Method to manufacture high-precision RFID straps and RFID antennas using a laser

• US 7,510,985 B1
• Filed: 10/26/2005
• Issued: 03/31/2009
• Est. Priority Date: 10/26/2005
• Status: Expired due to Fees

• Current Assignee: LPKF Laser & Electronics AG
• Original Assignee: LPKF Laser & Electronics AG
• Inventors: Boenke, Andreas, Meier, Dieter J.
• Primary Examiner(s): EVERHART, CARIDAD
• Application Number:
  US11/260,078
• Time in Patent Office: 1,252 Days
• Field of Search: 438/795, 438/792, 438/662, 438/707, 438/708, 438/940, 257/E21.328, 257/E21.517, 257/E21.596, 257/E21.331, 257/E27.114
• US Class Current: 438/795
• CPC Class Codes: B23K 2101/16 Bands or sheets of indefinite length
• CPC Class Codes: B23K 2101/36 Electric or electronic devices
• CPC Class Codes: B23K 2103/16 Composite materials , e.g. fibre reinforced
• CPC Class Codes: B23K 2103/172 wherein at least one of the layers is non-metallic
• CPC Class Codes: B23K 26/364 for making a groove or trench, e.g. for scribing a break initiation groove
• CPC Class Codes: H01Q 1/2208 associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems methods or arrangements for sensing record carriers, e.g. for reading patterns G06K7/00; record carrier for use with machines and with at least a part designed to carry digital markings G06K19/00
• CPC Class Codes: Y10S 438/904 Charge carrier lifetime control

Abstract

A method is described for the manufacture of structured flexible metallic patterns in which a metallic layer on a flexible substrate is structured using laser ablation. The flexible patterns manufactured in this fashion may be used as interposers (strap) for RFID tags or RFID antennas.

Claims

1. A method of making a RFID component comprising the acts of

a. providing a web, wherein said web comprises an insulating substrate having a conductive coating;

b. exposing a portion of said web to a laser beam, whereby a first structure is formed in said conductive coating, said first structure having a first predetermined geometric shape, said first geometric shape having predetermined features, said features having predetermined dimensions; and

c. moving said web relative to said laser beam wherein a second portion of said web is exposed to said laser beam, whereby a second structure is formed on said second portion, said second structure having a second geometric shape, said second geometric shape being substantially similar to said first geometric shape, said first structure and said second structure when compared to each other for similarity have a tolerance within 3 microns.

2. The method of claim 1, wherein said features have dimensions of at least 20 microns.

3. The method of claim 1, wherein said features have dimensions of at least 10 microns.

4. The method of claim 1, wherein said RFID component is an RFID strap.

5. The method of claim 1, wherein said RFID component is an RFID antenna.

6. The method of claim 5, where said antenna has features comprising winding widths and winding separations.

7. The method of claim 1, wherein the pitch between said first and said second structure has a deviation tolerance of less than 10 micron.

8. The method of claim 1, wherein act “

c”

is accomplished using a reel-to-reel device.

9. The method of claim 1, wherein said web further comprises a flexible organic insulating material.

10. The method of claim 1, wherein said insulating material comprises a thickness of no more than approximately 350 micron.

11. The method of claim 1, wherein said insulating material is selected from the group essentially consisting of polyimides, polyesters, polycarbonates, PEEK, PEK, LCP, and paper.

12. The method of claim 1, wherein said laser beam is produced by a pulsed Excimer laser.

13. The method of claim 12, wherein said laser beam is projected through a laser projection mask, whereby said structure is formed on said web portion.

14. The method of claim 13, wherein said conductive coating comprises a metallic coating having a thickness of at least 50 nanometers.

15. The method of claim 1, whereby said laser beam forms said structures by using an x-y-scanner system in a vectorial writing process.

16. The method of claim 15, wherein said conductive coating comprises a metallic coating having a thickness of at least 50 nanometers.

17. The method of claim 1, wherein said conductive coating comprises a metallic coating having a thickness of at least 50 nanometers.

19. The method of claim 17, wherein said conductive coat is selected from the group essentially consisting of Cu, Ni, Au, Al, Pt, Pd and alloys of the foregoing.

20. The method of claim 1, further comprising the act providing a second metallic coat using galvanic processes, wherein said second coat is provided after said first coat is exposed to said laser beam.

21. The method of claim 20, wherein said second coat comprises materials selected from the group essentially consisting of Cu, Ni, Au, Sn, and a combination of Sn and Pb.

18. The method of 17, wherein a tie coat is sandwiched between said metallic coating and said insulating substrate.

22. A method of making a RFID component comprising the acts of

a. providing a web, wherein said web comprises an insulating substrate having a conductive coating;

b. exposing a portion of said web to a laser beam, said laser beam being produced by a pulsed Excimer laser, whereby a first structure is formed in said conductive coating, said first structure having a first predetermined geometric shape, said first geometric shape having predetermined features, said features having predetermined dimensions; and

c. moving said web relative to said laser beam wherein a second portion of said web is exposed to said laser beam, whereby a second structure is formed on said second portion, said second structure having a second geometric shape, said second geometric shape being substantially similar to said first geometric shape.

23. The method of claim 22, wherein said first structure and said second structure when compared to each other for similarity have a tolerance within 3 microns.