Method for forming radio frequency antenna
First Claim
1. An RF antenna comprising:
- a substrate layer;
a seed layer on top of the substrate layer in an antenna coil pattern, the seed layer including bond pads;
a conductive layer contacting the seed layer over portions of the antenna coil pattern, wherein the conductive layer does not cover at least a portion of the bond pads;
the RF antenna wherein the antenna has a removed short region across the coil pattern;
the RF antenna wherein the removed short region comprising a portion of the seed layer not covered by the conductive layer or comprising a portion of the seed layer wherein the conductive layer is thinner than the remaining portion of the conductive layer.
0 Assignments
0 Petitions
Accused Products
Abstract
A metalized circuit suitable for application as a radio frequency antenna is produced by forming an antenna coil pattern on a flexible substrate. The antenna coil pattern is formed using a conductive ink which is patterned on the substrate. The conductive ink is cured and an electrical-short layer is formed across the coils of the conductive ink pattern. An insulating layer is formed over top of the electrical-short layer, a metal layer electroplated on top of the conductive layer, and then the electrical-short layer is removed. The use of the electrical-short layer during the electroplating allows for the voltage at the different points on the conductive ink layer to be relatively similar, so that a uniform electroplate layer is formed on top of the conductive ink layer. This results in a better quality radio frequency antenna at a reduced cost.
-
Citations
9 Claims
-
1. An RF antenna comprising:
-
a substrate layer; a seed layer on top of the substrate layer in an antenna coil pattern, the seed layer including bond pads; a conductive layer contacting the seed layer over portions of the antenna coil pattern, wherein the conductive layer does not cover at least a portion of the bond pads; the RF antenna wherein the antenna has a removed short region across the coil pattern; the RF antenna wherein the removed short region comprising a portion of the seed layer not covered by the conductive layer or comprising a portion of the seed layer wherein the conductive layer is thinner than the remaining portion of the conductive layer. - View Dependent Claims (2, 3, 4)
-
-
5. An RF antenna comprising:
-
a substrate layer; a seed layer on top of the substrate layer in an antenna pattern, the seed layer including bond pads; a conductive layer contacting the seed layer over portions of the antenna pattern, wherein the conductive layer does not cover at least a portion of the bond pads; the RF antenna wherein the antenna has a removed short region across the antenna pattern; the RF antenna wherein the removed short region comprising a portion of the seed layer not covered by the conductive layer or comprising a portion of the seed layer wherein the conductive layer is thinner than the remaining portion of the conductive layer. - View Dependent Claims (6, 7, 8, 9)
-
Specification