Sensor chip and apparatus for tactile and/or flow sensing

• US 7,516,671 B2
• Filed: 02/22/2007
• Issued: 04/14/2009
• Est. Priority Date: 06/06/2003
• Status: Expired due to Term

• Current Assignee: Board of Trustees of The University of Illinois
• Original Assignee: Board of Trustees of The University of Illinois
• Inventors: Chen, Jack, Liu, Chang, Engel, Jonathan
• Primary Examiner(s): DOWTIN, JEWEL VIRGIE
• Application Number:
  US11/709,466
• Publication Number:
  US 20070234793A1
• Time in Patent Office: 782 Days
• Field of Search: 738/56, 257/417, 296/101, 703/21
• US Class Current: 73/756
• CPC Class Codes: G01F 1/28 by drag-force, e.g. vane type or impact flowmeter
• CPC Class Codes: G01F 1/6845 Micromachined devices
• CPC Class Codes: G01K 7/015 using microstructures, e.g. made of silicon
• CPC Class Codes: G01K 7/186 using microstructures
• CPC Class Codes: G01L 19/0092 Pressure sensor associated with other sensors, e.g. for measuring acceleration or temperature G01L9/025, G01L9/045, G01L9/065, G01L9/085, G01L9/105, G01L9/125, G01L19/02, G01L19/04 take precedence; measuring two or more variable G01D21/02; temperature sensors with pressure compensation G01K1/26
• CPC Class Codes: G01L 5/228 using tactile array force sensors
• CPC Class Codes: G01N 13/00 Investigating surface or boundary effects, e.g. wetting power; Investigating diffusion effects; Analysing materials by determining surface, boundary, or diffusion effects scanning-probe techniques or apparatus G01Q
• CPC Class Codes: G01N 2203/0676 Force, weight, load, energy, speed or acceleration
• CPC Class Codes: G01P 5/12 using variation of resistance of a heated conductor
• CPC Class Codes: Y10T 29/49103 Strain gauge making

Abstract

A sensor chip, comprising a flexible, polymer-based substrate, and at least one microfabricated sensor disposed on the substrate and including a conductive element. The at least one sensor comprises at least one of a tactile sensor and a flow sensor. Other embodiments of the present invention include sensors and/or multi-modal sensor nodes.

Claims

1. A sensor chip comprising:

a flexible, polymer-based substrate;

at least one microfabricated sensor deposited and patterned directly on said substrate by surface micromachining and including a conductive element, said at least one sensor comprising a flow sensor.

2. The sensor chip of claim 1 wherein the flow sensor comprises at least one of a haircell sensor, an anemometer, a pressure sensor, and a shear stress sensor.

6. The sensor chip of claim 1 further comprising:

a processor coupled to said at least one sensor for processing signals from said at least one sensor.

7. The sensor chip of claim 1 wherein the sensor is not disposed on silicon.

8. The sensor chip of claim 2 wherein the sensor comprises a haircell sensor;

wherein the haircell sensor comprises a cilium raised from said substrate, the cilium being capable of deflection with respect to said substrate, and a strain gauge disposed on said cilium, which stretches or compresses in response to an external force acting on said cilium;

wherein the cilium comprises a base that is rigidly connected to said substrate via a support.

9. The sensor chip of claim 2 wherein the sensor comprises an anemometer.

10. The sensor chip of claim 2 wherein the sensor comprises a pressure sensor;

wherein the pressure sensor comprises a polymer membrane diaphragm disposed on said substrate and at least one strain gauge disposed on said membrane diaphragm.

11. The sensor chip of claim 2 wherein the sensor comprises a shear stress sensor;

wherein the shear stress sensor comprises a polymer membrane diaphragm and a hot-wire element at least partially supported by the membrane diaphragm.

19. The sensor chip of claim 1 wherein said at least one microfabricated sensor is exposed.

3. A sensor chip comprising:

a flexible, polymer-based substrate;

at least one microfabricated sensor deposited and patterned directly on said substrate by surface micromachining and including a conductive element, said at least one sensor comprising at least one of a flow sensor and a tactile sensor;

wherein said at least one sensor is part of a multi-modal sensor node, and wherein a plurality of said multi-modal sensor nodes is distributed along said substrate.

4. The sensor chip of claim 3 wherein said substrate further comprises a plurality of strain gauges positioned over defined flex points along said substrate and respectively between each of said plurality of multi-modal sensor nodes.

5. The sensor chip of claim 4 wherein the flex points are defined by channels formed in said substrate.

12. The sensor chip of claim 3 wherein each of said multi-modal sensor nodes comprises at least one of a plurality of flow sensors and a plurality of tactile sensors.

13. The sensor chip of claim 12 wherein said plurality of multi-modal sensor nodes is distributed in a two-dimensional array along said substrate.

14. The sensor chip of claim 13 wherein each of said multi-modal sensor nodes in said two-dimensional array is substantially identical.

15. The sensor chip of claim 13 further comprising:

a strain gauge disposed on said substrate and between said sensor nodes.

16. The sensor chip of claim 13 wherein each of said plurality of multi-modal sensor nodes are disposed in at least one cluster;

wherein said sensor chip further comprises, for each of said at least one cluster, a processor disposed to receive signals from each of said plurality of multi-modal sensor nodes in the cluster.

17. The sensor chip of claim 16 wherein, for each of said at least one cluster, said processor is disposed on said substrate and substantially centrally with respect to said plurality of multi-modal sensor nodes in the cluster.

18. A thermal conductivity sensor comprising:

a flexible, polymer-based substrate having a raised portion formed thereon, the raised portion defining an upper surface;

a heater disposed on the upper surface;

a temperature sensor disposed on the upper surface and separated from said heater.