Method of and system for functionally testing multiple devices in parallel in a burn-in-environment

• US 7,514,947 B2
• Filed: 08/31/2007
• Issued: 04/07/2009
• Est. Priority Date: 08/31/2007
• Status: Expired due to Fees

• Current Assignee: International Business Machines Corporation
• Original Assignee: International Business Machines Corporation
• Inventors: Eby, Timothy J., James, Norman K., Hamilton, Michael J., Bronk, William T., Albert, Jason T.
• Primary Examiner(s): Nguyen; Ha Tran T
• Assistant Examiner(s): Velez; Roberto
• Application Number:
  US11/848,282
• Publication Number:
  US 20090058450A1
• Time in Patent Office: 585 Days
• Field of Search: 324/760
• US Class Current: 324/750.05
• CPC Class Codes: G01R 31/2868 Complete testing stations; systems; procedures; software aspects

Abstract

A method of and a system for testing semiconductor devices heat a plurality of devices to a burn-in temperature, and perform functional tests in parallel on the plurality of devices at the burn-in temperature. Systems include a burn-in oven and a test multiplexer. The burn-in oven is adapted to receive and heat the devices to the burn-in temperature. The test multiplexer is adapted to apply functional test signals to and receive output signals from the devices in the burn-in oven.

Claims

1. A method of testing semiconductor devices, said method comprising:

simultaneously heating a plurality of devices to a burn-in temperature;

producing a set of device functional test input signals;

producing a test select signal;

producing a voltage control signal;

multiplexing said set of device functional test input signals to selected ones of said devices selected according to said test select signal at said burn-in temperature;

applying said set of device functional test input signals to said selected ones of said devices at a test voltage according to said voltage control signal;

receiving device functional test output signals from said selected ones of said devices at said burn-in temperature; and

,

demultiplexing device functional test output signals received from said selected ones of said devices at said burn-in temperature.

2. The method as claimed in claim 1, wherein:

test voltage is higher than a normal operating voltage for said selected devices.

3. The method as claimed in claim 1, further comprising:

detecting failed devices at said burn-in temperature.

4. The method as claimed in claim 3, further comprising:

rejecting said failed devices.

5. The method as claimed in claim 1, further comprising:

serializing said device functional test input signals multiplexed to said selected devices.

6. The method as claimed in claim 5, further comprising:

de-serializing said serialized device functional test input signals.

7. The method as claimed in claim 1, further comprising:

serializing said device functional test output signals prior to demultiplexing said device functional test output signals.

8. The method as claimed in claim 7, further comprising:

de-serializing said serialized device functional test output signals prior to demultiplexing said device functional test signals.

9. The method as claimed in claim 1, wherein said burn-in temperature is at least 100°

C.

10. The method as claimed in claim 9, wherein said burn-in temperature is at least 125°

C.

11. The method as claimed in claim 1, further comprising:

maintaining said devices at said burn-in temperature for at least 48 hours.

12. The method as claimed in claim 11, further comprising:

maintaining said devices at said burn-in temperature for at least 168 hours.

13. A semiconductor device testing system, which comprises:

a burn-in oven adapted to receive a plurality of devices;

a flexible service processor, said flexible service processor being configured to generate device test input signals and receive device test output signals, said flexible service processor being further configured to generate test select signals and voltage control signals;

a test multiplexer connected to receive device test signals from said flexible service processor and supply device test output signals to said flexible service processor, said test multiplexer being configured to multiplex said device test signals to selected devices in said burn-in oven under control of said test select signals at selected voltages under control of said voltage control signals, said test multiplexer being further configured to receive device test output signals from said devices and selectively provide device test output signals from selected devices under control of said test select signals.

14. The system as claimed claim 13, wherein said test multiplexer comprises:

a Joint Test Action Group multiplexer.

15. The system as claimed in claim 13, further comprising:

a first serializer connected to receive parallel multiplexed device test input signals from said test multiplexer and convert said parallel multiplexed device test input signals to a serial input bit stream;

a first de-serializer connected to receive said serial input bit stream and convert said serial input bit stream to parallel device test input signals, said first de-serializer being further connected to supply said parallel device test input signal to said devices in said burn-in oven;

a second serializer connected to receive parallel test output signals from said devices in said burn-in oven and convert said parallel test output signals to a serial output bit stream;

a second de-serializer connected to receive said serial output bit stream and convert said serial output bit stream to parallel output signals, said second de-serializer being further connected to supply said parallel output signals to said test multiplexer.

16. The system as claimed in claim 13, wherein said burn-in oven is adapted to maintain said devices at a burn-in temperature of at least 100°

C.

17. The system as claimed in claim 16, wherein said burn-in oven is adapted to maintain said devices at a burn-in temperature of at least 125°

C.

18. The system as claimed in claim 16, wherein said burn-in oven is adapted to maintain said devices at said burn-in temperature for at least 48 hours.

19. The system as claimed in claim 16, wherein said burn-in oven is adapted to maintain said devices at said burn-in temperature for at least 168 hours.