Chuck for holding a device under test

• US 7,514,915 B2
• Filed: 10/23/2007
• Issued: 04/07/2009
• Est. Priority Date: 09/05/2000
• Status: Expired due to Fees

• Current Assignee: Cascade Microtech Incorporated (FormFactor Incorporated)
• Original Assignee: Cascade Microtech Incorporated (FormFactor Incorporated)
• Inventors: Dunklee, John
• Primary Examiner(s): Karlsen; Ernest F
• Application Number:
  US11/977,052
• Publication Number:
  US 20080048648A1
• Time in Patent Office: 532 Days
• Field of Search: 324754-765, 324/158.1, 174/137.R, 174/150
• US Class Current: 324/756.01
• CPC Class Codes: G01R 31/2887 involving moving the probe head or the IC under test; docking stations moving single probes G01R1/06705; moving individual probes in multiple probes G01R1/07392
• CPC Class Codes: H01L 21/68785 characterised by the mechanical construction of the susceptor, stage or support
• CPC Class Codes: Y10T 279/11 Vacuum
• CPC Class Codes: Y10T 279/35 Miscellaneous

Abstract

A chuck for a probe station.

Claims

1. A chuck for a probe station comprising:

(a) a first chuck assembly element having a lower surface and an upper surface thereon suitable to support a wafer;

(b) a second chuck assembly element having an upper surface and a lower surface where the upper surface is in opposing relationship to said lower surface of said first chuck assembly element;

(c) a chuck spacing mechanism interconnecting said first and second chuck assembly elements and defining the spacing between said first and second chuck assembly elements; and

(d) said chuck spacing mechanism including an insulator having a first surface in pressing engagement with said upper surface of said second chuck assembly element and a second surface spaced apart from said lower surface of said first chuck assembly and in pressing engagement with a first surface of a conductive spacer, a second surface of said conductive spacer in pressing engagement with said lower surface of said first chuck assembly element, where said first surface of said insulator in pressing engagement with said upper surface opposes said second surface and is substantially coextensive with said second surface of said insulator in pressing engagement with said conductive spacer.

2. The chuck of claim 1 wherein said chuck spacing mechanism includes a central member extending there through.

3. The chuck of claim 2 wherein said central member is rigidly attachable to said first chuck assembly element.

4. The chuck of claim 3 wherein said central member is electrically isolated from said second chuck assembly element.

5. The chuck of claim 4 wherein said central member secures said first and second chuck assembly elements together with said insulator and said conductive spacer defining said spacing.