Semi-automatic multiplexing system for automated semiconductor wafer testing

• US 7,511,517 B2
• Filed: 11/08/2005
• Issued: 03/31/2009
• Est. Priority Date: 11/08/2005
• Status: Active Grant

• Current Assignee: QualiTau, Inc. (QualiTau Ltd.)
• Original Assignee: QualiTau, Inc. (QualiTau Ltd.)
• Inventors: Anderson, Michael L., Mostarshed, Shahriar
• Primary Examiner(s): Nguyen; Ha Tran T
• Assistant Examiner(s): Nguyen; Tung X
• Application Number:
  US11/270,371
• Publication Number:
  US 20070103176A1
• Time in Patent Office: 1,239 Days
• Field of Search: 324/754, 324761-762, 324/765, 324/158.1, 324/763, 439/41, 439/476.1, 397/330, 397/332, 257/48, 438/14, 438/17, 438/18
• US Class Current: 324/756.05
• CPC Class Codes: G01R 1/07385 using switching of signals between probe tips and test bed, i.e. the standard contact matrix which in its turn connects to the tester
• CPC Class Codes: G01R 31/2889 Interfaces, e.g. between probe and tester G01R31/31905 and G01R1/07364 take precedence

Abstract

A semi-automatic multiplexing system for automated semiconductor wafer testing employs a jumper block for each device type in the semiconductor wafer to be tested, each jumper block having inputs for receiving a test input/output line, a plurality of block contacts corresponding to pads of a device to be tested, and manually set connectors or jumper cables for selectively interconnecting jumper block inputs to block contacts. A multiplexer is then used for selectively connecting tester input/output lines to the jumper blocks, thereby reducing the number of relays required for connecting test signals to the devices in the semiconductor wafer.

Claims

1. A parametric test system for testing devices in dice in a semiconductor wafer, each die having a plurality of pads for electrically connecting to the device in the die, comprising:

a) a tester having a plurality of input/output lines for providing and receiving electrical signals during test,

b) a wafer prober having probe contacts for engaging pads on a die,

c) a jumper block for each device type in the semiconductor wafer, each jumper block having

inputs for receiving tester input/output lines,

a plurality of contacts corresponding to pads of a device to be tested and connected with probe contacts, and

manually settable connectors for selectively interconnecting jumper block inputs to block contacts, the interconnection such that each jumper block input is manually connectable to any one of the corresponding block contacts and each jumper block input is connected to one and only one block contact, and

d) a multiplexer comprising a plurality of relays, for selectively connecting tester input/output lines to jumper blocks based on a setting of the relays.

2. The parametric test system of claim 1 wherein the manually set connectors of a jumper block comprise jumper cables.

3. The parametric test system of claim 2 wherein the tester provides N source lines for M different devices, the multiplexer comprising M×

N relays.

4. The parametric test system of claim 3 wherein the tester provides four source signals to 12 different devices and the multiplexer comprises 48 relays.

5. The parametric test system of claim 1 wherein the tester provides N source lines for M different devices, the multiplexer comprising M×

N relays.

6. A method of multiplexing test signals from a parametric tester to pads of different devices in dice of a semiconductor wafer comprising the steps of:

a) providing a jumper block for each device, the block including inputs for receiving test signals, block contacts corresponding to probe contacts which engage pads of devices,

b) connecting block contacts to probe contacts through jumper blocks,

c) multiplexing test signals to jumper blocks based on a setting of relays of a multiplexer; and

d) manually setting the connectors to, for each jumper block, interconnect the block contacts of that jumper block such that each jumper block input of that jumper block is manually connectable to one of the corresponding block contacts of that jumper block and each jumper block input of that jumper block is connected to one and only one block contact of that jumper block.

7. The method of claim 6 wherein N test signals are applied to M different devices, and the multiplexing requires M×

N relays.

8. The method of claim 7 wherein four source signals are connected to twelve different devices and the multiplexing requires 12 relays.