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Method of processing substrate, post-chemical mechanical polishing cleaning method, and method of and program for manufacturing electronic device

  • US 7,510,972 B2
  • Filed: 02/14/2006
  • Issued: 03/31/2009
  • Est. Priority Date: 02/14/2005
  • Status: Active Grant
First Claim
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1. A method of processing a substrate having thereon an insulating film that has been revealed by chemical mechanical polishing, the method comprising:

  • an insulating film exposure step of exposing the revealed insulating film, which has been revealed through the chemical mechanical polishing, to an atmosphere of a mixed gas containing ammonia and hydrogen fluoride under a predetermined pressure; and

    an insulating film heating step of heating to a predetermined temperature the insulating film that has been exposed to the atmosphere of the mixed gas.

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