Method of controlling contact load in electronic component mounting apparatus

• US 7,513,036 B2
• Filed: 08/31/2005
• Issued: 04/07/2009
• Est. Priority Date: 09/01/2004
• Status: Expired due to Fees

• Current Assignee: Panasonic Corporation (Panasonic Holdings Corporation)
• Original Assignee: Panasonic Corporation (Panasonic Holdings Corporation)
• Inventors: Yoshida, Noriaki, Ueno, Yasuharu, Morikawa, Makoto, Yoshida, Hiroyuki, Hirata, Shuichi
• Primary Examiner(s): Kim; Paul D
• Application Number:
  US10/596,218
• Publication Number:
  US 20070056157A1
• Time in Patent Office: 1,315 Days
• Field of Search: 295/93, 297/39, 297/40, 297/42, 297/43, 298/33, 298/34, 298/36, 324/758, 324/765, 324/754, 324/755, 414/737, 414/749.3, 901/20
• US Class Current: 29/834
• CPC Class Codes: B23K 3/087 Soldering or brazing jigs, fixtures or clamping means
• CPC Class Codes: B23K 37/047 moving work to adjust its position between soldering, welding or cutting steps B23K37/053 takes precedence
• CPC Class Codes: H01L 2224/75502 in the upper part of the bonding apparatus, e.g. in the bonding head
• CPC Class Codes: Y10T 29/49004 including measuring or testing of device or component part
• CPC Class Codes: Y10T 29/4913 Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/49133 with component orienting
• CPC Class Codes: Y10T 29/49137 Different components
• CPC Class Codes: Y10T 29/53187 Multiple station assembly apparatus

Abstract

A method of controlling contact load in an apparatus for mounting electronic components on a substrate, in which a head is lowered at high speed to slow down starting position where there is no risk that the electronic component makes contact with the substrate (S1), and from there the head is lowered at low speed until a predetermined target contact load is detected. The process of lowering the head at low speed includes the steps of moving down the head a predetermined distance (S3), measuring load after the step of moving down the head (S5), and determining whether the measured contact load has reached the target contact load (S9). The steps of moving down the head (S3) and measuring the load (S5) are repeated until the measured load reaches the target contact load. The actual load is precisely controlled to be close to a very small set level of target contact load. Accordingly, electronic components using low dielectric constant material are mounted without the risk of damage.

Claims

1. A method of controlling contact load in an apparatus for mounting electronic components on a substrate, in which a head holding an electronic component is lowered at a first speed to a first position where the electronic component does not contact the substrate, and is lowered at a second speed slower than the first speed from the first position until a predetermined target contact load is detected, the method comprising:

moving the head down by a predetermined distance at the second speed;

measuring contact load after moving the head down; and

determining whether the measured contact load has reached the target contact load, the moving and measuring being repeated until the measured contact load reaches the predetermined target contact load,

wherein the predetermined distance is set at a first predetermined distance when the measured contact load is zero, and is set at a second predetermined distanced when the measured contact load exceeds zero, the second predetermined distance being smaller than the first predetermined distance,

wherein the head is incrementally moved downward without being moved upward, and

wherein the head moves in increments of either the first predetermined distance or the second predetermined distance.

2. The method of controlling contact load in an apparatus for mounting electronic components according to claim 1, further comprising:

halting the head for a predetermined period of time after moving the head down and before measuring the contact load.

3. The method of controlling contact load in an apparatus for mounting electronic components according to claim 1,

wherein the predetermined distance is adjustably set in accordance with the target contact load.

4. The method of controlling contact load in an apparatus for mounting electronic components according to claim 1,

wherein the second predetermined distance is adjustably set in accordance with a difference between the measured contact load and the target contact load.

5. The method of controlling contact load in an apparatus for mounting electronic components according to claim 1,

wherein, when the measured contact load is the same as the previously measured contact load after the measured contact load exceeds zero, the measuring of the contact load is repeated until a different contact load is measured.

6. The method of controlling contact load in an apparatus for mounting electronic components according to claim 1,

wherein the predetermined distance is adjustably set such that the moving and measuring need be repeated until the measured contact load reaches the predetermined target contact load.

7. The method of controlling contact load in an apparatus for mounting electronic components according to claim 1,

wherein the predetermined distance is adjustably set within a range of 0.2 μ

m to several μ

m.