Method of fabricating electromechanical device having a controlled atmosphere
First Claim
1. A method of sealing a chamber of an electromechanical device having a mechanical structure, wherein the mechanical structure is in the chamber and wherein the chamber includes a fluid that is capable of providing mechanical damping for the mechanical structure, the method comprising:
- depositing a sacrificial layer over at least a portion of the mechanical structure;
depositing a first encapsulation layer over the sacrificial layer;
forming at least one vent through the first encapsulation layer to expose at least a portion of the sacrificial layer;
removing at least a portion of the sacrificial layer to form the chamber;
introducing at least one relatively stable gas into the chamber; and
depositing a second encapsulation layer in the at least one vent to seal the chamber wherein the second encapsulation layer is a semiconductor material and wherein the fluid within the chamber includes the relatively stable gas.
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Accused Products
Abstract
There are many inventions described and illustrated herein. In one aspect, the present invention is directed to a technique of fabricating or manufacturing MEMS having mechanical structures that operate in controlled or predetermined mechanical damping environments. In this regard, the present invention encapsulates the mechanical structures within a chamber, prior to final packaging and/or completion of the MEMS. The environment within the chamber containing and/or housing the mechanical structures provides the predetermined, desired and/or selected mechanical damping. The parameters of the encapsulated fluid (for example, the gas pressure) in which the mechanical structures are to operate are controlled, selected and/or designed to provide a desired and/or predetermined operating environment.
188 Citations
32 Claims
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1. A method of sealing a chamber of an electromechanical device having a mechanical structure, wherein the mechanical structure is in the chamber and wherein the chamber includes a fluid that is capable of providing mechanical damping for the mechanical structure, the method comprising:
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depositing a sacrificial layer over at least a portion of the mechanical structure; depositing a first encapsulation layer over the sacrificial layer; forming at least one vent through the first encapsulation layer to expose at least a portion of the sacrificial layer; removing at least a portion of the sacrificial layer to form the chamber; introducing at least one relatively stable gas into the chamber; and depositing a second encapsulation layer in the at least one vent to seal the chamber wherein the second encapsulation layer is a semiconductor material and wherein the fluid within the chamber includes the relatively stable gas. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A method of sealing a chamber of an electromechanical device having a mechanical structure, wherein the mechanical structure resides in the chamber and wherein the chamber includes a fluid having a pressure that provides mechanical damping for the mechanical structure, the method comprising:
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depositing a first encapsulation layer over the mechanical structure; forming at least one vent through the first encapsulation layer; forming the chamber; depositing a second encapsulation layer by introducing at least one gaseous deposition reagent into an epitaxial or a CVD reactor to thereby deposit a second encapsulation layer in the vent to seal the chamber wherein the second encapsulation layer is a semiconductor material; and wherein the fluid within the chamber includes at least one by-product resulting from depositing a second encapsulation layer and wherein the pressure of the fluid is sufficient to provide a predetermined mechanical damping for the mechanical structure. - View Dependent Claims (12, 13, 14, 15, 16, 17, 18, 19, 20)
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21. A method of sealing a chamber of a microelectromechanical device having a mechanical structure, wherein the mechanical structure resides in the chamber and wherein the chamber includes a fluid having a pressure that provides mechanical damping for the mechanical structure, the method comprising:
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depositing a first encapsulation layer on a sacrificial layer disposed on the mechanical structure; removing at least a portion of the sacrificial layer to form a chamber; introducing at least one relatively stable gas into the chamber; and depositing a second encapsulation layer on the first encapsulation layer to seal the chamber wherein the second encapsulation layer is a semiconductor material and wherein the fluid within the chamber includes the relatively stable gas. - View Dependent Claims (22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32)
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Specification