Thin profile battery bonding method, method of conductively interconnecting electronic components, battery powerable apparatus, radio frequency communication device, and electric circuit
First Claim
Patent Images
1. A radio frequency communication device comprising:
- a flexible substrate;
a dipole antenna;
a flexible conductive path disposed on the substrate, the conductive path including a first portion and a second portion;
an RFID integrated circuit mounted to the substrate and electrically coupled to the first portion of the conductive path and to the antenna using a conductive adhesive, the integrated circuit including a processor, a modulated backscatter transmitter coupled to the processor, a receiver coupled to the processor, and a wake-up circuit coupled to the receiver and configured to selectively activate the receiver; and
a thin profile battery conductively bonded with the second portion of the conductive path by a conductive adhesive including a silane.
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Accused Products
Abstract
A curable adhesive composition is provided. A battery and a substrate to which the battery is to be conductively connected are also provided. The adhesive composition is interposed between the battery and the substrate. In another aspect, a curable epoxy composition is interposed between first and second electrically conductive components. In another aspect, a battery powerable apparatus, such as an RF communication device or RFID device, is coupled to a battery via a conductive epoxy. In another aspect, first and second electric components are electrically connected with one another through a conductive epoxy.
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Citations
17 Claims
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1. A radio frequency communication device comprising:
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a flexible substrate; a dipole antenna; a flexible conductive path disposed on the substrate, the conductive path including a first portion and a second portion; an RFID integrated circuit mounted to the substrate and electrically coupled to the first portion of the conductive path and to the antenna using a conductive adhesive, the integrated circuit including a processor, a modulated backscatter transmitter coupled to the processor, a receiver coupled to the processor, and a wake-up circuit coupled to the receiver and configured to selectively activate the receiver; and a thin profile battery conductively bonded with the second portion of the conductive path by a conductive adhesive including a silane. - View Dependent Claims (2)
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3. A radio frequency communication device comprising:
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a flexible substrate; a dipole antenna; a flexible conductive path disposed on the substrate, the conductive path including a first portion and a second portion; an RFID integrated circuit mounted to the substrate and electrically coupled to the first portion of the conductive path and to the antenna using a conductive adhesive, the integrated circuit including a processor, a modulated backscatter transmitter coupled to the processor, a receiver coupled to the processor, and a wake-up circuit coupled to the receiver and configured to selectively activate the receiver; and a thin profile battery conductively bonded with the second portion of the conductive path by a conductive adhesive; wherein the integrated circuit includes a frequency lock loop configured to supply clock signals to the receiver and transmitter, the frequency lock loop including a current source having a thermal voltage generator, and a current controlled oscillator having a plurality of selectively engageable current mirrors multiplying the current of the current source.
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4. A radio frequency communication device comprising:
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a flexible substrate; a dipole antenna disposed on the substrate; flexible conductive paths disposed on the substrate, the conductive paths including a first portion and a second portion; an RFID integrated circuit mounted to the substrate and electrically coupled to the first portion of the conductive paths and to the antenna; and a thin profile battery conductively bonded with the second portion of the conductive paths by a conductive adhesive including a silane. - View Dependent Claims (5, 6, 7, 8, 9, 10)
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11. A radio frequency communication device comprising:
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a flexible substrate; a dipole antenna disposed on the substrate; flexible conductive paths disposed on the substrate, the conductive paths including a first portion and a second portion; an RFID integrated circuit mounted to the substrate and electrically coupled to the first portion of the conductive paths and to the antenna, wherein the integrated circuit includes a processor, a modulated backscatter transmitter coupled to the processor, and a receiver coupled to the processor; and a thin profile battery conductively bonded with the second portion of the conductive paths by a conductive adhesive; wherein the integrated circuit includes a frequency lock loop configured to supply clock signals to the receiver and transmitter, the frequency lock loop including a current source having a thermal voltage generator, and a current controlled oscillator having a plurality of selectively engageable current mirrors multiplying the current of the current source.
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12. A radio frequency communication device comprising:
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a flexible substrate; a dipole antenna disposed on the substrate; flexible conductive paths disposed on the substrate, the conductive paths including a first portion and a second portion; an RFID integrated circuit mounted to the substrate and electrically coupled to the first portion of the conductive paths and to the antenna; and a thin profile battery conductively bonded with the second portion of the conductive paths by a conductive adhesive; wherein the integrated circuit includes a microprocessor, a receiver configured to receive radio frequency commands from an interrogation device and having an output coupled to the microprocessor, a transmitter configured to transmit a signal identifying the device to the interrogator in response to a command from the microprocessor, and a wake-up timer circuit coupled to the receiver and configured to determine if a signal received by the receiver is a radio frequency command from the interrogation device, the integrated circuit at times switching between a sleep mode and a receiver-on mode, more power being consumed in the receiver-on mode than in the sleep mode, the integrated circuit switching from the receiver-on mode to a microprocessor-on mode in response to receiving a signal indicating that a communication received by the receiver is a radio frequency command from the interrogation device.
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13. A radio frequency communication device comprising:
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a flexible substrate; a dipole antenna disposed on the substrate; flexible conductive paths disposed on the substrate, the conductive paths including a first portion and a second portion; an RFID integrated circuit mounted to the substrate and electrically coupled to the first portion of the conductive paths and to the antenna; and a thin profile battery conductively bonded with the second portion of the conductive paths by a conductive adhesive; wherein the dipole antenna has first and second portions which define, in operation, first and second poles of the dipole antenna, respectively, and wherein the integrated circuit includes a transmitter and a receiver, the transmitter being switchable between a backscatter mode, wherein a carrier for the transmitter is derived from a carrier received from an interrogator and the integrated circuit alternately reflects or does not reflect the carrier from the interrogator by shorting or isolating the first and second portions of the dipole antenna to transmit data to the interrogator, and an active mode, wherein a carrier for the transmitter is generated by the integrated circuit itself, the transmitter being configured to switch between the backscatter and active modes in response to a radio frequency command received by the receiver.
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14. A radio frequency identification (RFID) device, comprising:
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a substrate; a battery; an RFID integrated circuit mounted on the substrate; and a cured adhesive including a silane and an epoxy configured to be conductive at least after being cured, the cured adhesive applied between the battery and the substrate; and wherein the adhesive is cured into an electrically conductive bond electrically coupling the battery to the substrate to connect the RFID integrated circuit to the battery. - View Dependent Claims (15, 16, 17)
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Specification