Non-resonant antennas embedded in wireless peripherals

• US 7,515,106 B2
• Filed: 12/29/2004
• Issued: 04/07/2009
• Est. Priority Date: 12/29/2004
• Status: Expired due to Fees

• Current Assignee: Avago Technologies International Sales Pte Limited (Broadcom, Inc.)
• Original Assignee: Avago Technologies General IP PTE Limited (Broadcom, Inc.)
• Inventors: Brosnan, Michael J.
• Primary Examiner(s): Chen, Shih-Chao
• Application Number:
  US11/025,215
• Publication Number:
  US 20060141958A1
• Time in Patent Office: 1,560 Days
• Field of Search: 343/700, 343/873, 343/872, 343/700.MS, 343/702, 343/866
• US Class Current: 343/700.0MS
• CPC Class Codes: H01Q 1/2258 used with computer equipment
• CPC Class Codes: H01Q 1/40 Radiating elements coated with or embedded in protective material
• CPC Class Codes: H01Q 7/00 Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop

Abstract

A peripheral apparatus includes a housing, a semiconductor device, and an antenna. The peripheral apparatus generates and transmits radio frequency (RF) control signals to a host device. The semiconductor device is contained within the housing and generates the RF control signals. The antenna is fully contained within the semiconductor device and transmits the RF control signals to the host device.

Claims

1. A peripheral apparatus for generating and transmitting radio frequency (RF) control signals to a host device, the peripheral apparatus comprising:

a housing;

a semiconductor device contained within the housing and that generates and sends the RF control signals, wherein the semiconductor device further comprises a leadframe and a plurality of semiconductor layers formed on the leadframe; and

an antenna fully contained within the semiconductor device for transmitting the RF control signals to the host device, wherein the antenna is formed directly on the leadframe, and wherein the antenna comprises a metal trace formed in contact with a layer of the leadframe.

2. The apparatus of claim 1, wherein the semiconductor device further comprises a plurality of semiconductor layers, and including at least one metal layer.

3. The apparatus of claim 1, wherein the antenna is formed within a 5 millimeter×

5 millimeter space of the semiconductor device.

4. The apparatus of claim 1, wherein the antenna has a total length between 30 millimeters and 300 millimeters.

5. The apparatus of claim 4, wherein the sending RF control signals are transmitted at a frequency between 27 MHz and 2.4 GHz.

6. The apparatus of claim 1, wherein the antenna is formed within a 12 millimeter×

12 millimeter space of the leadframe.

7. The apparatus of claim 1, wherein the antenna is a loop antenna having a total length between 100 millimeters and 500 millimeters.

8. The apparatus of claim 7, wherein the sending RF control signals are transmitted at a frequency between 27 MHz and 2.4 GHz.

9. The apparatus of claim 1, wherein the antenna is a loop antenna with a plurality of loops.

10. A peripheral apparatus comprising:

a peripheral apparatus housing; and

a semiconductor device mounted within the peripheral apparatus housing for generating and sending radio frequency (RF) control signals to a host device, the semiconductor device further comprising;

a leadframe;

a plurality of semiconductor layers;

a plurality of metallization layers;

an antenna, wherein the antenna is formed directly on the leadframe, and wherein the antenna comprises a metal trace formed in contact with a layer of the leadframe; and

a plastic housing containing the leadframe, the plurality of semiconductor layers, and the antenna.

11. The apparatus of claim 10, wherein the sending RF control signals are transmitted at a frequency between 27 MHz and 2.4 GHz.

12. A method for fabricating a semiconductor device for use in a peripheral device that generates and sends radio frequency (RF) control signals to a host device, the method comprising:

providing a leadframe;

attaching a semiconductor chip with layers of semiconductor material onto the leadframe;

providing metallization layers;

fabricating an antenna on the leadframe, wherein the antenna comprises a metal trace formed in contact with a layer of the leadframe; and

encapsulating the leadframe, the semiconductor chip, the metallization layers, and the antenna in a plastic housing.