Universal wafer carrier for wafer level die burn-in
First Claim
1. A fixture for testing a wafer of semiconductor dice comprising:
- a first rigid support member for receiving the semiconductor dice in wafer form, the first rigid support member having a plurality of contact members thereon, the plurality of contact members including a plurality of contact tips including at least one contact area for mating with a plurality of bumps on the wafer and a plurality of connectors for connection with test circuitry connected to the fixture, the first rigid support member configured to have a portion thereof for receipt in a portion of a cavity in a second support member.
0 Assignments
0 Petitions
Accused Products
Abstract
A reusable burn-in/test fixture for testing unsingulated dice on a semiconductor wafer consisting of two halves. The first half of the test fixture is a wafer cavity plate for receiving the wafer, and the second half establishes electrical communication between the wafer and electrical testing equipment. A rigid substrate has conductors thereon which establish electrical contact with the wafer. The test fixture need not be opened until the burn-in and electrical testing are completed. After burn-in stress and electrical testing, it is possible to establish interconnection between the single die or separate and package dice into discrete parts, arrays or clusters, either as singulated parts or as arrays.
51 Citations
16 Claims
-
1. A fixture for testing a wafer of semiconductor dice comprising:
a first rigid support member for receiving the semiconductor dice in wafer form, the first rigid support member having a plurality of contact members thereon, the plurality of contact members including a plurality of contact tips including at least one contact area for mating with a plurality of bumps on the wafer and a plurality of connectors for connection with test circuitry connected to the fixture, the first rigid support member configured to have a portion thereof for receipt in a portion of a cavity in a second support member. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16)
Specification