Light emitting element mounting member, and semiconductor device using the same
First Claim
1. A light-emitting element mounting member comprising:
- a substrate including an element mounting surface mounting a semiconductor light-emitting element and first and second conductive regions disposed on said element mounting surface and connected to said semiconductor light-emitting element;
a reflective member made of metal or alloy or metal composite material including a reflective surface defining an internal space for housing said semiconductor light-emitting element disposed on said element mounting surface; and
a metal layer disposed on said reflective surface;
wherein;
said substrate comprises a ceramic material and has a thermal expansion coefficient that is at least 3×
10−
6/K and no more than 10×
10−
6/K,said reflective member has a thermal expansion coefficient that is at least 3×
10−
6/K and no more than 7×
10−
6/K, andsaid reflective surface is sloped relative to said element mounting surface so that a diameter of said internal space is greater away from said element mounting surface.
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Accused Products
Abstract
The object of the present invention is to provide a light-emitting element mounting member and a semiconductor device using the same that is easy to process and that allows adequate heat dissipation.
A light-emitting element mounting member 200 includes: a substrate 2 including an element mounting surface 2a mounting a semiconductor light-emitting element 1 and first and second conductive regions 21, 22 disposed on the element mounting surface 2a and connected to the semiconductor light-emitting element 1; a reflective member 6 including a reflective surface 6a defining an internal space 6b for housing the semiconductor light-emitting element 1 and containing a metal disposed on the element mounting surface 1a; and a metal layer 13 disposed on the reflective surface 6a. The reflective surface 6a is sloped relative to the element mounting surface 2a so that a diameter of the internal space 6b is greater away from the element mounting surface 2a.
36 Citations
14 Claims
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1. A light-emitting element mounting member comprising:
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a substrate including an element mounting surface mounting a semiconductor light-emitting element and first and second conductive regions disposed on said element mounting surface and connected to said semiconductor light-emitting element; a reflective member made of metal or alloy or metal composite material including a reflective surface defining an internal space for housing said semiconductor light-emitting element disposed on said element mounting surface; and a metal layer disposed on said reflective surface; wherein; said substrate comprises a ceramic material and has a thermal expansion coefficient that is at least 3×
10−
6/K and no more than 10×
10−
6/K,said reflective member has a thermal expansion coefficient that is at least 3×
10−
6/K and no more than 7×
10−
6/K, andsaid reflective surface is sloped relative to said element mounting surface so that a diameter of said internal space is greater away from said element mounting surface. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
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Specification