Lithographic apparatus and device manufacturing method

• US 7,515,281 B2
• Filed: 09/13/2005
• Issued: 04/07/2009
• Est. Priority Date: 04/08/2005
• Status: Active Grant

• Current Assignee: ASML Netherlands BV (ASML Holding NV)
• Original Assignee: ASML Netherlands BV (ASML Holding NV)
• Inventors: Van der Pasch, Engelbertus Antonius Fransiscus, Loopstra, Erik Roelof
• Primary Examiner(s): Lauchman; L. G.
• Assistant Examiner(s): Slomski; Rebecca C
• Application Number:
  US11/224,308
• Publication Number:
  US 20060227309A1
• Time in Patent Office: 1,302 Days
• Field of Search: 356614-623, 356399-401, 356/603, 250/559.3, 250/559.4
• US Class Current: 356/616
• CPC Class Codes: G03F 7/70775 Position control, e.g. interferometers or encoders for determining the stage position

Abstract

A lithographic apparatus includes a displacement measuring system configured to measure the position of a substrate table in at least three degrees of freedom. The displacement measuring system includes a first x-sensor configured to measure the position of the substrate table in a first direction and a first and a second y-sensor configured to measure the position of the substrate table in a second direction. Said displacement measuring system further comprises a second x-sensor. The first and second x-sensor and first and second y-sensors are encoder type sensors configured to measure the position of each of the sensors with respect to at least one grid plate. The displacement measuring system is configured to selectively use, depending on the position of the substrate table, three of the first and second x-sensors and the first and second y-sensors to determine the position of the substrate table in three degrees of freedom.

Claims

1. A lithographic apparatus comprising:

a substrate table configured to hold a substrate;

a projection system configured to project a patterned beam onto a target portion of the substrate; and

a displacement measuring system configured to measure a position of said substrate table, wherein said displacement measuring system comprises at least one encoder type x-sensor mounted on said substrate table and configured to measure the position of the substrate table in a first direction with respect to two or more substantially stationary adjacent grid plates, said displacement measuring system being configured to continuously measure the position of said substrate table when crossing a crossing line between said two or more adjacent grid plates.

2. The lithographic apparatus of claim 1, wherein said two or more grid plates cover all possible locations of said substrate table, so that continuous position measurement of said substrate table is possible.

3. The lithographic apparatus of claim 1, wherein said displacement measuring system comprises a second encoder-type x-sensor mounted on said substrate table and configured to measure the position of the substrate table in said first direction with respect to said two or more adjacent grid plates, said displacement measuring system being configured to selectively use, depending on the position of said substrate table, one of said first and second x-sensors to determine the position of said substrate table in said first direction.

4. The lithographic apparatus of claim 3, wherein said displacement measuring system is configured to measure the position of said substrate table in at least three coplanar degrees of freedom (x, y, Rz), wherein said displacement measuring system further comprises:

a first and a second encoder-type y-sensor mounted on said substrate table and configured to measure the position of the substrate table in a second direction with respect to said two or more adjacent grid plates,

said displacement measuring system being configured to selectively use, depending on the position of said substrate table, three of said first and second x-sensors and said first and second y-sensors to determine the position of said substrate table in said three degrees of freedom.

5. The lithographic apparatus of claim 4, wherein each of said x-sensors and y-sensors is spaced from the other of the said x-sensors and y-sensors at least in a direction perpendicular to the direction of said crossing line.

6. The lithographic apparatus of claim 4, wherein each of said x-sensors and y-sensors is spaced from the other of the said x-sensors and y-sensors at least in a direction perpendicular to said first and/or said second direction.

7. The lithographic apparatus of claim 4, wherein said displacement measuring system comprises four z-sensors to measure the position of the substrate table in a direction perpendicular to the first and the second direction, said displacement measuring system being configured to selectively use, depending on the position of said substrate table, three of said four z-sensors to determine the position of said substrate table in three further degrees of freedom (z, Rx, Ry).

8. The lithographic apparatus of claim 7, wherein each of said four z-sensors is spaced from the other of said z-sensors in at least a direction perpendicular to the direction of said crossing line.

9. The lithographic apparatus of claim 7, wherein each of the z-sensors is spaced from the other three z-sensors in at least a direction perpendicular to the first and/or second direction.

10. The lithographic apparatus of claim 7, wherein said z-sensors are interferometers.

11. The lithographic apparatus of claim 7, wherein in each corner of said substrate table one of said first and second x-sensors or said first and second y-sensors and one of said four z-sensors are mounted.

12. The lithographic apparatus of claim 7, wherein said two x-sensors, two y-sensors and four z-sensors are arranged on the corners of an inner and outer rectangle, each rectangle comprising a x-sensor, a y-sensor and two z-sensors, the z-sensors being arranged on opposed corners of said inner rectangle and on the other two opposed corners of said outer rectangle.

13. The lithographic apparatus of claim 1, wherein said lithographic apparatus comprises two or more substrate tables, wherein on each of these substrate tables at least one x-sensor is mounted.

14. The lithographic apparatus of claim 7, wherein on each of at least three locations of said substrate table two sensor sets are arranged, each sensor set comprising a x-sensor or y-sensor, and a z-sensor.

15. The lithographic apparatus of claim 1, wherein the dimensions of said at least one grid plate in said first and second direction are smaller than the dimensions of said substrate table in said first and second direction.

16. The lithographic apparatus of claim 1, wherein said each of said two or more grid plates is a wafer, on which a grid grating is provided.

17. A lithographic apparatus comprising:

a substrate table configured to hold a substrate;

a projection system configured to project a patterned beam onto a target portion of the substrate; and

a displacement measuring system configured to measure the position of said substrate table in six degrees of freedom (x, y, z, Rx, Ry, Rz), wherein said displacement measuring system comprises;

one x-sensor configured to measure the position of the substrate table in a first direction,

two y-sensors configured to measure the position of the substrate table in a second direction, and

three z-sensors configured to measure the position of the substrate table in a third direction, wherein said displacement measuring system further comprises a second x-sensor and a fourth z-sensor, wherein said first and said second x-sensor and said first and second y-sensors are encoder type sensors configured to cooperate with respect to two or more separate grid plates, said displacement measuring system being configured to selectively use, depending on the position of said substrate table with respect to the two or more separate grid plates, three of said first and second x-sensors and said first and second y-sensors and three of said z-sensors to continuously determine the position of said substrate table in six degrees of freedom when the substrate table crosses a space between the two or more separate grid plates.

18. A device manufacturing method comprising:

projecting a patterned beam of radiation onto a substrate, wherein said substrate is supported on a substrate table at least during projecting a patterned beam onto a target portion of the substrate; and

measuring a position of said substrate table, the measuring including measuring the position of said substrate table in a first direction with respect to two or more substantially stationary adjacent grid plates using at least one encoder-type sensor mounted on said substrate table, the measuring further including continuously measuring the position of said substrate table when crossing a crossing line between said two or more adjacent grid plates.

19. The method of claim 18, wherein said two or more adjacent grid plates cover all possible locations of said substrate table making continuous measurement of the position of said substrate table possible.

20. The method of claim 18, further comprising:

measuring the position of the substrate table with respect to said two or more adjacent grid plates with a second encoder-type sensor mounted on the substrate table in the same direction as the first encoder type sensor, and

if one of said encoder-type sensors is located in a position in which it cannot determine its position with respect to the two or more adjacent grid plates, determining the position of said substrate table on the basis of the signal of the other encoder-type sensor.

21. The method of claim 18, further comprising measuring the position in at least three degrees of freedom (x, y, Rz), the measuring in at least three degrees of freedom including:

measuring the position of the substrate table in a first direction using a first and a second x-sensor,

measuring the position of the substrate table in a second direction using a first and a second y-sensor,

wherein said x-sensors and said y-sensors are encoder type sensors configured to measure the position of each of said sensors with respect to said two or more adjacent grid plates,

wherein, if one of the x-sensors or y-sensors is located in a position in which it cannot determine its position with respect to the at least one grid plate, the position of said substrate table is determined in three degrees of freedom on the basis of signals of the other three of said first and said second x-sensor and said first and second y-sensors.

22. The method of claim 21, wherein the movements of the substrate table are limited in such a way that only one of said two x-sensors and two y-sensors may be located in a position of which it is known that the respective sensor cannot determine its position with respect to the at least one grid plate.

23. The method of claim 21, further comprising measuring the position of said substrate in six degrees of freedom, the measuring in six degrees of freedom including measuring the position of said substrate table in a third direction using four z-zensors, wherein, if one of the z-sensors is located in a position in which it cannot determine its position with respect to the at least one grid plate, the position of said substrate table is determined in three further degrees of freedom (z, Rx, Ry) on the basis of signals of the other three of said four z-sensors.