claim 16 wherein the plasma protective layer is not a baffier layer.

24. The method of claim 16 wherein the plasma protective layer is deposited using a modified sputtering process.

25. The method of claim 24 wherein the modified sputtering process is selected from providing a screen between a target cathode and the plasma sensitive device, applying off-axis sputtering, reducing a time of exposure of the plasma sensitive device to a plasma, reducing the energy of a plasma, or combinations thereof.

26. The method of claim 24 wherein the modified sputtering process comprises a modified reactive sputtering process.