Light emitting element mounting member, and semiconductor device using the same

• US 7,518,155 B2
• Filed: 03/15/2004
• Issued: 04/14/2009
• Est. Priority Date: 03/18/2003
• Status: Active Grant

• Current Assignee: Sumitomo Electric Industries Limited (Sumitomo Corporation)
• Original Assignee: Sumitomo Electric Industries Limited (Sumitomo Corporation)
• Inventors: Ishii, Takashi, Tsuzuki, Yasushi, Ishidu, Sadamu, Higaki, Kenjiro
• Primary Examiner(s): Wilczewski; M.
• Assistant Examiner(s): Patton; Paul E
• Application Number:
  US10/546,777
• Publication Number:
  US 20060198162A1
• Time in Patent Office: 1,856 Days
• Field of Search: 257/79, 257 94- 99, 372/43.01, 372/50.23, 362/613, 362/623, 362/341, 362/345, 362347-350, 362/800
• US Class Current: 257/98
• CPC Class Codes: H01L 2224/05568 the whole external layer protruding from the surface
• CPC Class Codes: H01L 2224/05573 Single external layer
• CPC Class Codes: H01L 2224/05644 Gold [Au] as principal constituent
• CPC Class Codes: H01L 2224/06102 the bonding areas being at different heights
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/1703 Bump connectors having different sizes, e.g. different diameters, heights or widths
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 24/05 of an individual bonding area
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/60 Reflective elements
• CPC Class Codes: H01S 5/02255 using beam deflecting elements
• CPC Class Codes: H01S 5/0234 Up-side down mountings, e.g. Flip-chip, epi-side down mountings or junction down mountings

Abstract

The object of the present invention is to provide a light-emitting element mounting member and a semiconductor device using the same that is easy to process and that allows adequate heat dissipation.

A light-emitting element mounting member 200 includes: a substrate 2 including an element mounting surface 2a mounting a semiconductor light-emitting element 1 and first and second conductive regions 21, 22 disposed on the element mounting surface 2a and connected to the semiconductor light-emitting element 1; a reflective member 6 including a reflective surface 6a defining an internal space 6b for housing the semiconductor light-emitting element 1 and containing a metal disposed on the element mounting surface 1a; and a metal layer 13 disposed on the reflective surface 6a. The reflective surface 6a is sloped relative to the element mounting surface 2a so that a diameter of the internal space 6b is greater away from the element mounting surface 2a.

Claims

1. A light-emitting element mounting member comprising:

a substrate including an element mounting surface mounting a semiconductor light-emitting element and first and second conductive regions disposed on said element mounting surface and connected to said semiconductor light-emitting element;

a reflective member made of metal or alloy or metal composite material including a reflective surface defining an internal space for housing said semiconductor light-emitting element disposed on said element mounting surface; and

a metal layer disposed on said reflective surface;

wherein;

said substrate comprises a ceramic material and has a thermal expansion coefficient that is at least 3×

10<sup>−

6</sup>/K and no more than 10×

10<sup>−

6</sup>/K,

said reflective member has a thermal expansion coefficient that is at least 3×

10<sup>−

6</sup>/K and no more than 7×

10<sup>−

6</sup>/K, and

said reflective surface is sloped relative to said element mounting surface so that a diameter of said internal space is greater away from said element mounting surface.

2. A light-emitting element mounting member according to claim 1 further comprising a bonding layer bonding said element mounting surface and said reflective member wherein:

a heat resistance temperature of said bonding layer is at least 300 deg C.; and

said bonding layer melts at a temperature of no more than 700 deg C. and bonds said element mounting surface and said reflective member.

3. A light-emitting element mounting surface according to claim 1 wherein:

said substrate is insulative;

first and second through-holes are formed on said substrate;

said first conductor region is formed at said first through-hole; and

said second conductor region is formed at said second through-hole.

4. A semiconductor device according to claim 1 wherein a minimum formation dimension of metal film patterns of said first and/or said second conductor region is at least 5 microns and less than 100 microns.

5. A semiconductor device comprising:

a light-emitting element mounting member according to claim 1; and

a semiconductor light-emitting element mounted on said element mounting surface;

wherein;

said semiconductor light-emitting element includes a main surface facing said element mounting surface and said substrate includes a bottom surface positioned opposite from said element mounting surface; and

a ratio H/L between a distance H from said bottom surface to said element mounting surface and a distance L along a direction of a long side of said main surface of said semiconductor light-emitting element is at least 0.3.

6. A semiconductor device according to claim 5 wherein an electrode is disposed on said main surface side of said semiconductor light-emitting element and is electrically connected to said first and/or said second conductor region.

7. A semiconductor device according to claim 5 wherein said main surface has an area of at least 1 mm².

8. A semiconductor device according to claim 3, wherein:

said first conductor region comprises a first conductor portion that fills said first through-hole; and

said second conductor region comprises a second conductor portion that fills said second through-hole.

9. A semiconductor device according to claim 2, wherein said bonding layer bonds a planar surface of said element mounting surface to a planar surface of said reflective member.

10. A semiconductor device according to claim 9, further comprising:

a plating layer on the planar surface of said reflective member,

wherein said bonding layer is interposed between said planar surface of said reflective member and said plating layer, and comprises an Au-based solder.

11. A semiconductor device according to claim 10, wherein said plating layer comprises Ni/Au.

12. A semiconductor device according to claim 9, further comprising:

a film that is disposed on the planar surface of said element mounting surface,

wherein said substrate comprises nitride aluminum,

wherein said bonding layer comprises an Au-based solder, and

wherein said bonding layer is bonded to said film.

13. A semiconductor device according to claim 12, wherein said film is an Au film.

14. A semiconductor device according to claim 13, further comprising one or more intermediate layers disposed between said Au film and said element mounting surface.