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Polymide substrate bonded to other substrate

  • US 7,512,297 B2
  • Filed: 10/01/2007
  • Issued: 03/31/2009
  • Est. Priority Date: 05/02/2003
  • Status: Expired due to Fees
First Claim
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1. A substrate for a circuit structure comprising:

  • a planar substrate mass of bulk polyimide material having a first side and a second side, said first side having a surface smoothness between about 0.025 μ

    inch and 100 μ

    inch, capable of receiving a circuit structure.

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